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1. 发明申请

US20080081275A1 Process for Producing Resin-Coated Metal Particles, Resin-Coated Metal Particles, and Toner for Forming Circuit 有权
标题翻译：用于生产树脂涂覆的金属颗粒，树脂涂覆的金属颗粒和用于成型电路的调色剂的方法
公开(公告)号：US20080081275A1
公开(公告)日：2008-04-03
申请号：US10575662
申请日：2004-09-15
申请人： Kiyoko Ueda , Ichiro Nakamura , Kiyoyasu Sakurada
发明人： Kiyoko Ueda , Ichiro Nakamura , Kiyoyasu Sakurada
IPC分类号： G03G5/00 , G03G9/00
CPC分类号： H05K3/102 , C08F292/00 , H05K2201/0224 , Y10T428/29 , Y10T428/2982
摘要： A process for producing resin-coated metal particles includes coating surfaces of metal particles with silica; allowing a polymerizable group to adsorb onto the surfaces of the silica-coated particles by the use of a silane coupling agent; and coating the surfaces of the silica-coated particles with a polymeric resin by mixing the particles to which the polymerizable groups have been adsorbed, a polymerizable monomer, a polymerization initiator, and a dispersant to polymerize the polymerizable monomer and the polymerizable groups.
摘要翻译：制造树脂涂覆的金属颗粒的方法包括用二氧化硅涂覆金属颗粒的表面; 使可聚合基团通过使用硅烷偶联剂吸附在二氧化硅被覆颗粒的表面上; 并且通过混合吸附有可聚合基团的颗粒，可聚合单体，聚合引发剂和分散剂，用聚合物树脂涂覆二氧化硅涂覆的颗粒的表面以聚合可聚合单体和可聚合基团。

2. 发明授权

US08053073B2 Process for producing resin-coated metal particles, resin-coated metal particles, and toner for forming circuit 有权
标题翻译：用于生产树脂涂覆的金属颗粒，树脂涂覆的金属颗粒和用于形成电路的调色剂的方法
公开(公告)号：US08053073B2
公开(公告)日：2011-11-08
申请号：US10575662
申请日：2004-09-15
申请人： Kiyoko Ueda , Ichiro Nakamura , Kiyoyasu Sakurada
发明人： Kiyoko Ueda , Ichiro Nakamura , Kiyoyasu Sakurada
IPC分类号： G03G5/00
CPC分类号： H05K3/102 , C08F292/00 , H05K2201/0224 , Y10T428/29 , Y10T428/2982
摘要： A process for producing resin-coated metal particles includes coating surfaces of metal particles with silica; allowing a polymerizable group to adsorb onto the surfaces of the silica-coated particles by the use of a silane coupling agent; and coating the surfaces of the silica-coated particles with a polymeric resin by mixing the particles to which the polymerizable groups have been adsorbed, a polymerizable monomer, a polymerization initiator, and a dispersant to polymerize the polymerizable monomer and the polymerizable groups.
摘要翻译：制造树脂涂覆的金属颗粒的方法包括用二氧化硅涂覆金属颗粒的表面; 使可聚合基团通过使用硅烷偶联剂吸附在二氧化硅被覆颗粒的表面上; 并且通过混合吸附有可聚合基团的颗粒，可聚合单体，聚合引发剂和分散剂，用聚合物树脂涂覆二氧化硅涂覆的颗粒的表面以聚合可聚合单体和可聚合基团。

3. 发明授权

US09490055B2 Ceramic electronic component and manufacturing method thereof 有权
标题翻译：陶瓷电子部件及其制造方法
公开(公告)号：US09490055B2
公开(公告)日：2016-11-08
申请号：US13287255
申请日：2011-11-02
申请人： Kota Zenzai , Hisayoshi Omori , Takashi Kanayama , Kiyoyasu Sakurada , Naoki Shimizu , Seiji Katsuta , Shinji Otani
发明人： Kota Zenzai , Hisayoshi Omori , Takashi Kanayama , Kiyoyasu Sakurada , Naoki Shimizu , Seiji Katsuta , Shinji Otani
IPC分类号： H01F5/00 , H01F27/28 , H01F17/00 , H01G4/12 , H01G4/005 , H01F27/29
CPC分类号： H01G4/30 , H01F17/0013 , H01F27/292 , H01G4/005 , H01G4/008 , H01G4/012 , H01G4/12 , H01G4/248 , Y10T29/49002
摘要： A ceramic electronic component includes a ceramic body, an inner electrode, an outer electrode, and a connecting portion. The inner electrode is disposed inside the ceramic body. The end portion of the inner electrode extends to a surface of the ceramic body. The outer electrode is disposed on the surface of the ceramic body so as to cover the end portion of the inner electrode. The outer electrode includes a resin and a metal. The connecting portion is disposed so as to extend from an inside of the outer electrode to an inside of the ceramic body. In a portion of the surface of the ceramic body on which the outer electrode is disposed, the length of the connecting portion that extends in a direction in which the inner electrode is extends about 2.4 μm or more.
摘要翻译：陶瓷电子部件包括陶瓷体，内电极，外电极和连接部。内部电极设置在陶瓷体的内部。内部电极的端部延伸到陶瓷体的表面。外部电极设置在陶瓷体的表面上以覆盖内部电极的端部。外部电极包括树脂和金属。连接部被配置成从外部电极的内部延伸到陶瓷体的内部。在设置有外部电极的陶瓷体的表面的一部分中，连接部的在内部电极的延伸方向上延伸约2.4μm以上的长度。

4. 发明申请

US20110299221A1 Chip-Type Electronic Component 有权
标题翻译：片式电子元件
公开(公告)号：US20110299221A1
公开(公告)日：2011-12-08
申请号：US13150537
申请日：2011-06-01
申请人： Katsuaki Higashi , Koji Matsushita , Kiyoyasu Sakurada
发明人： Katsuaki Higashi , Koji Matsushita , Kiyoyasu Sakurada
IPC分类号： H01G4/008
CPC分类号： H01G4/2325 , H01C1/142 , H01C7/18 , H01G4/30
摘要： A chip-type electronic component with high reliability, which is able to suppress and prevent fatal damage to a ceramic body due to cracking even if a substrate with the chip-type electronic component mounted thereon undergoes a deflection. The chip-type electronic component includes a ceramic body having internal electrodes; resin electrode layers formed in a region including at least end surfaces of the ceramic body, and connected to the internal electrodes directly or indirectly and connected with the ceramic body; and plating metal layers covering the resin electrode layers, wherein the adhesion strength between the ceramic body and the resin electrode layer is higher than the adhesion strength between the resin electrode layer and the plating metal layer.
摘要翻译：具有高可靠性的芯片型电子部件，即使安装有芯片型电子部件的基板发生偏转，也能够抑制和防止由于开裂导致的陶瓷体的致命损坏。芯片型电子部件包括具有内部电极的陶瓷体; 形成在至少包含陶瓷体的端面的区域中的树脂电极层，并且与内部电极直接或间接连接并与陶瓷体连接; 以及覆盖树脂电极层的金属层，其中陶瓷体和树脂电极层之间的粘合强度高于树脂电极层和电镀金属层之间的粘附强度。

5. 发明授权

US09013859B2 Laminated electronic component and manufacturing method therefor 有权
标题翻译：层压电子部件及其制造方法
公开(公告)号：US09013859B2
公开(公告)日：2015-04-21
申请号：US13020886
申请日：2011-02-04
申请人： Masahito Saruban , Makoto Ogawa , Akihiro Motoki , Syunsuke Takeuchi , Kiyoyasu Sakurada
发明人： Masahito Saruban , Makoto Ogawa , Akihiro Motoki , Syunsuke Takeuchi , Kiyoyasu Sakurada
IPC分类号： H01G4/228 , H01G4/06 , H01G4/30 , H01G4/005 , H01G13/00 , H01F17/00 , H01L41/293
CPC分类号： H01G4/30 , H01F17/0013 , H01G4/005 , H01G13/00 , H01L41/293
摘要： A method for manufacturing a laminated electronic component in which, when first plating layers that respectively connect a plurality of internal electrodes to each other and second plating layers that improves the mountability of a laminated electronic component are formed as external terminal electrodes, the entire component main body is treated with a water repellent agent after the formation of the first plating layers, and the water repellent agent on the first plating layers is then removed before the formation of the second plating layers. The gaps between the end edges of the first plating films on the outer surface of the component main body and the outer surface of the component main body are filled with the water repellent agent.
摘要翻译：一种层叠电子部件的制造方法，其中，当分别连接多个内部电极彼此连接的第一镀层和提高层压电子部件的安装性的第二镀层形成为外部端子电极时，整个部件主体在形成第一镀层之后，用防水剂处理体，然后在形成第二镀层之前去除第一镀层上的防水剂。在组件主体的外表面上的第一镀膜的端缘与部件主体的外表面之间的间隙填充有防水剂。

6. 发明授权

US08553391B2 Electronic component 有权
标题翻译：电子元器件
公开(公告)号：US08553391B2
公开(公告)日：2013-10-08
申请号：US13233412
申请日：2011-09-15
申请人： Syunsuke Takeuchi , Kiyoyasu Sakurada
发明人： Syunsuke Takeuchi , Kiyoyasu Sakurada
IPC分类号： H01G4/06
CPC分类号： H01G4/08 , H01G4/012 , H01G4/2325 , H01G4/30
摘要： In an electronic component, a laminate includes a plurality of laminated ceramic layers and a mounting surface defined by outer edges of the plurality of laminated ceramic layers, the outer edges being continuously located adjacent to each other. Capacitor conductors are disposed on the ceramic layers and include exposed portions that are exposed at the mounting surface between the ceramic layers. An electroconductive layer defining an external electrode is arranged to directly cover the exposed portions and is formed by plating so as to be made of plated material. Another electroconductive layer covers the above-mentioned electroconductive layer and partially covers surfaces of the laminate, and it is made of a material including metal and one of glass and resin.
摘要翻译：在电子部件中，层压体包括多个层叠陶瓷层和由多个层叠陶瓷层的外边缘限定的安装面，外边缘彼此相邻地连续定位。电容器导体设置在陶瓷层上，并且包括露出在陶瓷层之间的安装表面的暴露部分。限定外部电极的导电层被布置成直接覆盖暴露部分，并且通过电镀形成以由电镀材料制成。另一导电层覆盖上述导电层并且部分覆盖层压体的表面，并且由包括金属和玻璃和树脂之一的材料制成。

7. 发明授权

US09202640B2 Ceramic electronic component and manufacturing method thereof 有权
标题翻译：陶瓷电子部件及其制造方法
公开(公告)号：US09202640B2
公开(公告)日：2015-12-01
申请号：US13287276
申请日：2011-11-02
申请人： Kota Zenzai , Hisayoshi Omori , Takashi Kanayama , Kiyoyasu Sakurada , Naoki Shimizu , Seiji Katsuta , Shinji Otani
发明人： Kota Zenzai , Hisayoshi Omori , Takashi Kanayama , Kiyoyasu Sakurada , Naoki Shimizu , Seiji Katsuta , Shinji Otani
IPC分类号： H01G4/005 , H01G4/228 , H01G4/06 , H01G13/00 , H01G4/12
CPC分类号： H01G4/30 , H01G4/005 , H01G4/012 , H01G4/12 , H01G4/248 , H01G4/252 , H01G13/006 , H05K3/1283 , H05K3/4664
摘要： A ceramic body includes an inner electrode disposed inside the ceramic body and in which an end portion of the inner electrode extends to a surface of the ceramic body. An electrode layer is formed on the surface of the ceramic body so as to cover the end portion of the inner electrode, the electrode layer including a resin, a first metal filler that contains a first metal component, and a second metal filler that contains a second metal component having a higher melting point than the first metal component. A step of heating the electrode layer is performed to form an electrode including a metal layer that is located on the surface of the ceramic body and that includes the first and second metal components and a metal contained in the inner electrode.
摘要翻译：陶瓷体包括设置在陶瓷体内部的内部电极，内部电极的端部延伸到陶瓷体的表面。在陶瓷体的表面上形成电极层，以覆盖内部电极的端部，包括树脂的电极层，含有第一金属成分的第一金属填料和含有第一金属成分的第二金属填料具有比第一金属成分高的熔点的第二金属成分。执行加热电极层的步骤，以形成包括位于陶瓷体表面上并且包括第一和第二金属成分的金属层和包含在内部电极中的金属的电极。

8. 发明申请

US20090021443A1 DIELECTRIC ANTENNA 有权
标题翻译：电介质天线
公开(公告)号：US20090021443A1
公开(公告)日：2009-01-22
申请号：US10585672
申请日：2005-02-17
申请人： Kiyoyasu Sakurada
发明人： Kiyoyasu Sakurada
IPC分类号： H01Q1/38
CPC分类号： H01Q9/0421 , H01Q1/38
摘要： A dielectric antenna is provided which uses a compounded material and exhibits a small change in relative dielectric constant at room temperature against a load due to temperature changes. The dielectric antenna includes a dielectric block, a radiation electrode, a feeding electrode and a fixing electrode provided on the dielectric block. The dielectric block contains a crystalline thermoplastic resin, ceramic powder, and an acid-modified styrenic thermoplastic elastomer. The acid-modified styrenic thermoplastic elastomer content in the dielectric block is 3% to 20% by volume.
摘要翻译：提供一种电介质天线，其使用复合材料，并且在室温下相对于由于温度变化引起的负载具有小的相对介电常数的变化。电介质天线包括介质块，辐射电极，馈电电极和设置在介质块上的固定电极。介电块包含结晶热塑性树脂，陶瓷粉末和酸改性苯乙烯类热塑性弹性体。介电块中的酸改性苯乙烯类热塑性弹性体含量为3〜20体积％。

9. 发明授权

US07088309B2 Lens antenna 有权
公开(公告)号：US07088309B2
公开(公告)日：2006-08-08
申请号：US10188023
申请日：2002-07-01
申请人： Kiyoyasu Sakurada , Hiroshi Nongaki
发明人： Kiyoyasu Sakurada , Hiroshi Nongaki
IPC分类号： H01Q15/08
CPC分类号： H01Q19/08 , H01Q15/08
摘要： A lens antenna including a lens body and/or a matching layer. In the lens antenna, lens body may be formed by a material containing thermoplastic elastomers. When a matching layer is formed on the surface of the lens body, at least one of the lens body and the matching layer is formed by a material containing thermoplastic elastomers. The use of thermoplastic elastomers in the lens body and/or the matching layer assist in reducing the formation of cracks therein.

10. 发明授权

US06489928B2 Composite dielectric molded product and lens antenna using the same 有权
公开(公告)号：US06489928B2
公开(公告)日：2002-12-03
申请号：US09978745
申请日：2001-10-17
申请人： Kiyoyasu Sakurada
发明人： Kiyoyasu Sakurada
IPC分类号： H01Q1906
CPC分类号： H01B3/30 , H01B3/12 , H01Q15/08 , H01Q15/10 , H01Q19/08 , Y10T428/24917
摘要： Provided is a composite dielectric molded product exhibiting excellent properties such as the antenna gain and side lobe, etc. when used for a lens antenna, and exhibiting less variation of properties in one individual product and between individual products. The composite dielectric molded product is formed by molding a composite dielectric material containing a dielectric inorganic filler and an organic polymer material so that the dielectric constant anisotropy is in the range of about 1.00 to 1.05.

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