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1. 发明授权

US5200272A Process for metallizing substrate surfaces 失效
标题翻译：金属化基板表面的工艺
公开(公告)号：US5200272A
公开(公告)日：1993-04-06
申请号：US922592
申请日：1992-07-30
申请人： Kirkor Sirinyan , Reinhold Dederichs , Rudolf Merten , Ulrich von Gizycki , Gerhard-Dieter Wolf , John L. Williams
发明人： Kirkor Sirinyan , Reinhold Dederichs , Rudolf Merten , Ulrich von Gizycki , Gerhard-Dieter Wolf , John L. Williams
IPC分类号： C23C18/20 , H05K3/18 , H05K3/38
CPC分类号： C23C18/30 , C23C18/208 , H05K3/181 , H05K3/387 , Y10T428/31681
摘要： An improved process for depositing strongly adhering metallic coatings on substrate surfaces by wet chemical methods by treating the surfaces with a primer before activation.The materials produced by the process are eminently suitable for the shielding of electromagnetic waves.
摘要翻译：一种通过湿法化学方法在基体表面上沉积强粘附金属涂层的改进方法，通过在活化之前用底漆处理表面。该工艺生产的材料特别适用于电磁波屏蔽。

2. 发明授权

US5300140A Hydroprimer for metallising substrate surfaces 失效
标题翻译：用于金属化基底表面的水合物
公开(公告)号：US5300140A
公开(公告)日：1994-04-05
申请号：US842715
申请日：1992-02-27
申请人： Gerhard-Dieter Wolf , Ulrich von Gizycki , Wolfgang Cohnen , Gunther Reichert , Gert Jabs
发明人： Gerhard-Dieter Wolf , Ulrich von Gizycki , Wolfgang Cohnen , Gunther Reichert , Gert Jabs
IPC分类号： C08J7/04 , C09D5/38 , C09D175/00 , C09D175/04 , C23C18/28 , C23C18/30 , H05K3/18 , H05K3/38 , H05K9/00
CPC分类号： C23C18/28 , H05K3/181 , H05K3/387
摘要： Formulations which contain a water-dispersible polymer, a metallization catalyst, if appropriate fillers, if appropriate other constituents and water are outstandingly suitable for the pretreatment of various substrate surfaces for the purpose of subsequent metallization in a currentless metallization bath.
摘要翻译：含有水分散性聚合物，金属化催化剂，如果合适的填料，如果合适的话，其它组分和水的配方，显着地适用于各种基材表面的预处理，以便在无电镀金属浴中随后进行金属化。

3. 发明授权

US5296020A Formulation for the activation of substrate surfaces for currentless metallization thereof 失效
标题翻译：用于激活基板表面以进行无电镀金属化的配方
公开(公告)号：US5296020A
公开(公告)日：1994-03-22
申请号：US864782
申请日：1992-04-07
申请人： Gunther Reichert , Frank Kobelka , Gerhard-Dieter Wolf , Ulrich von Gizycki
发明人： Gunther Reichert , Frank Kobelka , Gerhard-Dieter Wolf , Ulrich von Gizycki
IPC分类号： C23C18/30 , C23C18/28
CPC分类号： C23C18/28
摘要： Formulations containing an organometallic activator, a filler, a solvent and an aqueous dispersion of a polyurethane polymer are outstandingly suitable for activation of surfaces of plastics for currentless metallisation thereof.The components of plastic activated in this way are preferably employed, after metallisation has been carried out, for shielding from electromagnetic waves.
摘要翻译：含有有机金属活化剂，填料，溶剂和聚氨酯聚合物的水分散体的配方显着地适用于塑料表面的无电金属化活化。在进行金属化之后，优选使用以这种方式激活的塑料的部件，以防止电磁波。

4. 发明授权

US5436034A Process for improving the adhesiveness of electrolessly deposited metal films 失效
标题翻译：提高无电沉积金属膜的粘合性的方法
公开(公告)号：US5436034A
公开(公告)日：1995-07-25
申请号：US358660
申请日：1994-12-19
申请人： Henning Giesecke , Gerhard-Dieter Wolf , Wilfried Haese
发明人： Henning Giesecke , Gerhard-Dieter Wolf , Wilfried Haese
IPC分类号： C23C18/20 , C23C18/30 , H05K3/18 , H05K3/38 , B05D3/02
CPC分类号： C23C18/30 , H05K3/181 , H05K3/387
摘要： Electrolessly deposited metal films having improved adhesion can be obtained by coating the surface of the substrates to be metallized with a formulation consisting of UV-curable varnishes which contain noble metal compounds as activators and, in addition, either fillers or solvents or a combination of fillers and solvents, curing these varnishes by means of UV radiation, followed by electroless metallization of the substrates thus treated.
摘要翻译：可以通过用含有贵金属化合物作为活化剂的紫外线可固化清漆和另外填充剂或溶剂或填料的组合的由UV可固化的清漆组成的制剂涂覆待金属化的基材的表面来获得具有改善的粘合性的无电沉积金属膜和溶剂，通过UV辐射固化这些清漆，然后对如此处理的基材进行无电镀金属化。

5. 发明授权

US5575898A Process for through-hole plating of two-layer printed circuit boards and multilayers 失效
标题翻译：双层印刷电路板和多层通孔电镀工艺
公开(公告)号：US5575898A
公开(公告)日：1996-11-19
申请号：US530998
申请日：1995-09-20
申请人： Gerhard-Dieter Wolf , Friedrich Jonas , Reinhard Schomacker
发明人： Gerhard-Dieter Wolf , Friedrich Jonas , Reinhard Schomacker
IPC分类号： C25D5/54 , C25D7/00 , H05K3/42 , H05K3/46 , C25D5/02 , C25D5/56
CPC分类号： C25D5/54 , H05K3/424 , H05K2201/0329 , H05K2203/0796 , H05K3/427
摘要： Process for through-hole plating of printed circuit boards and multilayers by applying a conductive layer of a polythiophene onto the walls of the through-holes and electrodeposition of copper onto the walls of the through-holes, characterized in that a microemulsion of a monomeric thiophene of the formula (I) is used to form the conductive polythiophene layer, ##STR1## in which X denotes oxygen or a single bond,R.sub.1 and R.sub.2 mutually independently denote hydrogen or a C.sub.1 -C.sub.4 alkyl group or together form an optionally substituted C.sub.1 -C.sub.4 alkylene residue or a 1,2-cyclohexylene residue,and in that the conductive layer of polythiophene is produced on the walls of the through-holes by subsequent or simultaneous treatment with acid and, finally, a metal is electro-deposited on this conductive base.
摘要翻译：通过在通孔的壁上施加聚噻吩的导电层并将铜电沉积在通孔的壁上，印刷电路板和多层的通孔电镀工艺，其特征在于单体噻吩的微乳液（I）的化合物用于形成导电性聚噻吩层，其中X表示氧或单键，R1和R2相互独立地表示氢或C1-C4烷基，或一起形成任选地取代的C1-C4亚烷基残基或1,2-亚环己基残基，并且通过随后或同时用酸处理，在通孔的壁上产生聚噻吩的导电层，最后将金属电沉积在这个导电基底上。

6. 发明授权

US5403467A Process for through-hole plating of two-layer circuit boards and multilayers 失效
标题翻译：二层电路板和多层通孔电镀工艺
公开(公告)号：US5403467A
公开(公告)日：1995-04-04
申请号：US5779
申请日：1993-01-19
申请人： Friedrich Jonas , Gerhard-Dieter Wolf
发明人： Friedrich Jonas , Gerhard-Dieter Wolf
IPC分类号： C25D7/00 , C25D5/56 , H05K3/42 , C25D5/00 , C25D5/02 , C25D5/54
CPC分类号： H05K3/424 , C25D5/56 , H05K2201/0329 , H05K2203/0796 , H05K3/427
摘要： A process for through-hole plating of two-layer circuit boards and multilayers using polythiophenes as a conductive agent on the side walls of through-holes for the direct through-hole plating and to the circuit boards and multilayers thus produced.
摘要翻译：使用聚噻吩作为导电剂的双层电路板和多层的通孔电镀方法，用于直接通孔电镀的通孔的侧壁以及由此制造的电路板和多层。

7. 发明授权

US5935405A Process for producing rigid and flexible circuits 失效
标题翻译：生产刚性和柔性电路的工艺
公开(公告)号：US5935405A
公开(公告)日：1999-08-10
申请号：US926111
申请日：1997-09-09
申请人： Gerhard-Dieter Wolf , Friedrich Jonas
发明人： Gerhard-Dieter Wolf , Friedrich Jonas
IPC分类号： H05K3/10 , H05K3/18 , H05K3/42 , C25D5/02
CPC分类号： H05K3/188 , C25D5/022 , H05K3/108 , H05K2201/0329 , H05K2203/1142 , H05K3/426
摘要： Rigid or flexible circuits of electrically conductor tracks can be produced on flexible or rigid, non-conductive support materials bya) coating the surfaces of the support materials including existing drill holes with a primer and a conductive polymer, preferably poly-3,4-ethylendioxythiophene, which may contain binders,b) applying an electroplating resist in the form of the negative image of the conductor tracks,c) metallizing by electroplating the surface kept free by the electroplating resist, including existing drill holes, in the form of the positive image of the conductor tracks,d) removing the electroplating resist ande) removing the conductive polymer, which had been below the electroplating resist, or converting it to a non-conductive form, wherein the conductor tracks are electrically interconnected during the metallizing step by the layer of conductive polymer, thereby avoiding the need to individually contact each conductor track.
摘要翻译：电导体轨道的刚性或柔性电路可以通过以下方式在柔性或刚性的非导电支撑材料上制造：a）用底漆和导电聚合物涂覆包括现有钻孔的载体材料的表面，优选聚3,4- 乙烯二氧噻吩，其可以包含粘合剂，b）以导体轨迹的负像形式施加电镀抗蚀剂，c）通过电镀由电镀抗蚀剂保持的表面（包括现有的钻孔）以阳性形式进行金属化导体轨迹的图像，d）去除电镀抗蚀剂，以及e）去除已经在电镀抗蚀剂下面的导电聚合物，或将其转换成非导电形式，其中导体轨道在金属化步骤期间电互连，导电聚合物层，从而避免需要单独接触每个导体轨道。

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