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    • 3. 发明授权
    • Preparation of workpieces for cold forming
    • 冷成型工件的制备
    • US06482273B1
    • 2002-11-19
    • US09787043
    • 2001-04-06
    • Klaus-Dieter NittelUwe Rau
    • Klaus-Dieter NittelUwe Rau
    • C23C2200
    • C23C22/78
    • The invention relates to a method for preparing workpieces suitable for phosphatizing for chipless cold forming by acid pickling, rinsing, drying and treatment with acid reaction lubricants containing phosphate ions. According to said method the workpieces are rinsed before drying with a solution which contains lactic acid, has a pH below 3 and preferably a temperature of between 60 and 80° C. Preferred embodiments of the invention consist of rinsing the workpieces with a solution which in addition contains phosphoric acid, has a lactic acid concentration of between 1 and 50 g/l and a weight ratio of lactic acid to phosphoric acid of between 1:9 and 9:1.
    • 本发明涉及一种适用于通过酸洗,漂洗,干燥和含有磷酸根离子的酸反应润滑剂进行处理的用于无酸冷成型的工件的制备方法。 根据所述方法,在用含有乳酸的溶液干燥之前将工件漂洗,pH低于3,优选温度在60至80℃之间。本发明的优选实施方案包括用溶液冲洗工件, 添加含有磷酸,乳酸浓度为1〜50g / l,乳酸与磷酸的重量比为1:9〜9:1。
    • 4. 发明授权
    • Concentrate for the electroless deposition of copper coatings on iron
and iron alloy surfaces
    • 集中在铁和铁合金表面上的铜涂层的无电沉积
    • US5776231A
    • 1998-07-07
    • US802029
    • 1997-02-18
    • Klaus-Dieter NittelKarl-Heinz Nuss
    • Klaus-Dieter NittelKarl-Heinz Nuss
    • C23C18/38B22F7/00
    • C23C18/38
    • Disclosed is a process for the electroless deposition of a copper coating on an iron or iron alloy surface wherein the workpiece surface is contacted with a solution which contains hydrogen ions, 5 to 30 g/l Cu as well as 0.2 to 5 g/l Mg and preferably copper and magnesium with a weight ratio of Cu:Mg of (35 to 5):1 for a treatment time of 3 sec to 15 min at a temperature of the solution of 20.degree. to 65.degree. C. The invention also comprises a solid concentrate for preparing and replenishing the solution for carrying out the process, which consists of at least 85 wt-% CuSO.sub.4.5H.sub.2 O and MgSO.sub.4 (anhydrous) with a weight ratio of (35 to 5):1, and preferably contains in addition a maximum of 10 wt-% polyglycol and a maximum of 5 wt-% sodium chloride.
    • 公开了一种在铁或铁合金表面上无电沉积铜涂层的方法,其中工件表面与含有氢离子的溶液接触,5至30g / l的Cu以及0.2至5g / l的Mg 优选铜和镁的重量比为(35〜5):1,在20〜65℃的温度下处理时间为3秒〜15分钟。本发明还包括 用于制备和补充用于进行该方法的溶液的固体浓缩物,其由至少85重量%的重量比为(35至5):1的CuSO 4·5H 2 O和MgSO 4(无水)组成,并且优选还包含 最多10重量%的聚乙二醇和最多5重量%的氯化钠。