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    • 1. 发明授权
    • Epoxy-acrylate blend pressure-sensitive thermosetting adhesives
    • 环氧丙烯酸酯共混物压敏热固性粘合剂
    • US5086088A
    • 1992-02-04
    • US632029
    • 1990-12-21
    • Shuichi KitanoKiyoshi OgataShinobu Sato
    • Shuichi KitanoKiyoshi OgataShinobu Sato
    • C08F2/46C08F283/10
    • C08F283/10
    • The invention relates to a pressure-sensitive thermosetting adhesive comprising from about 30% to about 80% by weight of a photopolymerizable prepolymeric or monomeric syrup containing an acrylic ester and a polar copolymerizable monomer, from about 20% to about 60% by weight of an epoxy resin or a mixture of epoxy resins containing no photopolymerizable groups, from about 0.5% to about 10% by weight of a heat-activatable hardener for the epoxy resin, from about 0.01% to about 5% of a photoinitiator, and from 0% to about 5% of a photocrosslinking agent. In a preferred embodiment, imidazoles and thermally expandable thermoplastic microspheres are utilized in the inventive adhesive formulation.
    • 本发明涉及一种压敏热固性粘合剂,其包含约30重量%至约80重量%的含有丙烯酸酯和极性可共聚单体的可光聚合的预聚物或单体糖浆,约20重量%至约60重量% 环氧树脂或不含光聚合基团的环氧树脂的混合物,约0.5重量%至约10重量%的可热活化的环氧树脂固化剂,约0.01%至约5%的光引发剂和0% 至约5%的光交联剂。 在优选的实施方案中,咪唑和热可发性热塑性微球用于本发明的粘合剂制剂中。