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1. 发明授权

US5916688A Resin solution compositions for electronic materials and protective membranes prepared therefrom for circuits in printed wiring boards 失效
标题翻译：用于电子材料的树脂溶液组合物和由其制备用于印刷线路板中的电路的保护膜
公开(公告)号：US5916688A
公开(公告)日：1999-06-29
申请号：US25629
申请日：1998-02-18
申请人： Kiwamu Tokuhisa , Akira Tokumitsu , Isamu Takarabe
发明人： Kiwamu Tokuhisa , Akira Tokumitsu , Isamu Takarabe
IPC分类号： C08G59/40 , C08G73/10 , C08L63/00 , C08L79/08 , C08L83/10 , H01L21/52 , H01L23/29 , H01L23/31 , H05K3/46 , C08F283/04 , B32B9/04
CPC分类号： H01L23/293 , C08G73/106 , C08L63/00 , C08L79/08 , C08L83/10 , H01L24/29 , H01L2924/3011 , Y10T428/31511 , Y10T428/31663 , Y10T428/31721
摘要： This invention relates to resin solution compositions for electronic materials consisting of organic solutions of 100 parts by weight of siloxanepolyimidepolyamic acid copolymers composed of imide segments formed by polycondensation of aromatic tetracarboxylic acid dianhydrides and siloxanediamines and amic acid segments formed by polyaddition of aromatic tetracarboxylic acid dianhydrides and aromatic diamines other than siloxanediamines and represented by the following general formula (1) (in which X is the residue of an aromatic tetracarboxylic acid dianhydride, Y is the residue of a siloxanediamine, Z is the residue of an aromatic diamine, l and m are integers independent of each other, and n is an integer of 1 or more) and 1 to 50 parts by weight of epoxy resins. The compositions are storage-stable and curable at relatively low temperature and yield cured products with an excellent balance of heat resistance, high-frequency characteristics, chemical resistance and stress relaxation characteristics.
摘要翻译：本发明涉及电子材料用树脂溶液组合物，该组合物由100重量份由芳族四羧酸二酐与硅氧烷二胺缩合而形成的酰亚胺片段和由芳族四羧酸二酐加成形成的酰胺链段构成的有机溶液组成，除了硅氧烷二胺之外的芳族二胺，由以下通式（1）表示（其中X是芳族四羧酸二酐的残基，Y是硅氧烷二胺的残基，Z是芳族二胺的残基，l和m是相互独立的整数，n为1以上的整数）和1〜50重量份的环氧树脂。该组合物在较低温度下是储存稳定的和可固化的，并产生具有优异的耐热性，高频特性，耐化学性和应力松弛特性的平衡的固化产物。

2. 发明授权

US06887580B2 Adhesive polyimide resin and adhesive laminate 失效
标题翻译：粘合聚酰亚胺树脂和粘合剂层压板
公开(公告)号：US06887580B2
公开(公告)日：2005-05-03
申请号：US10182402
申请日：2001-01-26
申请人： Kiwamu Tokuhisa , Akira Tokumitsu , Kazuaki Kaneko
发明人： Kiwamu Tokuhisa , Akira Tokumitsu , Kazuaki Kaneko
IPC分类号： B32B15/08 , B32B27/34 , C08G73/10 , C08G77/455 , C09J179/08 , C09J183/10 , H01L21/58 , H01L23/498 , H05K1/03 , H05K3/46 , B32B27/00
CPC分类号： B32B15/08 , B32B7/12 , B32B27/281 , B32B27/34 , B32B2311/12 , B32B2311/16 , B32B2311/24 , B32B2311/30 , B32B2379/08 , C08G73/106 , C08G77/455 , C09J179/08 , C09J183/10 , H01L23/49894 , H01L24/29 , H01L24/83 , H01L2224/29 , H01L2224/2919 , H01L2224/29191 , H01L2224/29298 , H01L2224/8319 , H01L2224/8385 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/0105 , H01L2924/01082 , H01L2924/04953 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/12042 , H01L2924/19042 , H05K1/0346 , H05K3/4626 , Y10T156/10 , Y10T428/31504 , Y10T428/31663 , Y10T428/31678 , Y10T428/31681 , Y10T428/31721 , H01L2924/0715 , H01L2924/07025 , H01L2924/00 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： An adhesive polyimide resin which comprises a siloxane polyimide resin obtained from (A) an aromatic tetracarboxylic dianhydride and (B) a diamine ingredient comprising (B1) a diamine having a phenolic hydroxyl group, carboxyl group, or vinyl group as a crosslinkable reactive group and (B2) a siloxanediamine and has a glass transition temperature of 50 to 250□C and a Young's modulus (storage modulus) at 250□C of 105 Pa or higher; and a laminate which comprises a substrate comprising a conductor layer and an insulating supporting layer having at least one polyimide resin layer and, disposed on a surface of the substrate, an adhesive layer comprising a layer of the adhesive polyimide resin. The adhesive polyimide resin and the laminate have satisfactory adhesion strength even after exposure to a high temperature of up to 270□C and further have excellent heat resistance in reflow ovens. They are hence suitable for use in the bonding of electronic parts.
摘要翻译：一种粘合性聚酰亚胺树脂，其包含由（A）芳族四羧酸二酐获得的硅氧烷聚酰亚胺树脂和（B）二胺成分，所述二胺成分包含（B1）具有酚羟基，羧基或乙烯基的二胺作为可交联反应性基团，（B2）硅氧烷二胺，玻璃化转变温度为50〜250℃，在250℃下的杨氏模量（储能模量）为10〜5Pa以上; 以及层叠体，其包含基板，所述基板包括具有至少一个聚酰亚胺树脂层的导体层和绝缘支撑层，并且在所述基板的表面上设置包括所述粘合性聚酰亚胺树脂层的粘合剂层。粘合性聚酰亚胺树脂和层压体即使在暴露于高达270℃的高温下也具有令人满意的粘合强度，并且在回流炉中还具有优异的耐热性。因此，它们适用于电子部件的接合。

3. 发明授权

US08268940B2 Flame-retardant adhesive resin composition and adhesive film using the same 有权
标题翻译：阻燃粘合剂树脂组合物和使用其的粘合膜
公开(公告)号：US08268940B2
公开(公告)日：2012-09-18
申请号：US12530152
申请日：2008-03-06
申请人： Akira Mori , Kiwamu Tokuhisa , Kazuhiko Nakahara , Masashi Kaji
发明人： Akira Mori , Kiwamu Tokuhisa , Kazuhiko Nakahara , Masashi Kaji
IPC分类号： C08L63/00 , C08L79/08 , C08L83/10 , B32B27/28 , B32B27/38
CPC分类号： C08G59/4284 , C08G59/04 , C08G59/245 , C08G73/106 , C08L63/00 , C08L2666/14 , C08L2666/22 , C09J163/00 , C09J179/08 , C09J183/10 , H05K3/386 , H05K2201/0162
摘要： Disclosed is a halogen- and phosphorus-free flame-retardant adhesive resin composition which can be used in heat contact bonding of adherends at or below 250° C. and is excellent in heat resistance, solder heat resistance after moisture absorption, and processability. Also disclosed is an adhesive film produced from said composition. The flame-retardant adhesive resin composition comprises 65-98% by weight of a silicone unit-containing polyimide resin and 2-35% by weight of an epoxy resin having an acenaphthylene-substituted naphthalene skeleton. The adhesive film produced from the flame-retardant adhesive resin composition is suitable as an adhesive for a laminate for a multiplayer printed circuit board substrate, an adhesive for a hybrid circuit board substrate, and an adhesive for a coverlay film.
摘要翻译：公开了一种无卤阻燃粘合树脂组合物，其可用于250℃以下的被粘物的热接触粘合，耐热性，吸湿后的耐焊锡性，加工性优异。还公开了由所述组合物制备的粘合膜。阻燃性粘合剂树脂组合物包含65-98重量％的含硅氧烷单元的聚酰亚胺树脂和2-35重量％的具有苊烯取代的萘骨架的环氧树脂。由阻燃粘合树脂组合物制成的粘合膜适用于多层印刷电路板基板，混合电路板基板用粘合剂和覆盖膜用粘合剂的粘合剂。

4. 发明授权

US08026036B2 Photosensitive resin composition and circuit substrate employing the same 有权
标题翻译：感光树脂组合物和使用其的电路基板
公开(公告)号：US08026036B2
公开(公告)日：2011-09-27
申请号：US11887420
申请日：2006-03-24
申请人： Kiwamu Tokuhisa , Kentaro Hayashi , Hironobu Kawasato
发明人： Kiwamu Tokuhisa , Kentaro Hayashi , Hironobu Kawasato
IPC分类号： G03F7/00 , G03F7/004
CPC分类号： G03F7/037 , C08F283/12 , C08F290/14 , C08G73/1042 , C08G73/106 , C08G73/1075 , C08G73/1082 , C08K5/103 , C08L79/08 , C08L83/10 , G03F7/0387 , H05K3/0023 , H05K3/4676 , H05K2201/0154 , Y10S430/114 , Y10S430/12 , Y10S430/121 , Y10S430/146 , Y10T428/24802
摘要： The present invention relates to a photosensitive resin composition excellent in pliability, ultraviolet sensitivity for development, developability with an aqueous alkali solution, and storage stability at room temperature and a circuit substrate employing the same. The photosensitive resin composition includes a siloxane-containing polyamic acid resin having structural units respectively represented by the following formulae (1), (2), and (3) and a photopolymerization initiator incorporated therein. The circuit substrate is coated with the photosensitive resin composition. In the formulae, Ar represents a residue of an aromatic tetracarboxylic acid; R1 represents alkyl group having 1 to 6 carbon atoms or phenyl group; R2 represents alkylene group having 2 to 6 carbon atoms or phenylene group; l represents a number of 0 to 10; R3 represents a divalent group or a direct bond; R4 represents —CH2═CH—R6—, in which R6 represents a direct bond, alkylene group having 1 to 6 carbon atoms, or phenylene group; R5 represents a diamine residue; and m, n, and o, indicating the range of the abundant molar ratios of the respective structural units, are 0.3 to 0.95, 0.05 to 0.7, and 0 to 0.5, respectively.
摘要翻译：本发明涉及柔软性，紫外线敏感性，显色性，碱性水溶液的显影性和室温下的保存稳定性以及使用该感光性树脂组合物的电路基板。感光性树脂组合物包含具有分别由下式（1），（2）和（3）表示的结构单元的含硅氧烷的聚酰胺酸树脂和其中引入的光聚合引发剂。电路基板用感光性树脂组合物涂布。式中，Ar表示芳香族四羧酸的残基， R1表示碳原子数为1〜6的烷基或苯基; R2表示碳原子数2〜6的亚烷基或亚苯基; l表示0〜10的数; R3表示二价基团或直接键; R 4表示-CH 2 = CH-R 6 - ，其中R 6表示直接键，具有1至6个碳原子的亚烷基或亚苯基; R5表示二胺残基; m，n，o表示各结构单元的摩尔比的范围分别为0.3〜0.95,0.05〜0.7,0〜0.5的范围。

5. 发明申请

US20100063217A1 FLAME-RETARDANT ADHESIVE RESIN COMPOSITION AND ADHESIVE FILM USING THE SAME 有权
标题翻译：阻燃粘合剂树脂组合物和粘合膜使用相同
公开(公告)号：US20100063217A1
公开(公告)日：2010-03-11
申请号：US12530152
申请日：2008-03-06
申请人： Akira Mori , Kiwamu Tokuhisa , Kazuhiko Nakahara , Masashi Kaji
发明人： Akira Mori , Kiwamu Tokuhisa , Kazuhiko Nakahara , Masashi Kaji
IPC分类号： C09J139/00
CPC分类号： C08G59/4284 , C08G59/04 , C08G59/245 , C08G73/106 , C08L63/00 , C08L2666/14 , C08L2666/22 , C09J163/00 , C09J179/08 , C09J183/10 , H05K3/386 , H05K2201/0162
摘要： Disclosed is a halogen- and phosphorus-free flame-retardant adhesive resin composition which can be used in heat contact bonding of adherends at or below 250° C. and is excellent in heat resistance, solder heat resistance after moisture absorption, and processability. Also disclosed is an adhesive film produced from said composition. The flame-retardant adhesive resin composition comprises 65-98% by weight of a silicone unit-containing polyimide resin and 2-35% by weight of an epoxy resin having an acenaphthylene-substituted naphthalene skeleton. The adhesive film produced from the flame-retardant adhesive resin composition is suitable as an adhesive for a laminate for a multiplayer printed circuit board substrate, an adhesive for a hybrid circuit board substrate, and an adhesive for a coverlay film.
摘要翻译：公开了一种无卤阻燃粘合树脂组合物，其可用于250℃以下的被粘物的热接触粘合，耐热性，吸湿后的耐焊锡性，加工性优异。还公开了由所述组合物制备的粘合膜。阻燃性粘合剂树脂组合物包含65-98重量％的含硅氧烷单元的聚酰亚胺树脂和2-35重量％的具有苊烯取代的萘骨架的环氧树脂。由阻燃粘合树脂组合物制成的粘合膜适用于多层印刷电路板基板，混合电路板基板用粘合剂和覆盖膜用粘合剂的粘合剂。

6. 发明申请

US20090202786A1 Photosensitive Resin Composition and Circuit Substrate Employing the Same 有权
标题翻译：光敏树脂组合物和使用它的电路基板
公开(公告)号：US20090202786A1
公开(公告)日：2009-08-13
申请号：US11887420
申请日：2006-03-24
申请人： Kiwamu Tokuhisa , Kentaro Hayashi , Hironobu Kawasato
发明人： Kiwamu Tokuhisa , Kentaro Hayashi , Hironobu Kawasato
IPC分类号： B32B3/10 , G03F7/075
CPC分类号： G03F7/037 , C08F283/12 , C08F290/14 , C08G73/1042 , C08G73/106 , C08G73/1075 , C08G73/1082 , C08K5/103 , C08L79/08 , C08L83/10 , G03F7/0387 , H05K3/0023 , H05K3/4676 , H05K2201/0154 , Y10S430/114 , Y10S430/12 , Y10S430/121 , Y10S430/146 , Y10T428/24802
摘要： The present invention relates to a photosensitive resin composition excellent in pliability, ultraviolet sensitivity for development, developability with an aqueous alkali solution, and storage stability at room temperature and a circuit substrate employing the same. The photosensitive resin composition includes a siloxane-containing polyamic acid resin having structural units respectively represented by the following formulae (1), (2), and (3) and a photopolymerization initiator incorporated therein. The circuit substrate is coated with the photosensitive resin composition. In the formulae, Ar represents a residue of an aromatic tetracarboxylic acid; R1 represents alkyl group having 1 to 6 carbon atoms or phenyl group; R2 represents alkylene group having 2 to 6 carbon atoms or phenylene group; l represents a number of 0 to 10; R3 represents a divalent group or a direct bond; R4 represents —CH2═CH—R6—, in which R6 represents a direct bond, alkylene group having 1 to 6 carbon atoms, or phenylene group; R5 represents a diamine residue; and m, n, and o, indicating the range of the abundant molar ratios of the respective structural units, are 0.3 to 0.95, 0.05 to 0.7, and 0 to 0.5, respectively.
摘要翻译：本发明涉及柔软性，紫外线敏感性，显色性，碱性水溶液的显影性和室温下的保存稳定性以及使用该感光性树脂组合物的电路基板。感光性树脂组合物包含具有分别由下式（1），（2）和（3）表示的结构单元的含硅氧烷的聚酰胺酸树脂和其中引入的光聚合引发剂。电路基板用感光性树脂组合物涂布。式中，Ar表示芳香族四羧酸的残基， R1表示碳原子数为1〜6的烷基或苯基; R2表示碳原子数2〜6的亚烷基或亚苯基; l表示0〜10的数; R3表示二价基团或直接键; R 4表示-CH 2 -CH-R 6 - ，其中R 6表示直接键，具有1至6个碳原子的亚烷基或亚苯基; R5表示二胺残基; m，n，o表示各结构单元的摩尔比的范围分别为0.3〜0.95,0.05〜0.7,0〜0.5的范围。

7. 发明授权

US06984714B2 Siloxane-modified polyimide resin 失效
公开(公告)号：US06984714B2
公开(公告)日：2006-01-10
申请号：US10420858
申请日：2003-04-23
申请人： Kiwamu Tokuhisa , Hongyuan Wang
发明人： Kiwamu Tokuhisa , Hongyuan Wang
IPC分类号： C08G69/26 , C08G73/10
CPC分类号： C08G73/1042 , C08G73/106 , H05K1/0346 , Y10T428/31721
摘要： This invention relates to a siloxane-modified polyimide resin which shows excellent adhesiveness and can be bonded by thermocompression at high temperature even after subjection to thermal hysteresis in the manufacturing step for electronic parts. This polyimide resin is obtained from an aromatic tetracarboxylic acid dianhydride (A) and a diamine (B) comprising 30–95 mol % of a bis(4-aminophenoxy)alkane (B1) and 5–70 mol % of a siloxanediamine (B2) as essential components.

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