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1. 发明授权

US08405205B2 Power semiconductor module 有权
标题翻译：功率半导体模块
公开(公告)号：US08405205B2
公开(公告)日：2013-03-26
申请号：US13067607
申请日：2011-06-14
申请人： Kiyoshi Takahashi , Souichi Okita
发明人： Kiyoshi Takahashi , Souichi Okita
IPC分类号： H01L29/739
CPC分类号： H02M7/003 , H01L23/049 , H01L23/4006 , H01L25/072 , H01L2924/0002 , H01L2924/13055 , H01L2924/00
摘要： A power semiconductor module includes a plurality of sets of semiconductor switching elements, a molded resin casing containing the semiconductor switching elements, screw holders for receiving mounting screws formed at bottom regions of four corners of the molded resin casing, first terminal blocks having main circuit terminals, and arranged on a central region of a top surface of the molded resin casing, and second terminal blocks having control terminals arranged at a side edge of the molded resin casing apart. Insulating separation walls having a configuration of a rib erect from a surface of the second terminal blocks, and are interposed between groups of the control terminals corresponding to the sets of semiconductor switching elements, and between the screw holder including the mounting screw therein on the molded resin casing and the control terminal at a high voltage side adjacent to the screw holder.
摘要翻译：功率半导体模块包括多组半导体开关元件，包含半导体开关元件的模制树脂外壳，用于接收形成在模制树脂外壳的四个角的底部区域的安装螺钉的螺钉保持器，具有主电路端子并且配置在模制树脂壳体的顶表面的中心区域上，并且具有布置在模制树脂壳体的侧边缘处的控制端子的第二端子块分开。绝缘隔离壁具有从第二端子块的表面直立的肋的构造，并且插入到对应于该组半导体开关元件的控制端子的组之间，并且在包括其中的安装螺钉的螺钉保持器之间插入模制树脂壳体和控制端子在与螺钉保持器相邻的高压侧。

2. 发明申请

US20120001227A1 Power semiconductor module 有权
标题翻译：功率半导体模块
公开(公告)号：US20120001227A1
公开(公告)日：2012-01-05
申请号：US13067607
申请日：2011-06-14
申请人： Kiyoshi Takahashi , Souichi Okita
发明人： Kiyoshi Takahashi , Souichi Okita
IPC分类号： H01L29/739
CPC分类号： H02M7/003 , H01L23/049 , H01L23/4006 , H01L25/072 , H01L2924/0002 , H01L2924/13055 , H01L2924/00
摘要： A power semiconductor module includes a plurality of sets of semiconductor switching elements, a molded resin casing containing the semiconductor switching elements, screw holders for receiving mounting screws formed at bottom regions of four corners of the molded resin casing, first terminal blocks having main circuit terminals, and arranged on a central region of a top surface of the molded resin casing, and second terminal blocks having control terminals arranged at a side edge of the molded resin casing apart. Insulating separation walls having a configuration of a rib erect from a surface of the second terminal blocks, and are interposed between groups of the control terminals corresponding to the sets of semiconductor switching elements, and between the screw holder including the mounting screw therein on the molded resin casing and the control terminal at a high voltage side adjacent to the screw holder.
摘要翻译：功率半导体模块包括多组半导体开关元件，包含半导体开关元件的模制树脂外壳，用于接收形成在模制树脂外壳的四个角的底部区域的安装螺钉的螺钉保持器，具有主电路端子并且配置在模制树脂壳体的顶表面的中心区域上，并且具有布置在模制树脂壳体的侧边缘处的控制端子的第二端子块分开。绝缘隔离壁具有从第二端子块的表面直立的肋的构造，并且插入到对应于该组半导体开关元件的控制端子的组之间，并且在包括其中的安装螺钉的螺钉保持器之间插入模制树脂壳体和控制端子在与螺钉保持器相邻的高压侧。

3. 发明授权

US06262474B1 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US06262474B1
公开(公告)日：2001-07-17
申请号：US09301716
申请日：1999-04-29
申请人： Takatoshi Kobayashi , Souichi Okita , Rikihiro Maruyama
发明人： Takatoshi Kobayashi , Souichi Okita , Rikihiro Maruyama
IPC分类号： H01L23495
CPC分类号： H01L23/49575 , H01L24/48 , H01L24/73 , H01L25/072 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/01039 , H01L2924/1305 , H01L2924/13055 , H01L2924/30107 , H01L2924/3011 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2224/05599 , H01L2224/85399
摘要： A semiconductor device is formed of a casing, a substrate situated in the casing, at least one semiconductor chip fixed on the substrate, and at least one lead-out terminal for connecting the semiconductor chip to outside. The lead-out terminal includes a soldered portion soldered to the substrate, and a fixed portion fixed to the casing. A stress relaxing device or cutout is formed between the soldered portion and the fixed portion of the lead-out terminal to relieve stress along three axial directions orthogonal to each other. Thus, the crack formation is prevented in the soldered portion of the lead-out terminal while the resistance and impedance of the lead-out terminal are maintained at low values.
摘要翻译：半导体器件由壳体，位于壳体中的衬底，固定在衬底上的至少一个半导体芯片和用于将半导体芯片连接到外部的至少一个引出端子形成。引出端子包括焊接到基板的焊接部分和固定到壳体的固定部分。在引出端子的焊接部分和固定部分之间形成应力松弛装置或切口，以沿着彼此正交的三个轴向方向减轻应力。因此，在引出端子的电阻和阻抗保持在低值的情况下，在引出端子的焊接部分中防止了裂纹形成。

4. 发明授权

US06844621B2 Semiconductor device and method of relaxing thermal stress 有权
标题翻译：半导体器件和放热热应力的方法
公开(公告)号：US06844621B2
公开(公告)日：2005-01-18
申请号：US10640182
申请日：2003-08-13
申请人： Akira Morozumi , Yoshitaka Nishimura , Souichi Okita
发明人： Akira Morozumi , Yoshitaka Nishimura , Souichi Okita
IPC分类号： H01L23/373 , H01L23/12
CPC分类号： H01L23/3735 , H01L24/73 , H01L2224/32225 , H01L2224/45124 , H01L2224/48091 , H01L2224/48227 , H01L2224/4911 , H01L2224/73265 , H01L2924/10253 , H01L2924/13055 , H01L2924/181 , H01L2924/19107 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device has an insulating substrate with conductor patterns bonded to and formed on both the top and bottom surfaces of a ceramic substrate. Soldering is provided between the conductor pattern on the top surface side and a heat developing chip component such as a power semiconductor element is mounted thereon. Between the conductor pattern on the bottom surface side and a heat dissipating metal base plate, each of four corners of the ceramic substrate is chamfered to form a chamfered section with a chamfered dimension of 2 to 10 mm. Alternatively, slits can be formed at the four corners on the bottom surface side. Moreover, the thickness of the conductor patterns can be controlled in relation to the ceramic substrate. These configurations relax the stress concentration created in the soldered section due to a thermal cycle.
摘要翻译：半导体器件具有绝缘基板，导体图案与陶瓷基板的顶表面和底表面接合并形成。在顶表面侧的导体图案和诸如功率半导体元件的显影芯片组件之间设置焊接。在底表面侧的导体图案与散热金属基板之间，陶瓷基板的四个角中的每一个被倒角以形成倒角尺寸为2至10mm的倒角部分。或者，可以在底面侧的四个角部形成狭缝。此外，可以相对于陶瓷基板来控制导体图案的厚度。这些结构由于热循环而放松了焊接部分产生的应力集中。

5. 发明申请

US20050280490A1 Semiconductor and electronic device with spring terminal 有权
标题翻译：半导体和电子设备带弹簧端子
公开(公告)号：US20050280490A1
公开(公告)日：2005-12-22
申请号：US11148013
申请日：2005-06-08
申请人： Taku Uchiyama , Souichi Okita
发明人： Taku Uchiyama , Souichi Okita
IPC分类号： H01F27/02 , H01L23/48 , H01L25/07 , H01R13/24 , H05K1/14 , H05K3/32
CPC分类号： H01R13/2421 , H01L24/72 , H01L25/072 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2924/0102 , H01L2924/01068 , H01L2924/01078 , H01L2924/1305 , H01L2924/13055 , H01L2924/19107 , H01R12/52 , H05K1/144 , H05K3/325 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor or electronic device, such as a power module uses at least one spring terminal as a control terminal. The spring terminal is led outside a case through a coil-accommodating member, which can be a frame or removable cover. With this arrangement, the spring terminal can be arranged at an arbitrary position inside the case. The spring terminal can be joined by soldering or bonding to the electrode of an in-case substrate while being held by the frame or cover. The in-case substrate can be accessed for solder joining through at least one aperture formed in the frame.
摘要翻译：诸如功率模块的半导体或电子设备使用至少一个弹簧端子作为控制端子。弹簧端子通过可以是框架或可移除的盖的线圈容纳构件被引导到壳体外部。通过这种布置，弹簧端子可以布置在壳体内的任意位置。弹簧端子可以通过在被框架或盖子保持的同时通过焊接或粘合到内壳基板的电极来连接。可以通过形成在框架中的至少一个孔来访问内部衬底以进行焊接。

6. 发明授权

US08766331B2 Power semiconductor module 有权
标题翻译：功率半导体模块
公开(公告)号：US08766331B2
公开(公告)日：2014-07-01
申请号：US13295454
申请日：2011-11-14
申请人： Souichi Okita
发明人： Souichi Okita
IPC分类号： H01L29/66 , H01L29/739
CPC分类号： H01L29/7393 , H01L24/48 , H01L24/49 , H01L25/072 , H01L2224/0603 , H01L2224/48137 , H01L2224/48227 , H01L2224/49111 , H01L2224/49175 , H01L2924/00014 , H01L2924/01019 , H01L2924/01068 , H01L2924/1305 , H01L2924/13055 , H01L2924/30107 , H02M7/487 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： In a semiconductor module according to certain aspects the invention, a U-terminal and an M-terminal overlap each other in a manner to reduce inductance and to further to reduce the size of snubber capacitor. In certain aspects of the invention, a P-terminal, M-terminal, N-terminal, and U-terminal are arranged such that the U-terminal, through which currents flow in and out, is arranged farthest away from control electrodes to reduce the noises superposed to control electrodes, and the P-terminal, M-terminal, N-terminal, and U-terminal are aligned to facilitate attaching external connection bars thereto. A power semiconductor module according to aspects of the invention can facilitate reducing the wiring inductance inside and outside the module, reducing the electromagnetic noises introduced into the control terminals, and attaching the external wirings to the terminals thereof simply and easily.
摘要翻译：在根据本发明的某些方面的半导体模块中，U端子和M端子以降低电感并进一步减小缓冲电容器的尺寸的方式彼此重叠。在本发明的某些方面，P端子，M端子，N端子和U端子被布置成使得电流流入和流出的U端被布置在离控制电极最远的位置，以减少叠置在控制电极上的噪声，P端子，M端子，N端子和U端子对准，以便于将外部连接条连接到其上。根据本发明的功率半导体模块可以有助于减少模块内部和外部的布线电感，减少引入到控制端子中的电磁噪声，并且简单且容易地将外部布线附接到端子上。

7. 发明授权

US07187074B2 Semiconductor and electronic device with spring terminal 有权
标题翻译：半导体和电子设备带弹簧端子
公开(公告)号：US07187074B2
公开(公告)日：2007-03-06
申请号：US11148013
申请日：2005-06-08
申请人： Taku Uchiyama , Souichi Okita
发明人： Taku Uchiyama , Souichi Okita
IPC分类号： H01L23/13 , H01L23/34
CPC分类号： H01R13/2421 , H01L24/72 , H01L25/072 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2924/0102 , H01L2924/01068 , H01L2924/01078 , H01L2924/1305 , H01L2924/13055 , H01L2924/19107 , H01R12/52 , H05K1/144 , H05K3/325 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor or electronic device, such as a power module uses at least one spring terminal as a control terminal. The spring terminal is led outside a case through a coil-accommodating member, which can be a frame or removable cover. With this arrangement, the spring terminal can be arranged at an arbitrary position inside the case. The spring terminal can be joined by soldering or bonding to the electrode of an in-case substrate while being held by the frame or cover. The in-case substrate can be accessed for solder joining through at least one aperture formed in the frame.
摘要翻译：诸如功率模块的半导体或电子设备使用至少一个弹簧端子作为控制端子。弹簧端子通过可以是框架或可移除的盖的线圈容纳构件被引导到壳体外部。通过这种布置，弹簧端子可以布置在壳体内的任意位置。弹簧端子可以通过在被框架或盖子保持的同时通过焊接或粘合到内壳基板的电极来连接。可以通过形成在框架中的至少一个孔来访问内部衬底以进行焊接。

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