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1. 发明申请

US20130015481A1 SEMICONDUCTOR LIGHT EMITTING DEVICE 有权
标题翻译：半导体发光器件
公开(公告)号：US20130015481A1
公开(公告)日：2013-01-17
申请号：US13421817
申请日：2012-03-15
申请人： Kimitaka YOSHIMURA , Katsuhiko NISHITANI , Akihiro FUJIWARA
发明人： Kimitaka YOSHIMURA , Katsuhiko NISHITANI , Akihiro FUJIWARA
IPC分类号： H01L33/58
CPC分类号： H01L33/22 , H01L33/007
摘要： According to one embodiment, in a semiconductor light emitting device, a substrate includes a first surface, a second surface opposite to the first surface, lateral surfaces intersected with the first surface and the second surface, first regions each provided on the lateral surface, and second regions each provided on the lateral surface. Each of the first regions has a first width and a first roughness. Each of the second regions has a second width smaller than the first width and a second roughness smaller than the first roughness. The first regions and the second regions are alternately arranged. A proportion of the sum of the first widths to a distance between the first surface and the second surface is 0.5 or more. A semiconductor laminated body is provided above the first surface of the substrate, and includes a first semiconductor layer, an active layer and a second semiconductor layer.
摘要翻译：根据一个实施例，在半导体发光器件中，衬底包括第一表面，与第一表面相对的第二表面，与第一表面和第二表面交叉的侧表面，每个设置在侧表面上的第一区域，以及第二区域分别设置在侧面上。每个第一区域具有第一宽度和第一粗糙度。每个第二区域具有小于第一宽度的第二宽度和小于第一粗糙度的第二粗糙度。第一区域和第二区域交替布置。第一宽度与第一表面和第二表面之间的距离之和的比例为0.5以上。半导体层叠体设置在基板的第一表面上方，并且包括第一半导体层，有源层和第二半导体层。

2. 发明申请

US20120319138A1 SEMICONDUCTOR LIGHT EMITTING DEVICE 审中-公开
标题翻译：半导体发光器件
公开(公告)号：US20120319138A1
公开(公告)日：2012-12-20
申请号：US13423139
申请日：2012-03-16
申请人： Akihiro FUJIWARA , Kimitaka YOSHIMURA , Takashi HAKUNO
发明人： Akihiro FUJIWARA , Kimitaka YOSHIMURA , Takashi HAKUNO
IPC分类号： H01L33/48
CPC分类号： H01L33/22
摘要： According to one embodiment, in a semiconductor light emitting device, a substrate includes a first surface and a second surface opposite to each other, lateral surfaces intersected with the first surface and the second surface, first regions each provided on the lateral surface, and second regions each provided on the lateral surface. Each of the first regions has a first width and a first roughness. Each of the second regions has a second width smaller than the first width and a second roughness smaller than the first roughness. The first region is provided from a position away from the first surface by a first distance. The first regions and the second regions are alternately arranged. A semiconductor laminated body is provided above the first surface of the substrate, and includes a first semiconductor layer, an active layer and a second semiconductor layer.
摘要翻译：根据一个实施例，在半导体发光器件中，衬底包括彼此相对的第一表面和第二表面，与第一表面和第二表面相交的侧表面，设置在侧表面上的第一区域，第二表面各个设置在侧面上的区域。每个第一区域具有第一宽度和第一粗糙度。每个第二区域具有小于第一宽度的第二宽度和小于第一粗糙度的第二粗糙度。第一区域从远离第一表面的位置提供第一距离。第一区域和第二区域交替布置。半导体层叠体设置在基板的第一表面上方，并且包括第一半导体层，有源层和第二半导体层。

3. 发明申请

US20120018752A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20120018752A1
公开(公告)日：2012-01-26
申请号：US13039583
申请日：2011-03-03
申请人： Akihiro FUJIWARA , Takashi HAKUNO , Tokuhiko MATSUNAGA , Kimitaka YOSHIMURA , Katsufumi KONDO
发明人： Akihiro FUJIWARA , Takashi HAKUNO , Tokuhiko MATSUNAGA , Kimitaka YOSHIMURA , Katsufumi KONDO
IPC分类号： H01L33/40 , H01L33/30
CPC分类号： H01L33/20 , H01L33/0079 , H01L33/0095 , H01L33/40 , H01L2933/0008
摘要： According to one embodiment, a semiconductor device includes a substrate and a stacked body on the substrate via a joining metal layer. The stacked body includes a device portion and a peripheral portion. The device portion includes from a bottommost layer to a topmost layer included in the stacked body. The peripheral portion surrounding and provided around the device portion; the peripheral portion is a portion of the bottommost layer to the topmost layer included in the stacked body and includes a portion of a semiconductor layer in contact with the joining metal layer.
摘要翻译：根据一个实施例，半导体器件通过接合金属层包括衬底和衬底上的层叠体。堆叠体包括器件部分和周边部分。装置部分包括从堆叠体中包含的最底层到最顶层。围绕并设置在装置部分周围的周边部分; 外围部分是包括在层叠体中的最下层到最顶层的部分，并且包括与接合金属层接触的半导体层的一部分。

4. 发明申请

US20090225726A1 MOBILE COMMUNICATION METHOD, MOBILE COMMUNICATION SYSTEM, AND RADIO BASE STATION 审中-公开
标题翻译：移动通信方法，移动通信系统和无线电基站
公开(公告)号：US20090225726A1
公开(公告)日：2009-09-10
申请号：US12390647
申请日：2009-02-23
申请人： Akihito HANAKI , Akihiro FUJIWARA , Takahiro HAYASHI , Yoshikazu GOTO , Yukiko TAKAGI , Junichiro KAWAMOTO
发明人： Akihito HANAKI , Akihiro FUJIWARA , Takahiro HAYASHI , Yoshikazu GOTO , Yukiko TAKAGI , Junichiro KAWAMOTO
IPC分类号： H04B7/216
CPC分类号： H04W28/22 , H04W72/02 , H04W72/0466 , H04W76/10
摘要： A radio base station includes an assignment unit that selects a transmission rate control channel channelization code assigned to a fewest mobile stations, upon receipt of a communication start request from a mobile station, from among a plurality of transmission rate control channel channelization codes specified by a radio network controller and then assigns a selected transmission rate control channel channelization code to the mobile station.
摘要翻译：无线基站包括分配单元，在从由移动台接收到通信开始请求的情况下，从分配给最小移动台的多个传输速率控制信道信道化码中选择由无线网络控制器，然后将选定的传输速率控制信道信道化码分配给移动台。

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