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1. 发明授权

US08873212B2 Protection circuit, battery control device, and battery pack 有权
标题翻译：保护电路，电池控制装置和电池组
公开(公告)号：US08873212B2
公开(公告)日：2014-10-28
申请号：US13578865
申请日：2010-12-29
申请人： Koichi Mukai , Masahiko Ishimaru , Takahiro Asada , Chisato Komori , Yoshihiro Yoneda , Yuuji Kimura , Shoko Nagaki
发明人： Koichi Mukai , Masahiko Ishimaru , Takahiro Asada , Chisato Komori , Yoshihiro Yoneda , Yuuji Kimura , Shoko Nagaki
IPC分类号： H02J7/00 , H01M2/34 , H01M10/48 , H01M10/44 , H01M10/0525 , H02H7/18
CPC分类号： H01M2/348 , H01M10/0525 , H01M10/443 , H01M10/48 , H02H7/18 , H02J7/0031 , Y02E60/12
摘要： A protective circuit capable of coping with broad voltage variations of a battery unit to interrupt its charging/discharging current path as damages to the heating unit are prevented from occurrence is disclosed. The protective circuit includes fuses, connected to a charging/discharging current path in series between a battery unit and a charging/discharging control circuit, and a heating unit composed by a series connection of resistors. One of two ends of the resistor which is not connected to the peer resistor is connected to a current path of the fuses. The ends of the resistors not connected to the fuses, are provided with a plurality of terminals selected for connection to a current control element that controls the current flowing through the heating unit, as a range of voltage variations of the battery unit is taken into account.
摘要翻译：公开了一种能够应对电池单元的宽电压变化以防止其充电/放电电流路径作为对加热单元的损坏的保护电路。保护电路包括连接到电池单元和充电/放电控制电路之间串联的充电/放电电流路径的熔断器和由电阻器的串联连接构成的加热单元。未连接到对等电阻的电阻的两端之一连接到保险丝的当前路径。未连接到保险丝的电阻器的端部设置有多个端子，其被选择用于连接到控制流过加热单元的电流的电流控制元件，因为电池单元的电压变化的范围被考虑。

2. 发明申请

US20130044402A1 PROTECTION CIRCUIT, BATTERY CONTROL DEVICE, AND BATTERY PACK 有权
标题翻译：保护电路，电池控制装置和电池组
公开(公告)号：US20130044402A1
公开(公告)日：2013-02-21
申请号：US13578865
申请日：2010-12-29
申请人： Koichi Mukai , Masahiko Ishimaru , Takahiro Asada , Chisato Komori , Yoshihiro Yoneda , Yuuji Kimura , Shoko Nagaki
发明人： Koichi Mukai , Masahiko Ishimaru , Takahiro Asada , Chisato Komori , Yoshihiro Yoneda , Yuuji Kimura , Shoko Nagaki
IPC分类号： H02H5/04
CPC分类号： H01M2/348 , H01M10/0525 , H01M10/443 , H01M10/48 , H02H7/18 , H02J7/0031 , Y02E60/12
摘要： A protective circuit capable of coping with broad voltage variations of a battery unit to interrupt its charging/discharging current path as damages to the heating unit are prevented from occurrence is disclosed. The protective circuit includes fuses, connected to a charging/discharging current path in series between a battery unit and a charging/discharging control circuit, and a heating unit composed by a series connection of resistors. One of two ends of the resistor which is not connected to the peer resistor is connected to a current path of the fuses. The ends of the resistors not connected to the fuses, are provided with a plurality of terminals selected for connection to a current control element that controls the current flowing through the heating unit, as a range of voltage variations of the battery unit is taken into account.
摘要翻译：公开了一种能够应对电池单元的宽电压变化以防止其充电/放电电流路径作为对加热单元的损坏的保护电路。保护电路包括连接到电池单元和充电/放电控制电路之间串联的充电/放电电流路径的熔断器和由电阻器的串联连接构成的加热单元。未连接到对等电阻的电阻的两端之一连接到保险丝的当前路径。未连接到保险丝的电阻器的端部设置有多个端子，其被选择用于连接到控制流过加热单元的电流的电流控制元件，因为电池单元的电压变化的范围被考虑。

3. 发明申请

US20070176274A1 Functional device-mounted module and a process for producing the same 有权
标题翻译：功能装置安装模块及其制造方法
公开(公告)号：US20070176274A1
公开(公告)日：2007-08-02
申请号：US11717066
申请日：2007-03-13
申请人： Yoshihiro Yoneda , Takahiro Asada
发明人： Yoshihiro Yoneda , Takahiro Asada
IPC分类号： H01L23/02
CPC分类号： H01L31/0203 , H01L23/3185 , H01L24/45 , H01L24/48 , H01L24/49 , H01L33/54 , H01L33/56 , H01L2224/05554 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/8592 , H01L2924/10161 , H01L2924/12042 , H01L2924/1461 , H01L2924/16151 , H01L2924/16195 , H01L2924/1815 , H01L2924/3025 , H01S5/005 , H01S5/02216 , H01S5/02228 , H01S5/02296 , H01S5/32341 , H01L2924/00014 , H01L2924/00
摘要： The present disclosure provides an optical functional device-mounted module which needs no expensive or special members, can be reduced in size, and provide a producing process thereof. A bank to dam a liquid sealing resin is provided on a substrate around an optical functional device, the substrate being formed with a predetermined wiring pattern and having the optical functional device mounted thereon. The liquid sealing resin is filled between the functional device and the bank by dropping the liquid sealing resin therebetween. A package component member having a light transmission hole corresponding to an optical function part of the optical functional device is brought into contact with the bank such that the light transmission hole is opposed to the function part of the optical functional device, thereby causing the package component member to contact with the liquid sealing resin. The package component member is fixed onto the substrate by curing the liquid sealing resin and the bank is finally cut off and removed.
摘要翻译：本公开提供了一种不需要昂贵或特殊构件的光学功能装置安装模块，可以减小尺寸并提供其制造方法。在光学功能器件周围的基板上设置有用于防止液体密封树脂的堤坝，该基板由预定的布线图案形成并且安装有光学功能元件。液体密封树脂通过在其间滴落液体密封树脂而填充在功能元件和堤岸之间。具有与光功能元件的光学功能部分相对应的透光孔的封装部件与堤相接触，使得透光孔与光功能元件的功能部分相对，从而使封装元件与液体密封树脂接触的部件。通过固化液体密封树脂将封装构件部件固定在基板上，最后切断并移除堤岸。

4. 发明授权

US07812264B2 Functional element-mounted module and a method for producing the same 有权
公开(公告)号：US07812264B2
公开(公告)日：2010-10-12
申请号：US12230602
申请日：2008-09-02
申请人： Yoshihiro Yoneda , Takahiro Asada , Kazuaki Suzuki
发明人： Yoshihiro Yoneda , Takahiro Asada , Kazuaki Suzuki
IPC分类号： H01L23/28
CPC分类号： H01L27/14618 , H01L31/0203 , H01L33/52 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/8592 , H01L2924/01004 , H01L2924/01079 , H01L2924/1461 , H01L2924/1815 , H01S5/02296 , H01S5/32341 , Y10T29/49007 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , H01L2924/00014 , H01L2924/00
摘要： A functional element-mounted module can be decreased in size and requires no costly and special members for a light transition member. A substrate is used, on which an optical functional element having an optical function part and bonding pads therearound is mounted by wire bonding, with an upper face of the element upward. A bank to dam a liquid sealing resin is provided around the optical functional element on the substrate, and the liquid sealing resin is dropped and filled between the optical functional element and the bank such that the bonding pads and partial gold wires for the wire bonding are exposed. A package-component member having a hole corresponding to the optical functional element is abutted to the bank such that the hole is opposed to the function part of the functional element. Thereby, the package-component member is contacted to the liquid sealing resin. The package-component member is fixed to the substrate by curing the liquid sealing resin, and the bank is cut away.

5. 发明申请

US20100175247A1 Functional element-mounted module and a method for producing the same 有权
标题翻译：功能元件安装模块及其制造方法
公开(公告)号：US20100175247A1
公开(公告)日：2010-07-15
申请号：US12659740
申请日：2010-03-19
申请人： Yoshihiro Yoneda , Takahiro Asada , Kazuaki Suzuki
发明人： Yoshihiro Yoneda , Takahiro Asada , Kazuaki Suzuki
IPC分类号： H05K3/34
CPC分类号： H01L27/14618 , H01L31/0203 , H01L33/52 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/8592 , H01L2924/01004 , H01L2924/01079 , H01L2924/1461 , H01L2924/1815 , H01S5/02296 , H01S5/32341 , Y10T29/49007 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , H01L2924/00014 , H01L2924/00
摘要： A functional element-mounted module can be decreased in size and requires no costly and special members for a light transition member. A substrate is used, on which an optical functional element having an optical function part and bonding pads therearound is mounted by wire bonding, with an upper face of the element upward. A bank to dam a liquid sealing resin is provided around the optical functional element on the substrate, and the liquid sealing resin is dropped and filled between the optical functional element and the bank such that the bonding pads and partial gold wires for the wire bonding are exposed. A package-component member having a hole corresponding to the optical functional element is abutted to the bank such that the hole is opposed to the function part of the functional element. Thereby, the package-component member is contacted to the liquid sealing resin. The package-component member is fixed to the substrate by curing the liquid sealing resin, and the bank is cut away.
摘要翻译：功能元件安装模块的尺寸可以减小，并且不需要用于光过渡构件的昂贵且特殊的构件。使用其上具有光学功能部分的光学功能元件和其周围的接合焊盘的基板通过引线接合安装，元件的上表面向上。在基板上的光功能元件的周围设置有用于防止液体密封树脂的堤坝，并且液体密封树脂在光学功能元件和堤岸之间落下并填充，使得用于引线接合的接合焊盘和部分金线是裸露。具有与光功能元件相对应的孔的封装构件构件抵接于堤，使得孔与功能元件的功能部分相对。由此，封装构件与液体密封树脂接触。通过固化液体密封树脂将包装组分构件固定到基底上，并且切割堤。

6. 发明申请

US20090038843A1 Functional element-mounted module and a method for producing the same 有权
标题翻译：功能元件安装模块及其制造方法
公开(公告)号：US20090038843A1
公开(公告)日：2009-02-12
申请号：US12230602
申请日：2008-09-02
申请人： Yoshihiro Yoneda , Takahiro Asada , Kazuaki Suzuki
发明人： Yoshihiro Yoneda , Takahiro Asada , Kazuaki Suzuki
IPC分类号： H01L23/28 , H05K7/00
CPC分类号： H01L27/14618 , H01L31/0203 , H01L33/52 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/8592 , H01L2924/01004 , H01L2924/01079 , H01L2924/1461 , H01L2924/1815 , H01S5/02296 , H01S5/32341 , Y10T29/49007 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , H01L2924/00014 , H01L2924/00
摘要： A functional element-mounted module can be decreased in size and requires no costly and special members for a light transition member. A substrate is used, on which an optical functional element having an optical function part and bonding pads therearound is mounted by wire bonding, with an upper face of the element upward. A bank to dam a liquid sealing resin is provided around the optical functional element on the substrate, and the liquid sealing resin is dropped and filled between the optical functional element and the bank such that the bonding pads and partial gold wires for the wire bonding are exposed. A package-component member having a hole corresponding to the optical functional element is abutted to the bank such that the hole is opposed to the function part of the functional element. Thereby, the package-component member is contacted to the liquid sealing resin. The package-component member is fixed to the substrate by curing the liquid sealing resin, and the bank is cut away.
摘要翻译：功能元件安装模块的尺寸可以减小，并且不需要用于光过渡构件的昂贵且特殊的构件。使用其上具有光学功能部分的光学功能元件和其周围的接合焊盘的基板通过引线接合安装，元件的上表面向上。在基板上的光功能元件的周围设置有用于防止液体密封树脂的堤坝，并且液体密封树脂在光学功能元件和堤岸之间落下并填充，使得用于引线接合的接合焊盘和部分金线为裸露。具有与光功能元件相对应的孔的封装构件构件抵接于堤，使得孔与功能元件的功能部分相对。由此，封装构件与液体密封树脂接触。通过固化液体密封树脂将包装组分构件固定到基底上，并且切割堤。

7. 发明授权

US07727819B2 Process for producing a functional device-mounted module 失效
标题翻译：用于制造功能装置安装模块的方法
公开(公告)号：US07727819B2
公开(公告)日：2010-06-01
申请号：US12222437
申请日：2008-08-08
申请人： Yoshihiro Yoneda , Takahiro Asada
发明人： Yoshihiro Yoneda , Takahiro Asada
IPC分类号： H01L21/00
CPC分类号： H01L31/0203 , H01L23/3185 , H01L24/45 , H01L24/48 , H01L24/49 , H01L33/54 , H01L33/56 , H01L2224/05554 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/8592 , H01L2924/10161 , H01L2924/12042 , H01L2924/1461 , H01L2924/16151 , H01L2924/16195 , H01L2924/1815 , H01L2924/3025 , H01S5/005 , H01S5/02216 , H01S5/02228 , H01S5/02296 , H01S5/32341 , H01L2924/00014 , H01L2924/00
摘要： The present disclosure provides an optical functional device-mounted module which needs no expensive or special members, can be reduced in size, and provide a producing process thereof. A bank to dam a liquid sealing resin is provided on a substrate around an optical functional device, the substrate being formed with a predetermined wiring pattern and having the optical functional device mounted thereon. The liquid sealing resin is filled between the functional device and the bank by dropping the liquid sealing resin therebetween. A package component member having a light transmission hole corresponding to an optical function part of the optical functional device is brought into contact with the bank such that the light transmission hole is opposed to the function part of the optical functional device, thereby causing the package component member to contact with the liquid sealing resin. The package component member is fixed onto the substrate by curing the liquid sealing resin and the bank is finally cut off and removed.
摘要翻译：本公开提供了一种不需要昂贵或特殊构件的光学功能装置安装模块，可以减小尺寸并提供其制造方法。在光学功能器件周围的基板上设置有用于防止液体密封树脂的堤坝，该基板由预定的布线图案形成并且安装有光学功能元件。液体密封树脂通过在其间滴落液体密封树脂而填充在功能元件和堤岸之间。具有与光功能元件的光学功能部分相对应的透光孔的封装部件与堤相接触，使得透光孔与光功能元件的功能部分相对，从而使封装元件与液体密封树脂接触的部件。通过固化液体密封树脂将封装构件部件固定在基板上，最后切断并移除堤岸。

8. 发明授权

US08547195B2 Protective element and secondary battery device 有权
标题翻译：保护元件和二次电池装置
公开(公告)号：US08547195B2
公开(公告)日：2013-10-01
申请号：US12677492
申请日：2009-05-14
申请人： Yuji Kimura , Takahiro Asada , Yoshihiro Yoneda , Kazuaki Suzuki
发明人： Yuji Kimura , Takahiro Asada , Yoshihiro Yoneda , Kazuaki Suzuki
IPC分类号： H01H85/20 , H01H85/04 , H01H37/76 , H01H69/02 , H02H5/04
CPC分类号： H01M2/34 , H01H37/761 , H01M10/0525 , H01M10/4235
摘要： A protection element and a secondary battery device employing the protection element are provided for stably retaining a flux on a soluble conductor at a predetermined position, so as to enable appropriate blowout of the soluble conductor in the event of an abnormality. The protection element has a soluble conductor which is disposed on an insulation baseboard, and which is connected to a power supply path of a device targeted to be protected, and which causes a blowout when a predetermined abnormal electric power amount is supplied. A flux is coated on a surface of the soluble conductor, and an insulation cover member is mounted on the baseboard and covers the soluble conductor. The protection element also includes a stepped portion for retaining the flux at a predetermined position in contact with the flux, and the stepped portion is formed opposite to the soluble conductor on an interior face of the insulation cover member.
摘要翻译：提供一种使用保护元件的保护元件和二次电池装置，用于将预定位置上的可溶性导体上的助熔剂稳定地保持，从而能够在发生异常时适当地喷出可溶性导体。保护元件具有设置在绝缘基板上的可溶性导体，其与被保护对象的装置的电源路径连接，当提供规定的异常电力量时，产生喷出。助焊剂涂覆在可溶性导体的表面上，绝缘覆盖件安装在基板上并覆盖可溶性导体。保护元件还包括用于将焊剂保持在与焊剂接触的预定位置的阶梯部分，并且阶梯部分形成在绝缘覆盖部件的内表面上与可溶性导体相对。

9. 发明授权

US07855440B2 Functional device-mounted module and a process for producing the same 有权
标题翻译：功能装置安装模块及其制造方法
公开(公告)号：US07855440B2
公开(公告)日：2010-12-21
申请号：US11717066
申请日：2007-03-13
申请人： Yoshihiro Yoneda , Takahiro Asada
发明人： Yoshihiro Yoneda , Takahiro Asada
IPC分类号： H01L21/44
CPC分类号： H01L31/0203 , H01L23/3185 , H01L24/45 , H01L24/48 , H01L24/49 , H01L33/54 , H01L33/56 , H01L2224/05554 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2224/8592 , H01L2924/10161 , H01L2924/12042 , H01L2924/1461 , H01L2924/16151 , H01L2924/16195 , H01L2924/1815 , H01L2924/3025 , H01S5/005 , H01S5/02216 , H01S5/02228 , H01S5/02296 , H01S5/32341 , H01L2924/00014 , H01L2924/00
摘要： An optical functional device-mounted module and a producing process thereof. A bank to dam a liquid sealing resin is provided on a substrate around an optical functional device, the substrate being formed with a predetermined wiring pattern and having the optical functional device mounted thereon. The liquid sealing resin is filled between the functional device and the bank by dropping the liquid sealing resin therebetween. A package component member having a light transmission hole corresponding to an optical function part of the optical functional device is brought into contact with the bank such that the light transmission hole is opposed to the function part of the optical functional device, thereby causing the package component member to contact with the liquid sealing resin. The package component member is fixed onto the substrate by curing the liquid sealing resin and the bank is finally cut off and removed.
摘要翻译：光学功能装置安装模块及其制造方法。在光学功能器件周围的基板上设置有用于防止液体密封树脂的堤坝，该基板由预定的布线图案形成并且安装有光学功能元件。液体密封树脂通过在其间滴落液体密封树脂而填充在功能元件和堤岸之间。具有与光功能元件的光学功能部分相对应的透光孔的封装部件与堤相接触，使得透光孔与光功能元件的功能部分相对，从而使封装元件与液体密封树脂接触的部件。通过固化液体密封树脂将封装构件部件固定在基板上，最后切断并移除堤岸。

10. 发明申请

US20090022949A1 Functional-Element-Mounted Module, Process for Producing the Same, Resin Sealing Plate for Use Therein, and Substrate Structure for Resin Sealing 审中-公开
标题翻译：功能元件安装模块，其制造方法，其中使用的树脂密封板和用于树脂密封的基板结构
公开(公告)号：US20090022949A1
公开(公告)日：2009-01-22
申请号：US12086152
申请日：2006-11-28
申请人： Yoshihito Horita , Shiyuki Kanisawa , Takahiro Asada , Yoshihiro Yoneda
发明人： Yoshihito Horita , Shiyuki Kanisawa , Takahiro Asada , Yoshihiro Yoneda
IPC分类号： B32B3/10 , B05D5/06 , C08F2/48 , B31B1/60
CPC分类号： H01L21/56 , B81B7/0067 , B81C2203/0109 , B81C2203/032 , H01L23/24 , H01L24/48 , H01L27/14618 , H01L31/0203 , H01L2224/05554 , H01L2224/48091 , H01L2224/48227 , H01L2924/00014 , H01L2924/01004 , H01L2924/09701 , H01L2924/10161 , H01L2924/16195 , H01L2924/1815 , Y10T156/10 , Y10T428/24273 , Y10T428/24331 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Opposed to a substrate (2) having a functional element (1) with a functional portion (1a) mounted thereon, there is disposed a resin sealing plate (3) provided with an opening (3a) corresponding to the functional portion (1a) of the functional element (1) with a given spacing therebetween. Impregnation and filling of a sealing resin (5) in the spacing between the substrate (2) and the resin sealing plate (3) are carried out by the use of the capillary phenomenon. Thus, resin sealing of the functional element (1) can be realized without damaging to the function of the functional portion (1a).
摘要翻译：与具有安装有功能部分（1a）的功能元件（1）的基板（2）相对，设置有树脂密封板（3），其具有与功能部分（1a）对应的开口（3a）功能元件（1）之间具有给定的间隔。通过使用毛细管现象，进行衬底（2）和树脂密封板（3）之间的间隔中的密封树脂（5）的浸渍和填充。因此，可以实现功能元件（1）的树脂密封，而不损害功能部分（1a）的功能。

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