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1. 发明申请

US20130069680A1 RISERS INCLUDING A PLURALITY OF HIGH ASPECT RATIO ELECTRICAL CONDUITS AND SYSTEMS AND METHODS OF MANUFACTURE AND USE THEROF 审中-公开
标题翻译：包括多个高比例电气连接和系统的升高及其制造和使用方法
公开(公告)号：US20130069680A1
公开(公告)日：2013-03-21
申请号：US13610076
申请日：2012-09-11
申请人： Koby L. Duckworth , Eric Hill , Mike Jolley , Kurt Schultz , Jody Curtis
发明人： Koby L. Duckworth , Eric Hill , Mike Jolley , Kurt Schultz , Jody Curtis
IPC分类号： G01R1/073 , H05K3/10 , H05K1/11
CPC分类号： G01R1/07378 , G01R3/00 , H05K1/11 , H05K3/4046 , H05K2201/0379 , H05K2201/10378
摘要： Risers including a plurality of high aspect ratio electrical conduits, as well as systems and methods of manufacture and/or use of the risers and/or the high aspect ratio electrical conduits. The systems and methods may include incorporation of the plurality of high aspect ratio electrical conduits within a substantially planar body that may include and/or be formed from a solid dielectric material. The plurality of electrical conduits may be configured to conduct a plurality of electric currents between a first surface of the body and a second, substantially opposed, surface of the body. The surfaces may include a plurality of contact pads configured to provide a robust and/or corrosion-resistant surface and/or to improve electrical contact between the riser and another device. The risers also may include a layered structure, wherein the layers are sequentially formed to increase a thickness of the riser and/or the aspect ratio of the electrical conduits.
摘要翻译：包括多个高纵横比电导管的立管以及制造和/或使用立管和/或高纵横比电导管的系统和方法。系统和方法可以包括将多个高纵横比的电导管并入可包括和/或由固体电介质材料形成的基本平坦的体内。多个电导管可以被配置为在主体的第一表面和主体的第二，基本相对的表面之间传导多个电流。表面可以包括多个接触垫，其被配置为提供坚固的和/或耐腐蚀的表面和/或改善上升管和另一个装置之间的电接触。立管还可以包括层状结构，其中顺序地形成这些层以增加提升管的厚度和/或电导管的纵横比。

2. 发明申请

US20080026318A1 Composite photoresist for modifying die-side bumps 有权
标题翻译：复合光刻胶，用于修正裸片侧凸块
公开(公告)号：US20080026318A1
公开(公告)日：2008-01-31
申请号：US11495368
申请日：2006-07-27
申请人： Kurt Schultz , Kevin J. Lee , Michael D. Goodner , Shane Nolen
发明人： Kurt Schultz , Kevin J. Lee , Michael D. Goodner , Shane Nolen
IPC分类号： G03C1/00 , G03C5/00
CPC分类号： H01L24/11 , G03F7/0047 , H01L21/563 , H01L24/13 , H01L24/81 , H01L2224/05001 , H01L2224/05022 , H01L2224/05027 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05164 , H01L2224/05169 , H01L2224/05184 , H01L2224/05572 , H01L2224/05666 , H01L2224/05684 , H01L2224/11472 , H01L2224/13018 , H01L2224/13099 , H01L2224/13147 , H01L2224/16 , H01L2224/81193 , H01L2224/81801 , H01L2924/01013 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/18301 , H01L2924/19043 , H01L2924/00012 , H01L2924/00014
摘要： A composite photoresist comprises a photoresist material and a filler material dispersed within the photoresist material, wherein the filler material includes a plurality of nanoparticles. The photoresist material may comprise an acrylic-based photoresist, a novolak-based photoresist, a polyhydroxystyrene-based photoresist, a SLAM, or a BARC. The filler material may comprise base-soluble styrene-butadiene rubber nanospheres, nitrile-butadiene rubber nanospheres, polystyrene-based nanoparticles, acrylic-based nanoparticles, or inorganic nanoparticles. The nanoparticles may have an average diameter that is between around 10 nm and around 1000 nm and may have a loading in the photoresist material that is between around 5% and 50%. The composite photoresist may be used to form die-side metal bumps for use in a C4 connection that have a roughened sidewall surface but a smooth top surface.
摘要翻译：复合光致抗蚀剂包括光致抗蚀剂材料和分散在光致抗蚀剂材料内的填充材料，其中填充材料包括多个纳米颗粒。光致抗蚀剂材料可以包括基于丙烯酸的光致抗蚀剂，酚醛清漆型光致抗蚀剂，聚羟基苯乙烯类光致抗蚀剂，SLAM或BARC。填料可以包括可溶的苯乙烯 - 丁二烯橡胶纳米球，腈 - 丁二烯橡胶纳米球，基于聚苯乙烯的纳米颗粒，基于丙烯酸的纳米颗粒或无机纳米颗粒。纳米颗粒的平均直径可以在约10nm至约1000nm之间，并且可以在光致抗蚀剂材料中具有介于约5％和50％之间的负载。复合光致抗蚀剂可用于形成用于具有粗糙侧壁表面但具有光滑顶表面的C4连接中的模头侧金属凸块。

3. 发明申请

US20080003715A1 Tapered die-side bumps 审中-公开
标题翻译：锥形模头凸块
公开(公告)号：US20080003715A1
公开(公告)日：2008-01-03
申请号：US11479091
申请日：2006-06-30
申请人： Kevin J. Lee , Figen T. Akin , Kurt Schultz , Raman Vaidyanathan , Shane A. Nolen , Adwait Telang
发明人： Kevin J. Lee , Figen T. Akin , Kurt Schultz , Raman Vaidyanathan , Shane A. Nolen , Adwait Telang
IPC分类号： H01L21/00
CPC分类号： H01L24/13 , H01L24/11 , H01L2224/05001 , H01L2224/05022 , H01L2224/05124 , H01L2224/05147 , H01L2224/05166 , H01L2224/05181 , H01L2224/05186 , H01L2224/05572 , H01L2224/0558 , H01L2224/05647 , H01L2224/13099 , H01L2224/13147 , H01L2924/0001 , H01L2924/01013 , H01L2924/01019 , H01L2924/01022 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01073 , H01L2924/01082 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/14 , H01L2924/19043 , H01L2924/30105 , H01L2924/00014
摘要： Embodiments of the invention include apparatuses and methods relating to die-side bumps having a tapered cross-section. In one embodiment, the tapered die-side bump is electrically coupled to a solder bump on a package substrate.
摘要翻译：本发明的实施例包括与具有锥形横截面的模头侧凸起相关的装置和方法。在一个实施例中，锥形模头侧凸起电耦合到封装衬底上的焊料凸块。

4. 发明授权

US07585615B2 Composite photoresist for modifying die-side bumps 有权
标题翻译：复合光刻胶，用于修正裸片侧凸块
公开(公告)号：US07585615B2
公开(公告)日：2009-09-08
申请号：US11495368
申请日：2006-07-27
申请人： Kurt Schultz , Kevin J. Lee , Michael D. Goodner , Shane Nolen
发明人： Kurt Schultz , Kevin J. Lee , Michael D. Goodner , Shane Nolen
IPC分类号： G03F7/00 , G03F7/004
CPC分类号： H01L24/11 , G03F7/0047 , H01L21/563 , H01L24/13 , H01L24/81 , H01L2224/05001 , H01L2224/05022 , H01L2224/05027 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05164 , H01L2224/05169 , H01L2224/05184 , H01L2224/05572 , H01L2224/05666 , H01L2224/05684 , H01L2224/11472 , H01L2224/13018 , H01L2224/13099 , H01L2224/13147 , H01L2224/16 , H01L2224/81193 , H01L2224/81801 , H01L2924/01013 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/18301 , H01L2924/19043 , H01L2924/00012 , H01L2924/00014
摘要： A composite photoresist comprises a photoresist material and a filler material dispersed within the photoresist material, wherein the filler material includes a plurality of nanoparticles. The photoresist material may comprise an acrylic-based photoresist, a novolak-based photoresist, a polyhydroxystyrene-based photoresist, a SLAM, or a BARC. The filler material may comprise base-soluble styrene-butadiene rubber nanospheres, nitrile-butadiene rubber nanospheres, polystyrene-based nanoparticles, acrylic-based nanoparticles, or inorganic nanoparticles. The nanoparticles may have an average diameter that is between around 10 nm and around 1000 nm and may have a loading in the photoresist material that is between around 5% and 50%. The composite photoresist may be used to form die-side metal bumps for use in a C4 connection that have a roughened sidewall surface but a smooth top surface.
摘要翻译：复合光致抗蚀剂包括光致抗蚀剂材料和分散在光致抗蚀剂材料内的填充材料，其中填充材料包括多个纳米颗粒。光致抗蚀剂材料可以包括基于丙烯酸的光致抗蚀剂，酚醛清漆型光致抗蚀剂，聚羟基苯乙烯类光致抗蚀剂，SLAM或BARC。填料可以包括可溶的苯乙烯 - 丁二烯橡胶纳米球，腈 - 丁二烯橡胶纳米球，基于聚苯乙烯的纳米颗粒，基于丙烯酸的纳米颗粒或无机纳米颗粒。纳米颗粒的平均直径可以在约10nm至约1000nm之间，并且可以在光致抗蚀剂材料中具有介于约5％和50％之间的负载。复合光致抗蚀剂可用于形成用于具有粗糙侧壁表面但具有光滑顶表面的C4连接中的模头侧金属凸块。

5. 发明授权

US6069480A Kelvin contact-type testing device 失效
标题翻译：开尔文接触式试验装置
公开(公告)号：US6069480A
公开(公告)日：2000-05-30
申请号：US1299
申请日：1997-12-31
申请人： Farid J. Sabounchi , Martin Rowan , Kurt Schultz
发明人： Farid J. Sabounchi , Martin Rowan , Kurt Schultz
IPC分类号： G01R1/04 , G01R31/28
CPC分类号： G01R1/0466
摘要： A device (10) for testing miniature electronic components (104) includes a pair of contacts (88, 90), each of which is adapted to engage a common side (121) of a lead (110) of the electronic component (104) to be tested at longitudinally spaced locations. In particular, each contact (88, 90) includes an end portion (95, 99) that is arranged at an angle to both the lead (110) and the other contact (88, 90), while extending in a common vertical plane with the other contact (88, 90). In a preferred form of the invention, the device (10) includes a base (46) to which the first and second contacts (88, 90) are mounted. Each of the contacts (88, 90) include first and second end portions (94, 95 and 98, 99), with the first end portion (94, 98) of each contact (88, 90) being fixed relative to the base (46) and the second end portion (95, 99) extending at an angle to a plane of the base (46). In the most preferred form, the first end portion (94) of the first contact (88) is mounted atop the base (46) and the second end portion (95) thereof slopes downward from the base (46). On the other hand, the second end portion (99) of the second contact (90) is mounted below the first contact (88), such as on the bottom of the base (46), and the second end portion (99) thereof projects upwardly, at an acute angle to the vertical, to a point located above the second end portion (95) of the first contact (88). To accommodate the testing of electronic components (104) having varying lead spans, the base (46) can be formed from multiple, relatively shiftable sections (46a, 46b), each of which carries a respective pair of contact (88, 90).
摘要翻译：用于测试微型电子部件（104）的装置（10）包括一对触头（88,90），每个触头适于接合电子部件（104）的引线（110）的公共侧（121）在纵向间隔的位置进行测试。特别地，每个触头（88,90）包括端部（95,99），该端部（95,99）与引线（110）和另一触点（88,90）成一定角度布置，同时在共同的垂直平面中延伸另一个触点（88,90）。在本发明的优选形式中，装置（10）包括安装有第一和第二触头（88,90）的基座（46）。每个触点（88,90）包括第一和第二端部（94,95和98,99），每个触点（88,90）的第一端部（94,98）相对于基座（ 46）和与基座（46）的平面成一定角度延伸的第二端部（95,99）。在最优选的形式中，第一触点（88）的第一端部（94）安装在基座（46）的顶部，并且其第二端部（95）从基部（46）向下倾斜。另一方面，第二触点（90）的第二端部（99）安装在第一触点（88）的下方，例如在基部（46）的底部，并且其第二端部（99）以与垂直方向成锐角的方式向上突出到位于第一触头（88）的第二端部（95）上方的点。为了适应具有变化的引线跨距的电子部件（104）的测试，基部（46）可以由多个相对可移位的部分（46a，46b）形成，每个部分承载相应的一对触头（88,90）。

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