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1. 发明申请

US20110117302A1 PACKING BODY SEALED BY LASER WELDING AND METHOD OF SEALING THE SAME 有权
标题翻译：用激光焊接密封的包装体及其密封方法
公开(公告)号：US20110117302A1
公开(公告)日：2011-05-19
申请号：US13003939
申请日：2009-08-21
申请人： Kiyotaka Shinozaki , Shoichi Inaba , Yoshiaki Shinagawa , Jiro Iida
发明人： Kiyotaka Shinozaki , Shoichi Inaba , Yoshiaki Shinagawa , Jiro Iida
IPC分类号： B32B1/02 , B29C65/16
CPC分类号： B65B7/2878 , B23K26/206 , B23K2101/12 , B29C65/1616 , B29C65/1635 , B29C65/1648 , B29C65/1677 , B29C65/3412 , B29C65/3468 , B29C65/3476 , B29C65/82 , B29C66/112 , B29C66/131 , B29C66/542 , B29C66/71 , B29C66/723 , B29C66/72321 , B29C66/72328 , B29C66/72329 , B29C66/7352 , B29C66/73921 , B29C66/8122 , B29C66/81267 , B29C66/81431 , B29C66/81457 , B29C66/9161 , B29C66/919 , B29C66/929 , B29C66/93451 , B29C66/939 , B29C66/949 , B29K2105/0085 , B29K2305/02 , B29K2305/12 , B29K2505/12 , B29K2995/0069 , B29L2009/00 , B29L2031/712 , B65B51/22 , B65D77/2024 , Y10T428/1359 , Y10T428/1393 , B29K2909/08 , B29K2077/00 , B29K2067/003 , B29K2067/00 , B29K2023/18 , B29K2023/16 , B29K2023/12 , B29K2023/086 , B29K2023/083 , B29K2023/065 , B29K2023/0641 , B29K2023/0633 , B29K2023/06
摘要： A sealed packing body comprising a packing body made from a laminated material and a sealing member for sealing the packing body; wherein the laminated material includes a base material layer, a thermoplastic resin layer containing an iron powder, and a thermoplastic resin layer which permits a laser beam to pass through, at least the surface of the sealing member which comes in contact with the packing body comprising a thermoplastic resin which permits the laser beam to pass through; and the surfaces of the packing body and the sealing member coming in contact are sealed together by laser welding. It is, therefore, allowed to effectively utilize the iron powder that has, heretofore, been utilized as an oxygen absorber of the packing containers and to efficiently conduct the laser welding.
摘要翻译：一种密封包装体，包括由层压材料制成的包装体和用于密封包装体的密封构件; 其中，所述层压材料至少包括与所述包装体接触的所述密封材料的表面，所述层叠材料包含基材层，含有铁粉的热塑性树脂层和允许激光束通过的热塑性树脂层，允许激光束通过的热塑性树脂; 并且通过激光焊接将包装体和密封部件接触的表面密封在一起。因此，能够有效地利用迄今已被用作包装容器的氧吸收剂的铁粉，并有效地进行激光焊接。

2. 发明授权

US08349420B2 Packing body sealed by laser welding and method of sealing the same 有权
标题翻译：激光焊接密封的包装体及密封方法
公开(公告)号：US08349420B2
公开(公告)日：2013-01-08
申请号：US13003939
申请日：2009-08-21
申请人： Kiyotaka Shinozaki , Shoichi Inaba , Yoshiaki Shinagawa , Jiro Iida
发明人： Kiyotaka Shinozaki , Shoichi Inaba , Yoshiaki Shinagawa , Jiro Iida
IPC分类号： B29D22/00
CPC分类号： B65B7/2878 , B23K26/206 , B23K2101/12 , B29C65/1616 , B29C65/1635 , B29C65/1648 , B29C65/1677 , B29C65/3412 , B29C65/3468 , B29C65/3476 , B29C65/82 , B29C66/112 , B29C66/131 , B29C66/542 , B29C66/71 , B29C66/723 , B29C66/72321 , B29C66/72328 , B29C66/72329 , B29C66/7352 , B29C66/73921 , B29C66/8122 , B29C66/81267 , B29C66/81431 , B29C66/81457 , B29C66/9161 , B29C66/919 , B29C66/929 , B29C66/93451 , B29C66/939 , B29C66/949 , B29K2105/0085 , B29K2305/02 , B29K2305/12 , B29K2505/12 , B29K2995/0069 , B29L2009/00 , B29L2031/712 , B65B51/22 , B65D77/2024 , Y10T428/1359 , Y10T428/1393 , B29K2909/08 , B29K2077/00 , B29K2067/003 , B29K2067/00 , B29K2023/18 , B29K2023/16 , B29K2023/12 , B29K2023/086 , B29K2023/083 , B29K2023/065 , B29K2023/0641 , B29K2023/0633 , B29K2023/06
摘要： A sealed packing body comprising a packing body made from a laminated material and a sealing member for sealing the packing body; wherein the laminated material includes a base material layer, a thermoplastic resin layer containing an iron powder, and a thermoplastic resin layer which permits a laser beam to pass through, at least the surface of the sealing member which comes in contact with the packing body comprising a thermoplastic resin which permits the laser beam to pass through; and the surfaces of the packing body and the sealing member coming in contact are sealed together by laser welding. It is, therefore, allowed to effectively utilize the iron powder that has, heretofore, been utilized as an oxygen absorber of the packing containers and to efficiently conduct the laser welding.
摘要翻译：一种密封包装体，包括由层压材料制成的包装体和用于密封包装体的密封构件; 其中，所述层压材料至少包括与所述包装体接触的所述密封材料的表面，所述层叠材料包含基材层，含有铁粉的热塑性树脂层和允许激光束通过的热塑性树脂层，允许激光束通过的热塑性树脂; 并且通过激光焊接将包装体和密封部件接触的表面密封在一起。因此，能够有效地利用迄今已被用作包装容器的氧吸收剂的铁粉，并有效地进行激光焊接。

3. 发明授权

US06168684A Wafer polishing apparatus and polishing method 失效
标题翻译：晶圆抛光装置和抛光方法
公开(公告)号：US06168684A
公开(公告)日：2001-01-02
申请号：US09205695
申请日：1998-12-04
申请人： Hideo Mitsuhashi , Satoshi Ohi , Atsushi Yamamori , Shoichi Inaba
发明人： Hideo Mitsuhashi , Satoshi Ohi , Atsushi Yamamori , Shoichi Inaba
IPC分类号： C23F102
CPC分类号： B24B37/32 , B24B47/10
摘要： A wafer polishing apparatus has a rotary polishing bed, an abrasive cloth provided on the polishing bed, an abrasive supply supplying abrasives to a surface of the abrasive cloth, a wafer depressor depressing the wafer onto the abrasive cloth at a predetermined pressure, a ring shaped retainer arranged surrounding the wafer and provided with a plurality of grooves extending between an inner peripheral edge and an outer peripheral edge on a surface contacting with the abrasive cloth, a rotary driver driving the wafer and the retainer on the abrasive cloth, and a rotation speed difference generator providing a difference of rotation speeds between the wafer and the retainer.
摘要翻译：晶片抛光装置具有旋转抛光床，设置在研磨床上的研磨布，向磨料表面供给研磨剂的研磨剂，以预定压力将晶片压在研磨布上的晶片压片，环形保持器围绕晶片设置并且在与磨料接触的表面上的内周边缘和外周边缘之间延伸的多个槽，在研磨布上驱动晶片和保持器的旋转驱动器以及旋转速度差分发生器提供晶片和保持器之间的旋转速度差。

4. 发明授权

US5670184A Molding apparatus having a molding cavity divided by an elastic member 失效
标题翻译：具有由弹性构件分开的模制腔的成型装置
公开(公告)号：US5670184A
公开(公告)日：1997-09-23
申请号：US589375
申请日：1996-01-22
申请人： Kousaku Nakamichi , Kazunori Miura , Shoichi Inaba
发明人： Kousaku Nakamichi , Kazunori Miura , Shoichi Inaba
IPC分类号： B29C45/26 , B29C45/16
CPC分类号： B29C45/1639
摘要： A molding apparatus includes a movable mold-defining member mounted on the movable side of an injection machine and a stationary mold-defining member mounted on its stationary side. Those members are joinable to define a mold cavity and a runner channel therebetween. The movable mold-defining member is provided with a dividing member for dividing the runner channel, or cavity, or both into a plurality of portions. The dividing member is normally urged by an elastic member to project into the channel, or cavity. The dividing member has one side which is substantially perpendicular to the direction of flow of a molding resin material to stop its flow past the dividing member, and an opposite side cut away partly to form a recess at one end thereof, so that another molding resin material reaching the opposite side may flow into the recess and thereby move said dividing member out of the channel, or cavity by overcoming the force of the elastic member.
摘要翻译：成型装置包括安装在注射机的可动侧上的可移动模具限定件和安装在其固定侧上的固定模具限定件。这些构件可连接以在其间限定模腔和流道通道。可移动模具限定构件设置有用于将流道或空腔或两者分成多个部分的分隔构件。分隔构件通常由弹性构件推动以伸入通道或空腔。分隔构件具有基本上垂直于模制树脂材料的流动方向的一侧，以阻止其流过分隔构件，并且相对侧部分地切除以在其一端形成凹部，使得另一模制树脂到达相对侧的材料可能流入凹槽，从而通过克服弹性构件的力将所述分隔构件移出通道或空腔。

5. 发明授权

US6139409A Wafer polishing apparatus and backing pad for wafer polishing 失效
标题翻译：晶圆抛光装置和衬垫用于晶片抛光
公开(公告)号：US6139409A
公开(公告)日：2000-10-31
申请号：US323121
申请日：1999-06-01
申请人： Shoichi Inaba
发明人： Shoichi Inaba
IPC分类号： B24B37/04 , B24B37/30 , H01L21/304 , H01L21/306 , B24B7/22
CPC分类号： B24B37/30 , B24B41/061 , H01L21/30625
摘要： A wafer polishing apparatus includes a rotatably supported polishing table, a pad, a carrier head, and a backing pad. The pad is fixed to the polishing table. The carrier head is arranged to oppose the polishing table and is supported to be rotatable and movable forward/backward with respect to the polishing table. The backing pad is fixed to a surface of the carrier head which opposes the polishing pad, and presses a wafer against the polishing pad by cooperation with compressed air. The backing pad is constituted by an annular foamed body having closed cells to press an outer peripheral portion of the wafer, and a columnar second foamed body having open cells and provided inside the first foamed body.
摘要翻译：晶片抛光装置包括可旋转地支撑的抛光台，垫，载体头和背衬垫。该垫固定在抛光台上。承载头被布置为与抛光台相对，并被支撑为能够相对于抛光台旋转并可前后移动。背衬垫固定到与抛光垫相对的载体头的表面上，并通过与压缩空气的配合将晶片压靠在抛光垫上。衬垫由具有用于挤压晶片的外周部分的闭孔的环状发泡体和具有开口单元并设置在第一发泡体内部的柱状第二发泡体构成。

6. 发明授权

US5641231A Temperature monitoring apparatus equipped with gas chamber for converting temperature to gas pressure 失效
标题翻译：温度监控装置配有气体室，用于将温度转换为气体压力
公开(公告)号：US5641231A
公开(公告)日：1997-06-24
申请号：US404745
申请日：1995-03-15
申请人： Shoichi Inaba
发明人： Shoichi Inaba
IPC分类号： G01K3/00 , G01K3/14 , G01K5/00 , G01K5/28 , G01K3/08
CPC分类号： G01K3/14
摘要： A temperature monitoring apparatus has a plurality of cells held in contact with a heater unit having a temperature distribution, a plurality of pressure sensors for measuring pressure differences, a gas pipeline network connected between the plurality of cells and the plurality of pressure sensors and a data processing unit for calculating temperature differences between two of the plurality of cells on the basis of an initial temperature and an initial gas pressure of one of the plurality of cells measured before heating, and the temperature distribution measured by the temperature monitoring apparatus is accurate rather than a temperature monitoring apparatus using thermo couples.
摘要翻译：温度监视装置具有与具有温度分布的加热器单元保持接触的多个单元，用于测量压力差的多个压力传感器，连接在多个单元和多个压力传感器之间的气体管线网络以及数据处理单元，用于基于初始温度和加热前测量的多个单元之一的初始气体压力来计算两个多个单元之间的温度差，并且由温度监视装置测量的温度分布是准确的而不是使用热电偶的温度监测装置。

7. 发明授权

US6093080A Polishing apparatus and method 失效
标题翻译：抛光设备和方法
公开(公告)号：US6093080A
公开(公告)日：2000-07-25
申请号：US245881
申请日：1999-02-08
申请人： Shoichi Inaba , Takao Katsuyama , Morimitsu Tanaka
发明人： Shoichi Inaba , Takao Katsuyama , Morimitsu Tanaka
IPC分类号： B24B27/00 , B24B49/16 , B24B53/007 , B24B53/017 , H01L21/304 , B24B49/00 , B24B51/00
CPC分类号： B24B53/017 , B24B49/16
摘要： A polishing apparatus and method capable of polishing stably irrelevant of disorder such as the change of a polishing object, change of a polishing device with lapse of time. A polishing apparatus includes polishing pad 1, polishing table 3 with the polishing pad adhered thereto, table motor 8 for driving the polishing table 3, conditioning device 5 of the polishing pad 1 and conditioning control system 12 for setting conditioning conditions. According to a polishing method of the present invention, conditioning conditions of the polishing pad 1 are set on based on a frictional force exerted between the polishing pad 1 and a substrate or on torque current 10.
摘要翻译：能够稳定地抛光抛光装置的抛光装置和方法，如抛光对象的变化，随着时间的推移改变抛光装置。抛光装置包括抛光垫1，抛光垫3，抛光垫粘附在其上，用于驱动抛光台3的台马达8，抛光垫1的调节装置5以及用于调节条件的调节控制系统12。根据本发明的抛光方法，抛光垫1的调理条件基于抛光垫1和基板之间的摩擦力或扭矩电流10设定。

8. 发明申请

US20100107568A1 METHOD AND APPARATUS FOR HEAT-SEALING CONTAINER 审中-公开
标题翻译：热封容器的方法和装置
公开(公告)号：US20100107568A1
公开(公告)日：2010-05-06
申请号：US12450792
申请日：2007-04-18
申请人： Shoichi Inaba , Hironori Kobayashi , Yoshinori Asada
发明人： Shoichi Inaba , Hironori Kobayashi , Yoshinori Asada
IPC分类号： B65B7/28 , B65B51/22
CPC分类号： B65B7/2878 , B29C65/18 , B29C65/32 , B29C65/7873 , B29C65/7882 , B29C66/0042 , B29C66/0342 , B29C66/131 , B29C66/1312 , B29C66/3494 , B29C66/53461 , B29C66/542 , B29C66/545 , B29C66/71 , B29C66/723 , B29C66/80 , B29C66/8122 , B29C66/8126 , B29C66/81431 , B29C66/81811 , B29C66/8242 , B29C66/83421 , B29C66/83423 , B29C66/91231 , B29C66/91421 , B29C66/91443 , B29C66/91651 , B29C66/91655 , B29C66/919 , B29C66/91951 , B29K2023/12 , B29K2067/00 , B29K2077/00 , B29K2879/08 , B29K2995/0008 , B29L2009/00 , B65B51/227 , B65B2051/105 , B29K2827/12 , B29K2067/003
摘要： A heat welding member 23 of a seal head 21 formed in the shape of a flange portion 11a of a container 10 is heated by high frequency induction heating and a cap 12 is welded by pressing the heated seal head 21. By using the seal head 21 comprising the heat welding member 23 having a shape necessary for sealing the cap 12, influences by temperature drop and inflation of gas in a head space can be prevented and sealing at a high speed and in a stable manner can be achieved.
摘要翻译：通过高频感应加热来加热形成为容器10的凸缘部分11a形状的密封头21的热焊件23，并通过按压加热的密封头21来焊接盖12.通过使用密封头21 包括具有密封盖12所必需的形状的热焊接部件23，可以防止顶部空间中的气体的温度下降和充气的影响，并能够以高速，稳定的方式进行密封。

9. 发明授权

US06234884B1 Semiconductor wafer polishing device for removing a surface unevenness of a semiconductor substrate 失效
标题翻译：用于去除半导体衬底的表面凹凸的半导体晶片抛光装置
公开(公告)号：US06234884B1
公开(公告)日：2001-05-22
申请号：US09251438
申请日：1999-02-17
申请人： Shoichi Inaba
发明人： Shoichi Inaba
IPC分类号： B24B500
CPC分类号： B24B53/017 , B24B57/02
摘要： A surface of a semiconductor wafer is polished by a polishing pad provided on a rotary polishing table while a polishing slurry is supplied onto a surface of the polishing pad. A surface condition of the polishing pad is regulated by a polishing pad surface mending unit which is provided on an upstream of the wafer in a rotating direction of said polishing table.
摘要翻译：通过设置在旋转研磨台上的研磨垫，将抛光浆料供给到研磨垫的表面上，研磨半导体晶片的表面。抛光垫的表面状态由在抛光台的旋转方向上设置在晶片的上游的抛光垫表面修补单元来调节。

10. 发明授权

US07685794B2 Apparatus for sterilization and filling of cup type container 有权
标题翻译：杯型容器灭菌和灌装设备
公开(公告)号：US07685794B2
公开(公告)日：2010-03-30
申请号：US11662497
申请日：2005-09-13
申请人： Nobuaki Nagatani , Yoshinori Asada , Takeshi Iwashita , Shoichi Inaba
发明人： Nobuaki Nagatani , Yoshinori Asada , Takeshi Iwashita , Shoichi Inaba
IPC分类号： B65B55/02
CPC分类号： B65B55/025 , B65B55/027 , B65B55/04 , B65B55/10 , B65G47/525 , B65G2201/0235
摘要： Cup-shaped containers can be turned over and transferred with good stability from a sterilization-washing zone to the filling-sealing zone inside an aseptic chamber, and admixture of odor or microorganisms is prevented.The first conveyor 2 for conveying the cup-shaped container 38 in an inverted state and a second conveyor 3 for conveying the container in an upright state downstream of the first conveyor 2 are disposed in series in substantially the same plane inside a continuous aseptic chamber 1. A container supply device, a container sterilization device, and a container washing device are disposed successively along the first conveyor 2. A contents filling device 40, a lid material sealing device 41, and a device for discharging the sealed cup-shaped container are installed successively along the second conveyor 3. Sterilization and washing are performed in an inverted state, while conveying the container with the first conveyor 2. The washed container is turned over and transferred from the first conveyor to the second conveyor 3 and the contents filling and lid sealing are performed on the second conveyor.
摘要翻译：杯形容器可以从灭菌洗涤区转移到无菌室内的填充密封区域，并以良好的稳定性转移并转移，并且防止气味或微生物的混合。用于以倒立的状态输送杯形容器38的第一输送机2和用于在第一输送机2下游的直立状态下输送容器的第二输送机3在连续的无菌室1内的基本相同的平面内串联布置容器供给装置，容器消毒装置和容器清洗装置沿着第一输送机2依次配置。内容物填充装置40，盖材密封装置41以及密封杯形容器的排出装置在第二输送机3上依次安装灭菌和洗涤，同时用第一输送机2输送容器。经洗涤的容器翻转并从第一输送机转移到第二输送机3，在第二输送机上进行盖密封。

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