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    • 2. 发明申请
    • NONVOLATILE SEMICONDUCTOR MEMORY
    • 非易失性半导体存储器
    • US20100127320A1
    • 2010-05-27
    • US12618058
    • 2009-11-13
    • Kiyohito NishiharaFumitaka Arai
    • Kiyohito NishiharaFumitaka Arai
    • H01L29/792
    • H01L29/42336H01L21/764H01L27/11521H01L27/11524H01L29/7881
    • Two diffusion layers are provided in an element area. A tunnel insulating film is provided on the surface of the element area between the two diffusion layers. A charge storage layer is provided on the tunnel insulating film. A first insulator provided on the upper surface of the charge storage layer. An inter-electrode insulating film provided on the first insulator, on the side surface of the charge storage layer in a first direction and on the isolation insulating film. And a control gate electrode extends in the first direction and covers the charge storage layer via the first insulator and the inter-electrode insulating film. The first insulator is thicker than the inter-electrode insulating film, and the inter-electrode insulating film has a first slit on the first insulator.
    • 在元件区域中设置两个扩散层。 隧道绝缘膜设置在两个扩散层之间的元件区域的表面上。 电荷存储层设置在隧道绝缘膜上。 设置在电荷存储层的上表面上的第一绝缘体。 一种电极间绝缘膜,设置在第一绝缘体上,在电荷存储层的第一方向的侧表面上以及隔离绝缘膜上。 并且控制栅极电极沿第一方向延伸并且经由第一绝缘体和电极间绝缘膜覆盖电荷存储层。 第一绝缘体比电极间绝缘膜厚,并且电极间绝缘膜在第一绝缘体上具有第一狭缝。
    • 5. 发明授权
    • Non-volatile semiconductor storage device and method of manufacturing the same
    • 非易失性半导体存储装置及其制造方法
    • US08072025B2
    • 2011-12-06
    • US12244174
    • 2008-10-02
    • Kiyohito NishiharaFumitaka Arai
    • Kiyohito NishiharaFumitaka Arai
    • H01L29/792
    • H01L27/1203H01L27/11565H01L27/11568H01L27/11578H01L27/11582H01L29/792H01L29/7926
    • A first lamination part includes: a charge accumulation layer provided on the respective sidewalls of laminated first conductive layers and accumulating charges; and a first semiconductor layer provided in contact with the fourth insulation layer and formed to extend to the lamination direction. A second lamination part includes a second semiconductor layer provided in contact with the first semiconductor layer. A third lamination part includes: a plurality of first contact layers formed in contact with the respective second lamination part, extending to a first direction perpendicular to the lamination direction, and in line with each other along a second direction perpendicular to the first direction; and a plurality of contact plug layers formed in contact with any one of the first contact layers and extending to the lamination direction. The contact plug layers are arranged at different positions relative to each other in the first direction.
    • 第一层压部件包括:电荷累积层,设置在层叠的第一导电层的各个侧壁上并积累电荷; 以及第一半导体层,设置成与所述第四绝缘层接触并形成为向层叠方向延伸。 第二层压部件包括与第一半导体层接触设置的第二半导体层。 第三层压部件包括:多个第一接触层,其形成为与相应的第二层压部分接触,延伸到垂直于层叠方向的第一方向,并且沿着垂直于第一方向的第二方向彼此成直线; 以及多个接触塞层,其形成为与所述第一接触层中的任一个接触并延伸到层叠方向。 接触塞层在第一方向上相对于彼此设置在不同的位置。
    • 7. 发明授权
    • Non-volatile semiconductor storage device
    • 非易失性半导体存储器件
    • US07781807B2
    • 2010-08-24
    • US11947008
    • 2007-11-29
    • Kiyohito NishiharaFumitaka Arai
    • Kiyohito NishiharaFumitaka Arai
    • H01L29/80
    • H01L27/0688H01L21/8221H01L27/115H01L27/11521H01L27/11524H01L27/11551
    • A three-dimensional non-volatile semiconductor storage device which realizes both increased packing density and improved performance is disclosed. According to one aspect, there is provided a non-volatile semiconductor storage device comprising a first non-volatile memory cell provided on a first insulator, which includes a first semiconductor layer, and a first gate stack provided above the first semiconductor layer and including a first charge storage layer and a first control gate electrode, and a second non-volatile memory cell provided above the first non-volatile memory cell, which includes a second semiconductor layer, and a second gate stack provided above the second semiconductor layer and including a second charge storage layer and a second control gate electrode, the second gate stack being positioned to be aligned with the first gate stack, and wherein the first control gate electrode functions as a back gate electrode to the second non-volatile memory cell.
    • 公开了一种三维非易失性半导体存储装置,其实现了增加的封装密度和改进的性能。 根据一个方面,提供了一种非易失性半导体存储装置,包括设置在第一绝缘体上的第一非易失性存储单元,第一绝缘体包括第一半导体层,以及设置在第一半导体层上方的第一栅极堆叠, 第一电荷存储层和第一控制栅电极,以及设置在第一非易失性存储单元上方的第二非易失性存储单元,其包括第二半导体层,以及设置在第二半导体层上方的第二栅极堆叠, 第二电荷存储层和第二控制栅电极,第二栅极堆叠被定位成与第一栅极堆叠对准,并且其中第一控制栅电极用作到第二非易失性存储单元的背栅电极。
    • 8. 发明授权
    • Nonvolatile semiconductor flash memory
    • 非易失性半导体闪存
    • US08212308B2
    • 2012-07-03
    • US12618058
    • 2009-11-13
    • Kiyohito NishiharaFumitaka Arai
    • Kiyohito NishiharaFumitaka Arai
    • H01L29/788
    • H01L29/42336H01L21/764H01L27/11521H01L27/11524H01L29/7881
    • Two diffusion layers are provided in an element area. A tunnel insulating film is provided on the surface of the element area between the two diffusion layers. A charge storage layer is provided on the tunnel insulating film. A first insulator provided on the upper surface of the charge storage layer. An inter-electrode insulating film provided on the first insulator, on the side surface of the charge storage layer in a first direction and on the isolation insulating film. And a control gate electrode extends in the first direction and covers the charge storage layer via the first insulator and the inter-electrode insulating film. The first insulator is thicker than the inter-electrode insulating film, and the inter-electrode insulating film has a first slit on the first insulator.
    • 在元件区域中设置两个扩散层。 隧道绝缘膜设置在两个扩散层之间的元件区域的表面上。 电荷存储层设置在隧道绝缘膜上。 设置在电荷存储层的上表面上的第一绝缘体。 一种电极间绝缘膜,设置在第一绝缘体上,在电荷存储层的第一方向的侧表面上以及隔离绝缘膜上。 并且控制栅极电极沿第一方向延伸并且经由第一绝缘体和电极间绝缘膜覆盖电荷存储层。 第一绝缘体比电极间绝缘膜厚,并且电极间绝缘膜在第一绝缘体上具有第一狭缝。
    • 9. 发明申请
    • NON-VOLATILE SEMICONDUCTOR STORAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
    • 非挥发性半导体存储器件及其制造方法
    • US20090090959A1
    • 2009-04-09
    • US12244174
    • 2008-10-02
    • Kiyohito NishiharaFumitaka Arai
    • Kiyohito NishiharaFumitaka Arai
    • H01L29/423H01L21/28
    • H01L27/1203H01L27/11565H01L27/11568H01L27/11578H01L27/11582H01L29/792H01L29/7926
    • A first lamination part includes: a charge accumulation layer provided on the respective sidewalls of laminated first conductive layers and accumulating charges; and a first semiconductor layer provided in contact with the fourth insulation layer and formed to extend to the lamination direction. A second lamination part includes a second semiconductor layer provided in contact with the first semiconductor layer. A third lamination part includes: a plurality of first contact layers formed in contact with the respective second lamination part, extending to a first direction perpendicular to the lamination direction, and in line with each other along a second direction perpendicular to the first direction; and a plurality of contact plug layers formed in contact with any one of the first contact layers and extending to the lamination direction. The contact plug layers are arranged at different positions relative to each other in the first direction.
    • 第一层压部件包括:电荷累积层,设置在层叠的第一导电层的各个侧壁上并积累电荷; 以及第一半导体层,设置成与所述第四绝缘层接触并形成为向层叠方向延伸。 第二层压部件包括与第一半导体层接触设置的第二半导体层。 第三层压部件包括:多个第一接触层,其形成为与相应的第二层压部分接触,延伸到垂直于层叠方向的第一方向,并且沿着垂直于第一方向的第二方向彼此成直线; 以及多个接触塞层,其形成为与所述第一接触层中的任一个接触并延伸到层叠方向。 接触塞层在第一方向上相对于彼此设置在不同的位置。