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    • 1. 发明授权
    • Method of fabricating field effect transistors
    • 制造场效应晶体管的方法
    • US4503599A
    • 1985-03-12
    • US462014
    • 1983-01-28
    • Kiichi UeyanagiSusumu TakahashiYasunari UmemotoMichiharu Nakamura
    • Kiichi UeyanagiSusumu TakahashiYasunari UmemotoMichiharu Nakamura
    • H01L29/78H01L21/033H01L21/336H01L21/338H01L29/417H01L29/80H01L29/812H01L21/265
    • H01L29/66522H01L21/033H01L29/66871H01L29/80H01L29/812
    • Herein disclosed is a field effect transistor fabricating method comprising: the step of forming a surface portion of a semiconductor substrate with an impurity region for a channel; the step of forming a first material layer, which has a width substantially equal to that of a gate electrode, in such a position on said semiconductor substrate and is to be formed with said gate electrode, a second material layer, which has a width larger than that of said first material layer, above said first material layer, and source and drain regions by an ion implantation using said first and second material layers thus formed as a mask; the step of forming source and drain electrodes in contact with said source and drain regions; the step of forming a third material layer, which has a selectivity with said first material layer in its etched characteristics, on the semiconductor body thus far prepared by the foregoing steps; the step of forming at least an aperture by removing said first material layer in a state using said third material layer as a mask; and the step of forming said gate electrode in said aperture.
    • 本文公开了一种场效应晶体管制造方法,包括:形成具有沟道杂质区的​​半导体衬底的表面部分的步骤; 在所述半导体衬底上形成具有与栅电极的宽度基本相等的第一材料层的步骤,并形成所述栅电极,第二材料层的宽度较大 比所述第一材料层的上述第一材料层的上述第一材料层和通过使用由此形成的掩模的所述第一和第二材料层的离子注入的源极和漏极区域; 形成与所述源极和漏极区域接触的源极和漏极的步骤; 在上述步骤制备的半导体本体上形成第三材料层的步骤,该第三材料层具有其蚀刻特性中的所述第一材料层的选择性; 通过以使用所述第三材料层作为掩模的状态除去所述第一材料层来形成至少一个孔的步骤; 以及在所述孔中形成所述栅电极的步骤。