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1. 发明授权

US08617943B2 Method for making a semiconductor device on a flexible substrate 有权
标题翻译：在柔性基板上制造半导体器件的方法
公开(公告)号：US08617943B2
公开(公告)日：2013-12-31
申请号：US12746440
申请日：2009-07-22
申请人： Takashi Ichiryu , Seiichi Nakatani , Koichi Hirano , Yoshihisa Yamashita , Shingo Komatsu
发明人： Takashi Ichiryu , Seiichi Nakatani , Koichi Hirano , Yoshihisa Yamashita , Shingo Komatsu
IPC分类号： H01L21/00
CPC分类号： H01L29/78603 , H01L24/19 , H01L24/82 , H01L27/1218 , H01L29/66765 , H01L29/78609 , H01L29/78681 , H01L29/7869 , H01L51/0024 , H01L51/003 , H01L51/0097 , H01L51/0541 , H01L51/0545 , H01L2221/68377 , H01L2224/04105 , H01L2224/73267 , H01L2224/76155 , H01L2224/82039 , H01L2224/82102 , H01L2224/92144 , H01L2224/92244 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01047 , H01L2924/01049 , H01L2924/01056 , H01L2924/01057 , H01L2924/01072 , H01L2924/01073 , H01L2924/01078 , H01L2924/01082 , H01L2924/04941 , H01L2924/04953 , H01L2924/10329 , H01L2924/12042 , H01L2924/15788 , H01L2924/19041 , H01L2924/30105 , H01L2924/00
摘要： A method for fabricating a flexible semiconductor device includes: preparing a layered film 80 including a first metal layer 10, an inorganic insulating layer 20, a semiconductor layer 30, and a second metal layer 40 which are sequentially formed; etching the first metal layer 10 to form a gate electrode 12g; compression bonding a resin layer 50 to a surface of the layered film 80 provided with the gate electrode 12g to allow the gate electrode 12g to be embedded in the resin layer 50; and etching the second metal layer 40 to form a source electrode 42s and a drain electrode 42d, wherein the inorganic insulating layer 20 on the gate electrode 12g functions as a gate insulating film 22, and the semiconductor layer 30 between the source electrode 42s and drain electrode 42d on the inorganic insulating layer 20 functions as a channel 32.
摘要翻译：一种制造柔性半导体器件的方法包括：制备包括依次形成的第一金属层10，无机绝缘层20，半导体层30和第二金属层40的层状膜80; 蚀刻第一金属层10以形成栅电极12g; 将树脂层50压接到设置有栅电极12g的层叠膜80的表面，以使栅电极12g嵌入树脂层50中; 并且蚀刻第二金属层40以形成源电极42s和漏电极42d，其中栅电极12g上的无机绝缘层20用作栅极绝缘膜22，并且源电极42s和漏极之间的半导体层30 无机绝缘层20上的电极42d用作通道32。

2. 发明授权

US07059042B2 Method of manufacturing a thermal conductive circuit board with grounding pattern connected to a heat sink 有权
标题翻译：制造具有连接到散热器的接地图案的导热电路板的方法
公开(公告)号：US07059042B2
公开(公告)日：2006-06-13
申请号：US10998277
申请日：2004-11-24
申请人： Koichi Hirano , Seiichi Nakatani , Mitsuhiro Matsuo , Yoshihisa Yamashita
发明人： Koichi Hirano , Seiichi Nakatani , Mitsuhiro Matsuo , Yoshihisa Yamashita
IPC分类号： H05K3/30 , H05K7/02 , H01L2/44
CPC分类号： H05K7/205 , H01L23/3737 , H01L23/4334 , H01L23/49861 , H01L24/45 , H01L24/48 , H01L2224/451 , H01L2224/48247 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/1305 , H01L2924/13055 , H01L2924/19041 , H05K1/0204 , H05K1/056 , H05K3/0061 , H05K3/202 , H05K3/4084 , H05K7/20463 , H05K2201/0209 , H05K2201/0382 , H05K2201/09054 , H05K2201/0969 , H05K2201/10416 , H05K2203/1189 , Y10T29/49121 , Y10T29/4913 , Y10T29/49146 , Y10T29/49158 , Y10T29/49171 , Y10T29/49172 , H01L2924/00 , H01L2224/05599
摘要： A sheet-like thermally conductive resin composition containing 70 to 95 wt. % inorganic filler and 5 to 30 wt. % thermosetting resin composition, a lead frame as a wiring pattern, and an electrically conductive heat sink with a metal pole placed therein are superposed, heated and compressed, and thus are combined to form one body. Consequently, a thermally conductive circuit board with a flat surface is obtained in which a grounding pattern is grounded to the heat sink inside the insulating layer. Thus, the grounding pattern and the heat sink can be connected electrically with each other in an arbitrary position inside the insulating layer of the thermally conductive circuit board. Accordingly, there are provided a thermally conductive circuit board with high heat dissipation, high conductivity and high ground-connection reliability, a method of manufacturing the same, and a power module allowing its size to be reduced and its density to be increased.
摘要翻译：一种片状导热性树脂组合物，其含有70〜95重量％％无机填料和5〜30wt。热固性树脂组合物，作为布线图案的引线框架和放置有金属极的导电散热器叠加，加热和压缩，从而组合形成一体。因此，获得了具有平坦表面的导热电路板，其中接地图被接地到绝缘层内的散热片。因此，接地图案和散热器可以在导热电路板的绝缘层内的任意位置彼此电连接。因此，提供了具有高散热，高导电性和高接地连接可靠性的导热电路板，其制造方法以及允许其尺寸减小并且其密度增加的功率模块。

3. 发明授权

US06707671B2 Power module and method of manufacturing the same 有权
公开(公告)号：US06707671B2
公开(公告)日：2004-03-16
申请号：US10160353
申请日：2002-05-30
申请人： Yoshihisa Yamashita , Koichi Hirano , Seiichi Nakatani
发明人： Yoshihisa Yamashita , Koichi Hirano , Seiichi Nakatani
IPC分类号： H05K720
CPC分类号： H01L23/3737 , H01L23/42 , H01L2224/16225 , H01L2224/16227 , H01L2224/32245 , H01L2224/45144 , H01L2224/73253 , H01L2924/01322 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/19105 , H01L2924/19106 , H05K1/0203 , H05K3/284 , H01L2924/00
摘要： In a power module, a wiring substrate to which a heat generating component is connected electrically and a heat sink are connected through the medium of a thermally conductive and electrically insulating member. The thermally conductive and electrically insulating member is a curable composition containing (A) a thermosetting resin, (B) a thermoplastic resin, (C) a latent curing agent, and (D) an inorganic filler. The thermally conductive and electrically insulating member is bonded to the heat generating component in such a manner as to be deformed complementarily to unevenness in shape and height of the heat generating component. Heat generated from the heat generating component is radiated by means of the heat sink. Thus, a power module that allows heat generated from an electronic component to be radiated evenly and efficiently and achieves high-density mounting, and a method of manufacturing the power module are provided.

4. 发明授权

US08709293B2 Flip-chip mounting resin composition and bump forming resin composition 有权
标题翻译：倒装片树脂组合物和凸块形成树脂组合物
公开(公告)号：US08709293B2
公开(公告)日：2014-04-29
申请号：US11793175
申请日：2005-12-14
申请人： Takashi Kitae , Seiji Karashima , Koichi Hirano , Toshiyuki Kojima , Seiichi Nakatani , Shingo Komatsu , Yoshihisa Yamashita
发明人： Takashi Kitae , Seiji Karashima , Koichi Hirano , Toshiyuki Kojima , Seiichi Nakatani , Shingo Komatsu , Yoshihisa Yamashita
IPC分类号： H01B1/02
CPC分类号： H05K3/323 , H01L21/6835 , H01L23/49838 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L2224/0401 , H01L2224/05554 , H01L2224/06131 , H01L2224/06135 , H01L2224/11001 , H01L2224/11003 , H01L2224/1141 , H01L2224/11502 , H01L2224/11522 , H01L2224/13099 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/16058 , H01L2224/16225 , H01L2224/16227 , H01L2224/165 , H01L2224/2741 , H01L2224/27436 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29291 , H01L2224/293 , H01L2224/29311 , H01L2224/29313 , H01L2224/29316 , H01L2224/73204 , H01L2224/8121 , H01L2224/81815 , H01L2224/83097 , H01L2224/83192 , H01L2224/832 , H01L2224/83856 , H01L2224/83862 , H01L2224/8388 , H01L2224/83886 , H01L2224/83887 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01011 , H01L2924/01013 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01061 , H01L2924/01065 , H01L2924/01073 , H01L2924/01078 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/15311 , H01L2924/1579 , H01L2924/381 , H01L2924/3841 , H05K3/3436 , H05K2201/10674 , H05K2201/10977 , H05K2203/083 , H05K2203/087 , Y02P70/613 , H01L2924/00011 , H01L2924/066 , H01L2924/06 , H01L2924/0695 , H01L2924/062 , H01L2924/0615 , H01L2924/068 , H01L2924/0705 , H01L2924/0675 , H01L2924/07001 , H01L2924/0103 , H01L2924/01047 , H01L2924/01029 , H01L2924/01083 , H01L2924/00015 , H01L2924/00 , H01L2924/00014
摘要： There is provided a flip-chip mounting resin composition which can be used for a flip-chip mounting process that is high in productivity and reliability and thus can be applicable to a flip-chip mounting of a next-generation LSI. This flip-chip mounting resin composition comprises a resin, metal particles and a convection additive 12 that boils upon heating the resin 13. Upon the heating of the resin 13, the metal particles melt and the boiling convection additive 12 convects within the resin 13. This flip-chip mounting resin composition is supplied between a circuit substrate 10 and a semiconductor chip 20, and subsequently the resin 13 is heated so that the molten metal particles self-assemble into the region between each electrode of the circuit substrate and each electrode of the semiconductor chip. As a result, an electrical connection is formed between each electrode of the circuit substrate and each electrode of the semiconductor chip. Finally, the resin 13 is allowed to cure so that the semiconductor chip 20 is secured to the circuit substrate 10, which leads to in a formation of a flip chip assembly.
摘要翻译：提供了一种倒装芯片安装树脂组合物，其可用于生产率和可靠性高的倒装芯片安装工艺，因此可以应用于下一代LSI的倒装芯片安装。这种倒装芯片安装树脂组合物包括树脂，金属颗粒和在加热树脂13时沸腾的对流添加剂12.当加热树脂13时，金属颗粒熔化，沸腾对流添加剂12在树脂13内对流。将该倒装芯片安装树脂组合物供给在电路基板10和半导体芯片20之间，随后加热树脂13，使得熔融金属颗粒自组装成电路基板的每个电极和电极的每个电极之间的区域半导体芯片。结果，在电路基板的每个电极和半导体芯片的每个电极之间形成电连接。最后，使树脂13固化，使得半导体芯片20固定到电路基板10，这导致形成倒装芯片组件。

5. 发明申请

US20110049598A1 MANUFACTURING METHOD OF FLEXIBLE SEMICONDUCTOR DEVICE AND FLEXIBLE SEMICONDUCTOR DEVICE 有权
标题翻译：柔性半导体器件和柔性半导体器件的制造方法
公开(公告)号：US20110049598A1
公开(公告)日：2011-03-03
申请号：US12939729
申请日：2010-11-04
申请人： Koichi HIRANO , Seiichi Nakatani , Shingo Komatsu , Yoshihisa Yamashita , Takashi Ichiryu
发明人： Koichi HIRANO , Seiichi Nakatani , Shingo Komatsu , Yoshihisa Yamashita , Takashi Ichiryu
IPC分类号： H01L29/786
CPC分类号： H01L51/0024 , H01L29/41733 , H01L29/66742 , H01L29/78603 , H01L51/0023 , H01L51/0097 , H01L51/0525 , H01L51/055 , H01L51/102 , Y10T428/24917
摘要： A layered film of a three-layer clad foil formed with a first metal layer 23, a second metal layer 25, and an inorganic insulating layer 35 interposed therebetween is prepared. After the second metal layer 25 is partially etched to form a gate electrode 20g, the first metal layer 23 is partially etched to form source/drain electrodes 20s, 20d in a region corresponding to the gate electrode 20g. A semiconductor layer 40 is then formed in contact with the source/drain electrodes 20s, 20d and on the gate electrode 20g with the inorganic insulating layer 35 interposed therebetween. The inorganic insulating layer 35 on the gate electrode 20g functions as a gate insulating film 30, and the semiconductor layer 40 between the source/drain electrodes 20s, 20d on the inorganic insulating layer 35 functions as a channel.
摘要翻译：制备形成有第一金属层23，第二金属层25和介于其间的无机绝缘层35的三层复合箔的分层膜。在第二金属层25被部分蚀刻以形成栅电极20g之后，第一金属层23被部分蚀刻以在对应于栅电极20g的区域中形成源/漏电极20s，20d。然后，将半导体层40形成为与源极/漏极20s，20d接触并且在栅极电极20g上形成有绝缘层35。栅电极20g上的无机绝缘层35用作栅极绝缘膜30，无机绝缘层35上的源/漏电极20s，20d之间的半导体层40用作沟道。

6. 发明授权

US07888789B2 Transfer material used for producing a wiring substrate 有权
标题翻译：用于制造布线基板的转印材料
公开(公告)号：US07888789B2
公开(公告)日：2011-02-15
申请号：US11090401
申请日：2005-03-25
申请人： Yasuhiro Sugaya , Shingo Komatsu , Koichi Hirano , Seiichi Nakatani , Yasuyuki Matsuoka , Toshiyuki Asahi , Yoshihisa Yamashita
发明人： Yasuhiro Sugaya , Shingo Komatsu , Koichi Hirano , Seiichi Nakatani , Yasuyuki Matsuoka , Toshiyuki Asahi , Yoshihisa Yamashita
IPC分类号： H01L23/12 , H01L21/4763 , H01R43/20
CPC分类号： H05K3/20 , H01L2221/68345 , H01L2221/68359 , H01L2221/68363 , H01L2924/0002 , H01L2924/0102 , H01L2924/01078 , H05K1/0306 , H05K1/16 , H05K1/162 , H05K1/165 , H05K1/167 , H05K3/205 , H05K3/4061 , H05K3/4069 , H05K2203/1461 , Y10T29/49149 , Y10T29/49179 , Y10T29/49208 , Y10T29/49213 , Y10T428/12486 , H01L2924/00
摘要： A transfer material capable of transferring a fine wiring pattern to a substrate reliably and easily. The transfer material includes at least three layers of a first metal layer as a carrier, a second metal layer that is transferred to the substrate as a wiring pattern, and a peel layer adhering the first and second metal layers releasably. On the surface portion of the first metal layer, a concave and convex portion corresponding to the wiring pattern is formed, and the peel layer and the second metal layer are formed on a region of the convex portions.
摘要翻译：能够可靠且容易地将精细布线图案转印到基板上的转印材料。转印材料包括作为载体的第一金属层，作为布线图案转印到基板的第二金属层和可释放地粘附第一和第二金属层的剥离层的至少三层。在第一金属层的表面部分上形成与布线图形对应的凹凸部分，并且在凸部的区域上形成剥离层和第二金属层。

7. 发明授权

US07087467B2 Lead frame and production process thereof and production process of thermally conductive substrate 有权
标题翻译：导线架及其制造工艺及导热基板的生产工艺
公开(公告)号：US07087467B2
公开(公告)日：2006-08-08
申请号：US10752552
申请日：2004-01-08
申请人： Yoshihisa Yamashita , Koichi Hirano , Seiichi Nakatani , Masaki Suzumura
发明人： Yoshihisa Yamashita , Koichi Hirano , Seiichi Nakatani , Masaki Suzumura
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L23/49861 , H01L23/3737 , H01L2924/0002 , H05K1/0373 , H05K1/056 , H05K3/202 , H05K2201/0209 , Y10T29/49128 , Y10T428/24917 , H01L2924/00
摘要： A thermally conductive substrate includes a thermally conductive resin sheet member attached to a lead frame. The lead frame comprises a thermally conductive resin sheet member and it is integrated with the thermally conductive resin sheet member on the lead frame. The thermally conductive resin sheet member is formed from a thermosetting resin mixture which comprises 70 to 90 parts by weight of an inorganic filler and 5 to 30 parts by weight of a thermosetting resin composition including a thermosetting resin, and the thermosetting resin is in a semi-cured state.
摘要翻译：导热基板包括附接到引线框架的导热树脂片部件。引线框架包括导热树脂片部件，并且与引导框架上的导热树脂片部件一体化。导热性树脂片部件由热固性树脂混合物形成，该热固性树脂混合物包含70至90重量份的无机填料和5至30重量份的包含热固性树脂的热固性树脂组合物，并且所述热固性树脂为半固化状态。

8. 发明授权

US06958535B2 Thermal conductive substrate and semiconductor module using the same 失效
标题翻译：导热基板和使用其的半导体模块
公开(公告)号：US06958535B2
公开(公告)日：2005-10-25
申请号：US09956208
申请日：2001-09-18
申请人： Koichi Hirano , Yoshihisa Yamashita , Seiichi Nakatani
发明人： Koichi Hirano , Yoshihisa Yamashita , Seiichi Nakatani
IPC分类号： H01L23/14 , H01L23/373 , H05K1/05 , H01L23/10 , H01L23/34
CPC分类号： H01L23/3737 , H01L2224/16225 , H01L2924/00014 , H01L2924/09701 , H01L2924/19105 , H05K1/056 , H01L2224/0401
摘要： A semiconductor module includes a circuit substrate composed of a wiring pattern, an electrical insulating layer and a thermal radiation board, and in use is fixed to an external thermal radiation member, in which the electrical insulating layer is composed of a thermal conductive mixture containing 70-95 wt % of an inorganic filler and 5-30 wt % of a thermosetting resin. A warping degree of the circuit substrate with respect to the external thermal radiation member is at most 1/500 of a length of the substrate, and the circuit substrate warps to protrude toward the thermal radiation board as the temperature rises. Accordingly, the thermal radiation property does not deteriorate even when the temperature rises in use. At a time of fixing the circuit substrate to the external thermal radiation member, the thermal resistance is kept to be a sufficiently low level. The thermal resistance is kept in a low level without sacrificing the contact between a module and the external thermal radiation member even at a high temperature during an operation of the device or the like, and the thermal conductive substrate is resistant to fractures or cracks and thus is highly reliable.
摘要翻译：半导体模块包括由布线图案，电绝缘层和热辐射板构成的电路基板，并且在使用中固定到外部热辐射构件，其中电绝缘层由含有70的导热混合物 -95重量％的无机填料和5-30重量％的热固性树脂。电路基板相对于外部热辐射部件的翘曲程度为基板长度的至多1/500，电路基板随温度升高而向热辐射板翘曲。因此，即使使用温度上升，热辐射性也不会劣化。在将电路基板固定到外部热辐射部件的时刻，热阻保持在足够低的水平。即使在器件等的操作期间，即使在高温下，热阻也保持在低水平而不牺牲模块和外部热辐射构件之间的接触，并且导热基板抵抗裂缝或裂纹，因此高度可靠。

9. 发明申请

US20050158916A1 Thermal conductive board, method of manufacturing the same, and power module with the same incorporated therein 有权
标题翻译：导热板，其制造方法以及与其组合的功率模块
公开(公告)号：US20050158916A1
公开(公告)日：2005-07-21
申请号：US10998277
申请日：2004-11-24
申请人： Koichi Hirano , Seiichi Nakatani , Mitsuhiro Matsuo , Yoshihisa Yamashita
发明人： Koichi Hirano , Seiichi Nakatani , Mitsuhiro Matsuo , Yoshihisa Yamashita
IPC分类号： C08J5/18 , B29C43/18 , C08K3/00 , C08L101/00 , H01L23/373 , H01L23/433 , H01L23/498 , H01L23/50 , H05K1/02 , H05K1/03 , H05K1/05 , H05K3/20 , H05K3/40 , H05K7/20 , H01L21/44
CPC分类号： H05K7/205 , H01L23/3737 , H01L23/4334 , H01L23/49861 , H01L24/45 , H01L24/48 , H01L2224/451 , H01L2224/48247 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/1305 , H01L2924/13055 , H01L2924/19041 , H05K1/0204 , H05K1/056 , H05K3/0061 , H05K3/202 , H05K3/4084 , H05K7/20463 , H05K2201/0209 , H05K2201/0382 , H05K2201/09054 , H05K2201/0969 , H05K2201/10416 , H05K2203/1189 , Y10T29/49121 , Y10T29/4913 , Y10T29/49146 , Y10T29/49158 , Y10T29/49171 , Y10T29/49172 , H01L2924/00 , H01L2224/05599
摘要： A sheet-like thermally conductive resin composition containing 70 to 95 wt. % inorganic filler and 5 to 30 wt. % thermosetting resin composition, a lead frame as a wiring pattern, and an electrically conductive heat sink with a metal pole placed therein are superposed, heated and compressed, and thus are combined to form one body. Consequently, a thermally conductive circuit board with a flat surface is obtained in which a grounding pattern is grounded to the heat sink inside the insulating layer. Thus, the grounding pattern and the heat sink can be connected electrically with each other in an arbitrary position inside the insulating layer of the thermally conductive circuit board. Accordingly, there are provided a thermally conductive circuit board with high heat dissipation, high conductivity and high ground-connection reliability, a method of manufacturing the same, and a power module allowing its size to be reduced and its density to be increased.
摘要翻译：一种片状导热性树脂组合物，其含有70〜95重量％％无机填料和5〜30wt。热固性树脂组合物，作为布线图案的引线框架和放置有金属极的导电散热器叠加，加热和压缩，从而组合形成一体。因此，获得了具有平坦表面的导热电路板，其中接地图被接地到绝缘层内的散热片。因此，接地图案和散热器可以在导热电路板的绝缘层内的任意位置彼此电连接。因此，提供了具有高散热，高导电性和高接地连接可靠性的导热电路板，其制造方法以及允许其尺寸减小并且其密度增加的功率模块。

10. 发明授权

US06522555B2 Thermally conductive board, method of manufacturing the same, and power module with the same incorporated therein 有权
标题翻译：导热板，其制造方法以及与其相同的功率模块
公开(公告)号：US06522555B2
公开(公告)日：2003-02-18
申请号：US09834710
申请日：2001-04-13
申请人： Koichi Hirano , Seiichi Nakatani , Mitsuhiro Matsuo , Yoshihisa Yamashita
发明人： Koichi Hirano , Seiichi Nakatani , Mitsuhiro Matsuo , Yoshihisa Yamashita
IPC分类号： H05K702
CPC分类号： H05K7/205 , H01L23/3737 , H01L23/4334 , H01L23/49861 , H01L24/45 , H01L24/48 , H01L2224/451 , H01L2224/48247 , H01L2924/00014 , H01L2924/01019 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/1305 , H01L2924/13055 , H01L2924/19041 , H05K1/0204 , H05K1/056 , H05K3/0061 , H05K3/202 , H05K3/4084 , H05K7/20463 , H05K2201/0209 , H05K2201/0382 , H05K2201/09054 , H05K2201/0969 , H05K2201/10416 , H05K2203/1189 , Y10T29/49121 , Y10T29/4913 , Y10T29/49146 , Y10T29/49158 , Y10T29/49171 , Y10T29/49172 , H01L2924/00 , H01L2224/05599
摘要： A sheet-like thermally conductive resin composition containing 70 to 95 wt. % inorganic filler and 5 to 30 wt. % thermosetting resin composition, a lead frame as a wiring pattern, and an electrically conductive heat sink with a metal pole placed therein are superposed, heated and compressed, and thus are combined to form one body. Consequently, a thermally conductive circuit board with a flat surface is obtained in which a grounding pattern is grounded to the heat sink inside the insulating layer. Thus, the grounding pattern and the heat sink can be connected electrically with each other in an arbitrary position inside the insulating layer of the thermally conductive circuit board. Accordingly, there are provided a thermally conductive circuit board with high heat dissipation, high conductivity and high ground-connection reliability, a method of manufacturing the same, and a power module allowing its size to be reduced and its density to be increased.
摘要翻译：一种片状导热性树脂组合物，其含有70〜95重量％％无机填料和5〜30wt。热固性树脂组合物，作为布线图案的引线框架和放置有金属极的导电散热器叠加，加热和压缩，从而组合形成一体。因此，获得了具有平坦表面的导热电路板，其中接地图被接地到绝缘层内的散热片。因此，接地图案和散热器可以在导热电路板的绝缘层内的任意位置彼此电连接。因此，提供了具有高散热，高导电性和高接地连接可靠性的导热电路板，其制造方法以及允许其尺寸减小并且其密度增加的功率模块。

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