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1. 发明授权

US07091733B2 Reliability evaluation test apparatus, reliability evaluation test system, contactor, and reliability evaluation test method 有权
公开(公告)号：US07091733B2
公开(公告)日：2006-08-15
申请号：US10813257
申请日：2004-03-31
申请人： Kiyoshi Takekoshi , Hisatomi Hosaka , Junichi Hagihara , Kunihiko Hatsushika , Takamasa Usui , Hisashi Kaneko , Nobuo Hayasaka , Yoshiyuki Ido
发明人： Kiyoshi Takekoshi , Hisatomi Hosaka , Junichi Hagihara , Kunihiko Hatsushika , Takamasa Usui , Hisashi Kaneko , Nobuo Hayasaka , Yoshiyuki Ido
IPC分类号： G01R31/02
CPC分类号： G01R31/2862 , G01R1/0433 , G01R1/0491 , G01R31/2831 , G01R31/286 , G01R31/2865 , G01R31/2867 , G01R31/287 , G01R31/2886
摘要： A reliability evaluation test apparatus of this invention includes a wafer storage section which stores a wafer in a state wherein the electrode pads of a number of devices formed on the wafer and the bumps of a contactor are totally in electrical contact with each other. The wafer storage section transmits/receives a test signal to/from a measurement section and has a hermetic and heat insulating structure. The wafer storage section has a pressure mechanism which presses the contactor and a heating mechanism which directly heats the wafer totally in contact with the contactor to a predetermined high temperature. The reliability of an interconnection film and insulating film formed on the semiconductor wafer are evaluated under an accelerated condition.

2. 发明申请

US20080018355A1 RELIABILITY EVALUATION TEST APPARATUS, RELIABILITY EVALUATION TEST SYSTEM, CONTACTOR, AND RELIABILITY EVALUATION TEST METHOD 失效
标题翻译：可靠性评估测试仪器，可靠性评估测试系统，接触器和可靠性评估测试方法
公开(公告)号：US20080018355A1
公开(公告)日：2008-01-24
申请号：US11769432
申请日：2007-06-27
申请人： Kiyoshi TAKEKOSHI , Hisatomi Hosaka , Junichi Hagihara , Kunihiko Hatsushika , Takamasa Usui , Hisashi Kaneko , Nobuo Hayasaka , Yoshiyuki Ido
发明人： Kiyoshi TAKEKOSHI , Hisatomi Hosaka , Junichi Hagihara , Kunihiko Hatsushika , Takamasa Usui , Hisashi Kaneko , Nobuo Hayasaka , Yoshiyuki Ido
IPC分类号： G01R31/26
CPC分类号： G01R31/2862 , G01R1/0433 , G01R1/0491 , G01R31/2831 , G01R31/286 , G01R31/2865 , G01R31/2867 , G01R31/287 , G01R31/2886
摘要： A reliability evaluation test apparatus of this invention includes a wafer storage section which stores a wafer in a state wherein the electrode pads of a number of devices formed on the wafer and the bumps of a contactor are totally in electrical contact with each other. The wafer storage section transmits/receives a test signal to/from a measurement section and has a hermetic and heat insulating structure. The wafer storage section has a pressure mechanism which presses the contactor and a heating mechanism which directly heats the wafer totally in contact with the contactor to a predetermined high temperature. The reliability of an interconnection film and insulating film formed on the semiconductor wafer are evaluated under an accelerated condition.
摘要翻译：本发明的可靠性评价试验装置包括晶片存储部，其以形成在晶片上的多个器件的电极焊盘和接触器的凸块完全电接触的状态存储晶片。晶片存储部分向/从测量部分发送/接收测试信号，并具有密封和隔热结构。晶片存储部分具有压力接触器的压力机构和将与接触器完全接触的晶片直接加热到预定高温的加热机构。在加速条件下评估形成在半导体晶片上的互连膜和绝缘膜的可靠性。

3. 发明授权

US08456186B2 Reliability evaluation test apparatus, reliability evaluation test system, contactor, and reliability evaluation test method 失效
标题翻译：可靠性评估试验装置，可靠性评价试验系统，接触器和可靠性评价试验方法
公开(公告)号：US08456186B2
公开(公告)日：2013-06-04
申请号：US11769432
申请日：2007-06-27
申请人： Kiyoshi Takekoshi , Hisatomi Hosaka , Junichi Hagihara , Kunihiko Hatsushika , Takamasa Usui , Hisashi Kaneko , Nobuo Hayasaka , Yoshiyuki Ido
发明人： Kiyoshi Takekoshi , Hisatomi Hosaka , Junichi Hagihara , Kunihiko Hatsushika , Takamasa Usui , Hisashi Kaneko , Nobuo Hayasaka , Yoshiyuki Ido
IPC分类号： G01R31/02 , G01R31/00
CPC分类号： G01R31/2862 , G01R1/0433 , G01R1/0491 , G01R31/2831 , G01R31/286 , G01R31/2865 , G01R31/2867 , G01R31/287 , G01R31/2886
摘要： A reliability evaluation test apparatus of this invention includes a wafer storage section which stores a wafer in a state wherein the electrode pads of a number of devices formed on the wafer and the bumps of a contactor are totally in electrical contact with each other. The wafer storage section transmits/receives a test signal to/from a measurement section and has a hermetic and heat insulating structure. The wafer storage section has a pressure mechanism which presses the contactor and a heating mechanism which directly heats the wafer totally in contact with the contactor to a predetermined high temperature. The reliability of an interconnection film and insulating film formed on the semiconductor wafer are evaluated under an accelerated condition.
摘要翻译：本发明的可靠性评价试验装置包括晶片存储部，其以形成在晶片上的多个器件的电极焊盘和接触器的凸块完全电接触的状态存储晶片。晶片存储部分向/从测量部分发送/接收测试信号，并具有密封和隔热结构。晶片存储部分具有压力接触器的压力机构和将与接触器完全接触的晶片直接加热到预定高温的加热机构。在加速条件下评估形成在半导体晶片上的互连膜和绝缘膜的可靠性。

4. 发明申请

US20050253575A1 Reliability evaluation test apparatus, reliability evaluation test system, contactor, and reliability evaluation test method 有权
标题翻译：可靠性评估试验装置，可靠性评价试验系统，接触器和可靠性评价试验方法
公开(公告)号：US20050253575A1
公开(公告)日：2005-11-17
申请号：US11179538
申请日：2005-07-13
申请人： Kiyoshi Takekoshi , Hisatomi Hosaka , Junichi Hagihara , Kunihiko Hatsushika , Takamasa Usui , Hisashi Kaneko , Nobuo Hayasaka , Yoshiyuki Ido
发明人： Kiyoshi Takekoshi , Hisatomi Hosaka , Junichi Hagihara , Kunihiko Hatsushika , Takamasa Usui , Hisashi Kaneko , Nobuo Hayasaka , Yoshiyuki Ido
IPC分类号： G01R31/26 , G01R1/04 , G01R31/28 , G01R31/30 , H01L21/66
CPC分类号： G01R31/2862 , G01R1/0433 , G01R1/0491 , G01R31/2831 , G01R31/286 , G01R31/2865 , G01R31/2867 , G01R31/287 , G01R31/2886
摘要： A reliability evaluation test apparatus of this invention includes a wafer storage section which stores a wafer in a state wherein the electrode pads of a number of devices formed on the wafer and the bumps of a contactor are totally in electrical contact with each other. The wafer storage section transmits/receives a test signal to/from a measurement section and has a hermetic and heat insulating structure. The wafer storage section has a pressure mechanism which presses the contactor and a heating mechanism which directly heats the wafer totally in contact with the contactor to a predetermined high temperature. The reliability of an interconnection film and insulating film formed on the semiconductor wafer are evaluated under an accelerated condition.
摘要翻译：本发明的可靠性评价试验装置包括晶片存储部，其以形成在晶片上的多个器件的电极焊盘和接触器的凸块完全电接触的状态存储晶片。晶片存储部分向/从测量部分发送/接收测试信号，并具有密封和隔热结构。晶片存储部分具有压力接触器的压力机构和将与接触器完全接触的晶片直接加热到预定高温的加热机构。在加速条件下评估形成在半导体晶片上的互连膜和绝缘膜的可靠性。

5. 发明授权

US07242206B2 Reliability evaluation test apparatus, reliability evaluation test system, contactor, and reliability evaluation test method 有权
标题翻译：可靠性评估试验装置，可靠性评价试验系统，接触器和可靠性评价试验方法
公开(公告)号：US07242206B2
公开(公告)日：2007-07-10
申请号：US11179538
申请日：2005-07-13
申请人： Kiyoshi Takekoshi , Hisatomi Hosaka , Junichi Hagihara , Kunihiko Hatsushika , Takamasa Usui , Hisashi Kaneko , Nobuo Hayasaka , Yoshiyuki Ido
发明人： Kiyoshi Takekoshi , Hisatomi Hosaka , Junichi Hagihara , Kunihiko Hatsushika , Takamasa Usui , Hisashi Kaneko , Nobuo Hayasaka , Yoshiyuki Ido
IPC分类号： G01R31/06 , G01R31/04 , G01R27/26
CPC分类号： G01R31/2862 , G01R1/0433 , G01R1/0491 , G01R31/2831 , G01R31/286 , G01R31/2865 , G01R31/2867 , G01R31/287 , G01R31/2886
摘要： A reliability evaluation test apparatus of this invention includes a wafer storage section which stores a wafer in a state wherein the electrode pads of a number of devices formed on the wafer and the bumps of a contactor are totally in electrical contact with each other. The wafer storage section transmits/receives a test signal to/from a measurement section and has a hermetic and heat insulating structure. The wafer storage section has a pressure mechanism which presses the contactor and a heating mechanism which directly heats the wafer totally in contact with the contactor to a predetermined high temperature. The reliability of an interconnection film and insulating film formed on the semiconductor wafer are evaluated under an accelerated condition.
摘要翻译：本发明的可靠性评价试验装置包括晶片存储部，其以形成在晶片上的多个器件的电极焊盘和接触器的凸块完全电接触的状态存储晶片。晶片存储部分向/从测量部分发送/接收测试信号，并具有密封和隔热结构。晶片存储部分具有压力接触器的压力机构和将与接触器完全接触的晶片直接加热到预定高温的加热机构。在加速条件下评估形成在半导体晶片上的互连膜和绝缘膜的可靠性。

6. 发明授权

US07256592B2 Probe with trapezoidal contractor and device based on application thereof, and method of producing them 失效
标题翻译：基于应用的梯形承包商和装置的探头及其制造方法
公开(公告)号：US07256592B2
公开(公告)日：2007-08-14
申请号：US10502099
申请日：2002-12-11
申请人： Hisatomi Hosaka , Kiyoshi Takekoshi
发明人： Hisatomi Hosaka , Kiyoshi Takekoshi
IPC分类号： G01R31/02
CPC分类号： G01R1/06738 , G01R1/06727 , G01R1/06744 , G01R1/06755 , G01R1/07342 , G01R1/0735 , G01R3/00 , Y10T29/49155 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49218 , Y10T29/49222
摘要： A probe is disclosed, comprising a beam, which has a front end, an intermediate portion and a base end. The leading end is a portion for contacting a test subject through a contactor, the base end being a portion for fixing the probe. The probe includes a substantially trapezoidal contactor, which is fixed to the leading end of the beam.
摘要翻译：公开了一种探针，其包括具有前端，中间部分和基端的梁。前端是用于通过接触器与测试对象接触的部分，基端是用于固定探针的部分。探头包括大致梯形的接触器，其被固定到梁的前端。

7. 发明申请

US20070126444A1 PROBE WITH TRAPEZOIDAL CONTACTOR AND DEVICE BASED ON APPLICATION THEREOF, AND METHOD OF PRODUCING THEM 审中-公开
公开(公告)号：US20070126444A1
公开(公告)日：2007-06-07
申请号：US11671369
申请日：2007-02-05
申请人： Hisatomi Hosaka , Kiyoshi Takekoshi
发明人： Hisatomi Hosaka , Kiyoshi Takekoshi
IPC分类号： G01R31/02
CPC分类号： G01R1/06738 , G01R1/06727 , G01R1/06744 , G01R1/06755 , G01R1/07342 , G01R1/0735 , G01R3/00 , Y10T29/49155 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49218 , Y10T29/49222
摘要： A probe is disclosed, comprising a beam 4B, which has a front end 4b1, an intermediate portion 4b2 and a base end 4b3, the front end being a portion for contacting a test subject through a contactor, the base end being a portion for fixing the probe; and a substantially trapezoidal contactor 4A, which is fixed to the leading end 4b1 of the beam.

8. 发明申请

US20050162179A1 Probe with trapezoidal contactor and device based on application thereof, and method of producing them 失效
标题翻译：基于应用的梯形接触器和装置的探头及其制造方法
公开(公告)号：US20050162179A1
公开(公告)日：2005-07-28
申请号：US10502099
申请日：2002-12-11
申请人： Hisatomi Hosaka , Kiyoshi Takekoshi
发明人： Hisatomi Hosaka , Kiyoshi Takekoshi
IPC分类号： G01R31/26 , G01R1/067 , G01R1/073 , G01R3/00 , H01L21/66 , G01R31/02
CPC分类号： G01R1/06738 , G01R1/06727 , G01R1/06744 , G01R1/06755 , G01R1/07342 , G01R1/0735 , G01R3/00 , Y10T29/49155 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49218 , Y10T29/49222
摘要： A probe is disclosed, comprising a beam 4B, which has a front end 4b1, an intermediate portion 4b2 and a base end 4b3, the front end being a portion for contacting a test subject through a contactor, the base end being a portion for fixing the probe; and a substantially trapezoidal contactor 4A, which is fixed to the leading end 4b1 of the beam.
摘要翻译：公开了一种探针，其包括具有前端部4b 1，中间部分4 b 2和基端部4 b 3的梁4B，前端是用于通过接触器接触测试对象的部分，基端是用于固定探针的部分; 以及大致梯形的接触器4A，其固定在梁的前端部4b 1上。

9. 发明授权

US07621045B2 Method of producing a probe with a trapezoidal contactor 失效
标题翻译：用梯形接触器生产探头的方法
公开(公告)号：US07621045B2
公开(公告)日：2009-11-24
申请号：US11671346
申请日：2007-02-05
申请人： Hisatomi Hosaka , Kiyoshi Takekoshi
发明人： Hisatomi Hosaka , Kiyoshi Takekoshi
IPC分类号： H01R43/04
CPC分类号： G01R1/06738 , G01R1/06727 , G01R1/06744 , G01R1/06755 , G01R1/07342 , G01R1/0735 , G01R3/00 , Y10T29/49155 , Y10T29/49204 , Y10T29/49208 , Y10T29/49213 , Y10T29/49218 , Y10T29/49222
摘要： A probe is disclosed, comprising a beam 4B, which has a front end 4b1, an intermediate portion 4b2 and a base end 4b3, the front end being a portion for contacting a test subject through a contactor, the base end being a portion for fixing the probe; and a substantially trapezoidal contactor 4A, which is fixed to the leading end 4b1 of the beam.
摘要翻译：公开了一种探针，其包括具有前端4b1，中间部4b2和基端4b3的梁4B，前端是用于通过接触器接触测试对象的部分，基端是用于固定的部分探针; 以及固定在梁的前端4b1上的大致梯形的接触器4A。

10. 发明申请

US20070290699A1 Probe card 失效
标题翻译：探针卡
公开(公告)号：US20070290699A1
公开(公告)日：2007-12-20
申请号：US11710223
申请日：2007-02-23
申请人： Jun Mochizuki , Hisatomi Hosaka
发明人： Jun Mochizuki , Hisatomi Hosaka
IPC分类号： G01R1/067
CPC分类号： G01R1/07371 , G01R1/06733 , H01L2924/00013 , Y10T29/49204 , H01L2224/29099
摘要： The present invention provides a probe card that can examine an object with small electrode spacing. A probe supporting plate is provided to a lower face side of a printed wiring board of a probe card. A plurality of probes are supported by the probe supporting plate. The probes comprise an upper contact, a lower contact, and a main body portion. An upper end portion of the upper contact protrudes toward an upper side of the probe supporting plate and contacts a terminal of the printed wiring board. A lower end portion of the lower contact protrudes toward a lower side of the probe supporting plate. On the probe supporting plate, a through-hole and a concave portion are formed to lock the probes, and the probes can be inserted and removed freely against the probe supporting plate from above.
摘要翻译：本发明提供一种可以检查具有小电极间距的物体的探针卡。探针支撑板设置在探针卡的印刷电路板的下表面侧。多个探针由探针支撑板支撑。探针包括上触点，下触点和主体部分。上接触件的上端部朝向探针支撑板的上侧突出并与印刷线路板的端子接触。下接触件的下端部朝向探针支撑板的下侧突出。在探针支撑板上形成通孔和凹部来锁定探针，并且可以从上方将探针自由地插入和移除探针支撑板。

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