专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20100148348A1 PACKAGE SUBSTRATE 审中-公开
标题翻译：包装基板
公开(公告)号：US20100148348A1
公开(公告)日：2010-06-17
申请号：US12480291
申请日：2009-06-08
申请人： Jae-Joon LEE , Jin-Yong An , Ki-Hwan Kim , Seok-Kyu Lee
发明人： Jae-Joon LEE , Jin-Yong An , Ki-Hwan Kim , Seok-Kyu Lee
IPC分类号： H01L23/498
CPC分类号： H01L23/49822 , H01L23/49894 , H01L2224/16 , H01L2224/16235 , H01L2924/01078 , H01L2924/15174 , H05K1/0271 , H05K3/3452 , H05K3/4682 , H05K2201/0191 , H05K2201/09972 , H05K2203/1572
摘要： A package substrate is disclosed. The package substrate as a printed circuit board, in which a semiconductor chip is mounted on one side thereof and the other side thereof is mounted on a main board, can include a substrate part, a first pad, which is formed on one side of the substrate part such that the first pad is electrically connected to the semiconductor chip, and a first solder resist layer, which is formed on one surface of the substrate part such that the first pad is exposed. Here, the first solder resist layer is divided into a pad portion and a dummy portion, the first pad is exposed in the pad portion, and the dummy portion is thinner than the pad portion. The package substrate can contribute to the formation of a structure in which thermal expansion coefficients are symmetrical between the top and bottom, thus preventing the warpage.
摘要翻译：公开了封装衬底。作为印刷电路板的封装基板，其中半导体芯片安装在其一侧并且另一侧安装在主板上，可以包括基板部分，第一焊盘，其形成在主体的一侧上基板部分，使得第一焊盘电连接到半导体芯片;以及第一阻焊层，其形成在基板部分的一个表面上，使得第一焊盘露出。这里，第一阻焊层被分成焊盘部分和虚设部分，第一焊盘暴露在焊盘部分中，并且虚设部分比焊盘部分薄。封装基板有助于形成热膨胀系数在顶部和底部之间对称的结构，从而防止翘曲。

2. 发明申请

US20100126765A1 MULTI-LAYER PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：多层印刷电路板及其制造方法
公开(公告)号：US20100126765A1
公开(公告)日：2010-05-27
申请号：US12569104
申请日：2009-09-29
申请人： Ki-Hwan KIM , Jin-Yong An , Jae-Joon Lee
发明人： Ki-Hwan KIM , Jin-Yong An , Jae-Joon Lee
IPC分类号： H05K1/11 , B32B38/00 , B32B38/10 , C23F1/00
CPC分类号： H05K3/4007 , H05K3/205 , H05K3/4682 , H05K2201/0367 , H05K2201/09481 , H05K2203/054 , Y10T156/1168
摘要： A method of manufacturing a multi-layer PCB having external contact pads formed on one side can include: forming an outermost insulation layer, in which openings are formed corresponding with the external contact pads; forming a mask, in which openings are formed corresponding with the external contact pad and with a circuit pattern, on the outermost insulation layer; forming the external contact pads and the circuit pattern in the openings of the outermost insulation layer and the openings of the mask; removing the mask; forming a build-up layer by stacking layers over the outermost insulation layer such that the external contact pads and the circuit pattern are covered; forming a first solder resist layer on the build-up layer; and forming a second solder resist layer on an opposite side of the outermost insulation layer; and forming openings in the second solder resist layer such that the external contact pads are exposed.
摘要翻译：一种制造具有形成在一侧上的外部接触焊盘的多层PCB的方法可以包括：形成最外绝缘层，其中形成对应于外部接触焊盘的开口; 形成掩模，其中在最外绝缘层上形成对应于外部接触焊盘和电路图案的开口; 在外绝缘层的开口和掩模的开口中形成外部接触焊盘和电路图案; 去除面膜; 通过在最外层绝缘层上层叠层来形成堆积层，使得覆盖外部接触焊盘和电路图案; 在积层上形成第一阻焊层; 以及在最外绝缘层的相对侧上形成第二阻焊层; 以及在所述第二阻焊层中形成开口，使得所述外部接触焊盘露出。

3. 发明授权

US08051559B2 Method of manufacturing a multi-layer board 有权
标题翻译：制造多层板的方法
公开(公告)号：US08051559B2
公开(公告)日：2011-11-08
申请号：US12232820
申请日：2008-09-24
申请人： Ki-Hwan Kim , Jong-Kuk Hong , Jin-Yong An
发明人： Ki-Hwan Kim , Jong-Kuk Hong , Jin-Yong An
IPC分类号： H01K3/10 , H05K1/00
CPC分类号： H05K3/4682 , H05K3/0097 , H05K3/205 , H05K3/28 , H05K2203/0152 , H05K2203/1536 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： A method of manufacturing a multi-layer board is disclosed. The method may include forming a detachable separation layer over a support; forming a first solder resist layer over the separation layer; stacking a metal foil over the first solder resist layer; forming a circuit pattern over the metal foil; forming an insulation part over the first solder resist layer such that the circuit pattern is covered; forming a second solder resist layer over the insulation part; and separating a circuit stack unit, which includes the first solder resist layer, the metal foil, the circuit pattern, the insulation part, and the second solder resist layer, from the support by disconnecting the separation layer and the support. This method uses a simple process to reduce manufacture costs and shorten manufacture times.
摘要翻译：公开了制造多层板的方法。该方法可以包括在载体上形成可分离的分离层; 在所述分离层上形成第一阻焊层; 在第一阻焊层上堆叠金属箔; 在金属箔上形成电路图案; 在所述第一阻焊层上形成绝缘部分，使得所述电路图案被覆盖; 在所述绝缘部分上形成第二阻焊层; 以及通过断开分离层和支撑体从支撑件分离包括第一阻焊层，金属箔，电路图案，绝缘部分和第二阻焊层的电路堆叠单元。该方法采用简单的方法降低制造成本，缩短制造时间。

4. 发明申请

US20090236125A1 Multi-layer board and manufacturing method thereof 有权
标题翻译：多层板及其制造方法
公开(公告)号：US20090236125A1
公开(公告)日：2009-09-24
申请号：US12232820
申请日：2008-09-24
申请人： Ki-Hwan Kim , Jong-Kuk Hong , Jin-Yong An
发明人： Ki-Hwan Kim , Jong-Kuk Hong , Jin-Yong An
IPC分类号： H05K3/06 , H05K1/00
CPC分类号： H05K3/4682 , H05K3/0097 , H05K3/205 , H05K3/28 , H05K2203/0152 , H05K2203/1536 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： A method of manufacturing a multi-layer board is disclosed. The method may include forming a detachable separation layer over a support; forming a first solder resist layer over the separation layer; stacking a metal foil over the first solder resist layer; forming a circuit pattern over the metal foil; forming an insulation part over the first solder resist layer such that the circuit pattern is covered; forming a second solder resist layer over the insulation part; and separating a circuit stack unit, which includes the first solder resist layer, the metal foil, the circuit pattern, the insulation part, and the second solder resist layer, from the support by disconnecting the separation layer and the support. This method uses a simple process to reduce manufacture costs and shorten manufacture times.
摘要翻译：公开了制造多层板的方法。该方法可以包括在载体上形成可分离的分离层; 在所述分离层上形成第一阻焊层; 在第一阻焊层上堆叠金属箔; 在金属箔上形成电路图案; 在所述第一阻焊层上形成绝缘部分，使得所述电路图案被覆盖; 在所述绝缘部分上形成第二阻焊层; 以及通过断开分离层和支撑体从支撑件分离包括第一阻焊层，金属箔，电路图案，绝缘部分和第二阻焊层的电路堆叠单元。该方法采用简单的方法降低制造成本，缩短制造时间。

5. 发明申请

US20090073670A1 Multilayered printed circuit board and fabricating method thereof 审中-公开
标题翻译：多层印刷电路板及其制造方法
公开(公告)号：US20090073670A1
公开(公告)日：2009-03-19
申请号：US12076358
申请日：2008-03-17
申请人： Jong-Kuk Hong , Jin-Yong An , Jae-Joon Lee
发明人： Jong-Kuk Hong , Jin-Yong An , Jae-Joon Lee
IPC分类号： H05K1/14 , H05K3/10 , H05K3/36 , H05K3/42
CPC分类号： H05K1/0271 , H05K1/09 , H05K3/205 , H05K3/207 , H05K3/4602 , H05K3/4644 , H05K2201/0352 , H05K2201/09781 , H05K2203/0152 , Y10T29/49126 , Y10T29/49165
摘要： A multilayered printed circuit board and a fabricating method thereof are disclosed. A method that includes repeating processes of forming at least one circuit pattern, and at least one insulation layer that covers the circuit pattern, over a carrier and interconnecting circuit patterns on different layers with vias; stacking a metal stiffener over the insulation layer; repeating processes of forming at least one insulation layer and at least one circuit pattern over the stiffener and interconnecting circuit patterns on different layers with vias; and removing the carrier, can be used to reduce warpage in the board and improve workability.
摘要翻译：公开了一种多层印刷电路板及其制造方法。一种方法，其包括在载体上形成至少一个电路图案的重复处理和覆盖电路图案的至少一个绝缘层，并且在具有通孔的不同层上互连电路图案; 在绝缘层上堆叠金属加强件; 在加强件上形成至少一个绝缘层和至少一个电路图案的重复工艺，并且在具有通孔的不同层上互连电路图案; 并拆卸载体，可用于减少电路板翘曲，提高可加工性。

6. 发明申请

US20090038837A1 Multilayered printed circuit board and manufacturing method thereof 审中-公开
标题翻译：多层印刷电路板及其制造方法
公开(公告)号：US20090038837A1
公开(公告)日：2009-02-12
申请号：US12078176
申请日：2008-03-27
申请人： Shuhichi Okabe , Jin-Yong An , Seok-Kyu Lee , Soon-Oh Jung , Jong-Kuk Hong , Hae-Nam Seo
发明人： Shuhichi Okabe , Jin-Yong An , Seok-Kyu Lee , Soon-Oh Jung , Jong-Kuk Hong , Hae-Nam Seo
IPC分类号： H05K1/11 , B32B38/10
CPC分类号： H05K3/462 , H05K3/205 , H05K3/243 , H05K3/421 , H05K3/4623 , H05K3/4644 , H05K2201/09527 , H05K2201/09563 , H05K2201/096
摘要： A multilayered printed circuit board is disclosed. A method of manufacturing the multilayered printed circuit board, which includes: forming a metal layer and a lower-circuit-forming pattern in order on a carrier, and forming a lower circuit by filling a conductive material in the lower-circuit-forming pattern; removing the lower-circuit-forming pattern, stacking an insulation resin, and forming at least one via hole connecting with the lower circuit; forming at least one inner circuit and at least one interlayer connector connecting the inner circuit with the lower circuit on the insulation resin, to form a pair of circuit parts; and aligning the pair of circuit parts, attaching the pair of circuit parts to each other, and removing the carrier and the metal layer, allows the forming of fine-lined circuits and provides a thin board, while preventing bending and warpage in the board.
摘要翻译：公开了一种多层印刷电路板。一种制造多层印刷电路板的方法，包括：在载体上依次形成金属层和下电路形成图案，并通过在下电路形成图案中填充导电材料形成下层电路; 去除下部电路形成图案，堆叠绝缘树脂，并形成与下部电路连接的至少一个通孔; 在所述绝缘树脂上形成至少一个内部电路和连接所述内部电路与所述下部电路的至少一个层间连接器，以形成一对电路部件; 并且将一对电路部件对准，将一对电路部件彼此连接，并且移除载体和金属层，允许形成精细的电路并提供薄板，同时防止板的弯曲和翘曲。

7. 发明授权

US08499444B2 Method of manufacturing a package substrate 有权
标题翻译：制造封装基板的方法
公开(公告)号：US08499444B2
公开(公告)日：2013-08-06
申请号：US12216152
申请日：2008-06-30
申请人： Jin-Yong An , Chang-Sup Ryu , Jong-Kuk Hong
发明人： Jin-Yong An , Chang-Sup Ryu , Jong-Kuk Hong
IPC分类号： H05K3/02 , H05K3/10
CPC分类号： H05K1/02 , H01L23/49822 , H01L23/49827 , H01L2924/0002 , H05K3/0097 , H05K3/4007 , H05K3/4644 , H05K2201/0367 , H05K2201/09481 , H05K2201/096 , H05K2203/0384 , H05K2203/0726 , H05K2203/1536 , Y10T29/49126 , Y10T29/49155 , Y10T29/49204 , Y10T428/24851 , Y10T428/24917 , H01L2924/00
摘要： A package substrate and a method of manufacturing the package substrate are disclosed. The method of manufacturing the package substrate may include stacking a second metal layer in which at least one hole is formed over a first metal layer, stacking a barrier layer over the first metal layer exposed in the hole and over the second metal layer, forming at least one bump by filling the hole with a conductive metal, stacking an insulation layer over the bump and forming a circuit pattern over the insulation layer, and removing the first metal layer, the second metal layer, and the barrier layer.
摘要翻译：公开了封装基板和制造封装基板的方法。制造封装衬底的方法可以包括堆叠第二金属层，其中在第一金属层上形成至少一个孔，在第一金属层上方在第二金属层上方堆叠阻挡层，形成在第二金属层上通过用导电金属填充所述孔至少一个凸块，在所述凸块上方堆叠绝缘层并在所述绝缘层上形成电路图案，以及去除所述第一金属层，所述第二金属层和所述阻挡层。

8. 发明申请

US20090169837A1 Package substrate and manufacturing method thereof 有权
标题翻译：封装基板及其制造方法
公开(公告)号：US20090169837A1
公开(公告)日：2009-07-02
申请号：US12216152
申请日：2008-06-30
申请人： Jin-Yong An , Chang-Sup Ryu , Jong-Kuk Hong
发明人： Jin-Yong An , Chang-Sup Ryu , Jong-Kuk Hong
IPC分类号： B32B3/00 , B32B38/10
CPC分类号： H05K1/02 , H01L23/49822 , H01L23/49827 , H01L2924/0002 , H05K3/0097 , H05K3/4007 , H05K3/4644 , H05K2201/0367 , H05K2201/09481 , H05K2201/096 , H05K2203/0384 , H05K2203/0726 , H05K2203/1536 , Y10T29/49126 , Y10T29/49155 , Y10T29/49204 , Y10T428/24851 , Y10T428/24917 , H01L2924/00
摘要： A package substrate and a method of manufacturing the package substrate are disclosed. The method of manufacturing the package substrate may include stacking a second metal layer in which at least one hole is formed over a first metal layer, stacking a barrier layer over the first metal layer exposed in the hole and over the second metal layer, forming at least one bump by filling the hole with a conductive metal, stacking an insulation layer over the bump and forming a circuit pattern over the insulation layer, and removing the first metal layer, the second metal layer, and the barrier layer.
摘要翻译：公开了封装基板和制造封装基板的方法。制造封装衬底的方法可以包括堆叠第二金属层，其中在第一金属层上形成至少一个孔，在第一金属层上方在第二金属层上方堆叠阻挡层，形成在第二金属层上通过用导电金属填充所述孔至少一个凸块，在所述凸块上方堆叠绝缘层并在所述绝缘层上形成电路图案，以及去除所述第一金属层，所述第二金属层和所述阻挡层。

9. 发明授权

US07971352B2 Method of manufacturing printed circuit board 有权
标题翻译：制造印刷电路板的方法
公开(公告)号：US07971352B2
公开(公告)日：2011-07-05
申请号：US12213465
申请日：2008-06-19
申请人： Shuhichi Okabe , Jin-Yong An , Seok-Kyu Lee , Soon-Oh Jung , Jong-Kuk Hong , Hae-Nam Seo
发明人： Shuhichi Okabe , Jin-Yong An , Seok-Kyu Lee , Soon-Oh Jung , Jong-Kuk Hong , Hae-Nam Seo
IPC分类号： H01R9/00 , H05K3/00
CPC分类号： H05K3/4682 , H05K3/108 , H05K3/205 , H05K3/3473 , H05K2201/0367 , H05K2203/0376 , H05K2203/043 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49144 , Y10T29/49149
摘要： A method of manufacturing a printed circuit board having solder balls. The method may include: stacking a second carrier, in which at least one hole is formed, over one side of a first carrier; forming at least one solder bump by filling the hole with a conductive material; forming a circuit pattern layer, which is electrically connected with the solder bump, on the second carrier; and exposing the solder bump by removing the first carrier and the second carrier. Using this method, uniform hemispherical solder balls with fine pitch can be formed as a part of the manufacturing process, without having to attach the solder balls separately. Carriers may be used to serve as supports during the manufacturing process, whereby deformations can be prevented in the board.
摘要翻译：一种制造具有焊球的印刷电路板的方法。该方法可以包括：在第一载体的一侧堆叠形成有至少一个孔的第二载体; 通过用导电材料填充孔而形成至少一个焊料凸块; 在所述第二载体上形成与所述焊料凸块电连接的电路图案层; 以及通过去除所述第一载体和所述第二载体来暴露所述焊料凸块。使用这种方法，可以形成具有细间距的均匀的半球形焊球作为制造过程的一部分，而不必分别附接焊球。可以在制造过程中使用载体作为支撑体，从而可以防止板的变形。

10. 发明申请

US20090151160A1 Method of manufacturing printed circuit board 有权
标题翻译：制造印刷电路板的方法
公开(公告)号：US20090151160A1
公开(公告)日：2009-06-18
申请号：US12213465
申请日：2008-06-19
申请人： Shuhichi Okabe , Jin-Yong An , Seok-Kyu Lee , Soon-Oh Jung , Jong-Kuk Hong , Hae-Nam Seo
发明人： Shuhichi Okabe , Jin-Yong An , Seok-Kyu Lee , Soon-Oh Jung , Jong-Kuk Hong , Hae-Nam Seo
IPC分类号： H05K3/10 , H05K3/36
CPC分类号： H05K3/4682 , H05K3/108 , H05K3/205 , H05K3/3473 , H05K2201/0367 , H05K2203/0376 , H05K2203/043 , Y10T29/49126 , Y10T29/49128 , Y10T29/4913 , Y10T29/49144 , Y10T29/49149
摘要： A method of manufacturing a printed circuit board having solder balls. The method may include: stacking a second carrier, in which at least one hole is formed, over one side of a first carrier; forming at least one solder bump by filling the hole with a conductive material; forming a circuit pattern layer, which is electrically connected with the solder bump, on the second carrier; and exposing the solder bump by removing the first carrier and the second carrier. Using this method, uniform hemispherical solder balls with fine pitch can be formed as a part of the manufacturing process, without having to attach the solder balls separately. Carriers may be used to serve as supports during the manufacturing process, whereby deformations can be prevented in the board.
摘要翻译：一种制造具有焊球的印刷电路板的方法。该方法可以包括：在第一载体的一侧堆叠形成有至少一个孔的第二载体; 通过用导电材料填充孔而形成至少一个焊料凸块; 在所述第二载体上形成与所述焊料凸块电连接的电路图案层; 以及通过去除所述第一载体和所述第二载体来暴露所述焊料凸块。使用这种方法，可以形成具有细间距的均匀的半球形焊球作为制造过程的一部分，而不必分别附接焊球。可以在制造过程中使用载体作为支撑体，从而可以防止板的变形。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式