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1. 发明申请

US20070160907A1 Electrode comprising lithium nickel oxide layer, method for preparing the same, and electrochromic device comprising the same 有权
标题翻译：包含锂镍氧化物层的电极，其制备方法和包含该电极的电致变色器件
公开(公告)号：US20070160907A1
公开(公告)日：2007-07-12
申请号：US11650992
申请日：2007-01-09
申请人： Ki Jang , Jae Park , Jae Oh , Jin Park , Shin Choi , Won Kwon , Byoung Lee
发明人： Ki Jang , Jae Park , Jae Oh , Jin Park , Shin Choi , Won Kwon , Byoung Lee
IPC分类号： H01M4/52 , H01M4/02 , G02F1/15
CPC分类号： G02F1/155 , G02F1/1523 , H01M4/131 , H01M4/1391 , H01M4/525
摘要： The present invention provides A method for preparing an electrode containing lithium nickel oxide wherein nickel has a single oxidation number, which comprises the following steps: a) preparing an electrode containing the lithium nickel oxide (LixNi1-yO, 0.4
摘要翻译：本发明提供一种制备含有镍氧化镍的电极的方法，其中镍具有单一氧化数，其包括以下步骤：a）制备含有锂镍氧化物（Li x Ni）在导电基板上形成的1 O，0.4

2. 发明申请

US20050179012A1 Electrochromic material with improved lifetime 有权
标题翻译：电致变色材料，寿命更长
公开(公告)号：US20050179012A1
公开(公告)日：2005-08-18
申请号：US11015282
申请日：2005-04-18
申请人： Won Kwon , Ki Jang , Sang Kim , Shin Choi , Jin Park , Young Lim
发明人： Won Kwon , Ki Jang , Sang Kim , Shin Choi , Jin Park , Young Lim
IPC分类号： C09K9/02 , G02F1/15 , G03C1/00
CPC分类号： C09K9/02 , C09K2211/1011 , C09K2211/1022 , C09K2211/1029 , C09K2211/1033 , C09K2211/1037 , C09K2211/104 , C09K2211/1044 , C09K2211/1059 , C09K2211/187 , G02F1/1503
摘要： Disclosed are viologen derivatives as an electrochromic material having improved stability and lifetime, a metal oxide electrode including the same, and an electrochromic device using the viologen derivative as an electrochromic material. The viologen derivative includes a suitable regulator group capable of increasing ΔE that is a potential difference between E1 (potential at the first redox reaction) and E2 (potential at the second redox reaction). When ΔE increases, the mole fraction of viologen molecules present in the second reduction state decreases. Therefore, it is possible to lower the mole fraction of viologen molecules present in an irreversibly reduced state at an applied potential, thereby increasing the lifetime of an electrochromic material and an electrochromic device.
摘要翻译：公开了作为具有改善的稳定性和寿命的电致变色材料的紫罗兰衍生物，包含该化合物的金属氧化物电极以及使用紫精衍生物作为电致变色材料的电致变色装置。紫精衍生物包括能够增加DeltaE的合适的调节剂组，其为E 1 （第一次氧化还原反应时的电位）和E 2（第二次电位）之间的电位差氧化还原反应）。当DeltaE增加时，存在于第二还原状态的紫精分子的摩尔分数降低。因此，可以降低在施加电位下以不可逆还原状态存在的紫色分子的摩尔分数，从而增加电致变色材料和电致变色装置的寿命。

3. 发明申请

US20060263063A1 Audio processing apparatus and method 有权
标题翻译：音频处理装置及方法
公开(公告)号：US20060263063A1
公开(公告)日：2006-11-23
申请号：US11436022
申请日：2006-05-18
申请人： Shin Choi
发明人： Shin Choi
IPC分类号： H04N7/00
CPC分类号： G11B20/10527 , G11B2020/10972 , H03G3/3089 , H03G3/348 , H04N21/439
摘要： Disclosed herein are an audio processing apparatus and method. In an embodiment, if a playing mode that abruptly changes the level of audio being played has been input, the data of the audio is processed to mitigate the abrupt change in the level of the audio and converted into analog signals, and the analog signals are output. In an embodiment, if a playing mode that causes a jump from the current track of the audio being played to another track is input, the audio data is divided by an exponential function of 2 before the jump to the another track is completed. In another embodiment, if a playing mode that rapidly moves a playing position to another location on the same track has been input, the audio data is divided by a specific exponential function, and is then multiplied by the exponential function after the playing mode has been completed.
摘要翻译：这里公开了音频处理装置和方法。在一个实施例中，如果已经输入了突然改变正在播放的音频的播放模式的播放模式，则处理音频的数据以减轻音频电平的突然变化并转换成模拟信号，并且模拟信号输出。在一个实施例中，如果输入从正在播放的音频的当前轨道跳转到另一个轨道的播放模式，则在到达另一个轨道的跳转完成之前，将音频数据除以2的指数函数。在另一个实施例中，如果已经输入了将播放位置快速移动到相同轨道上的另一位置的播放模式，则音频数据被特定指数函数划分，然后在播放模式已经被播放模式之后乘以指数函数完成

4. 发明授权

US06972496B2 Chip-scaled package having a sealed connection wire 失效
标题翻译：具有密封连接线的芯片级封装
公开(公告)号：US06972496B2
公开(公告)日：2005-12-06
申请号：US10159348
申请日：2002-05-31
申请人： Shin Choi
发明人： Shin Choi
IPC分类号： H01L23/12 , H01L23/31 , H01L23/48 , H01L23/49 , H01L23/52 , H01L29/40
CPC分类号： H01L24/13 , H01L23/3114 , H01L24/03 , H01L24/05 , H01L2224/13099 , H01L2924/01004 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/1433 , H01L2924/3025
摘要： A chip-scaled package and manufacturing method thereof including a semiconductor chip having a chip pad thereon, a first insulating layer formed on the semiconductor chip and having an opening part exposing the chip pad, a metal wire of which one end covers the opening part so as to be electrically connected to the chip pad 202, a second insulating layer on the first insulating layer including the opening part, the second insulating layer exposing the other end of the metal wire, a conductive ball formed on the other end of the exposed metal wire, and a substrate on which the ball is to be mounted, thereby enabling to improve a package reliance by decreasing the scale and weight of the package.
摘要翻译：一种芯片级封装及其制造方法，包括其上具有芯片焊盘的半导体芯片，形成在半导体芯片上并具有露出芯片焊盘的开口部的第一绝缘层，一端覆盖开口部的金属线，为了电连接到芯片焊盘202，在包括开口部的第一绝缘层上的第二绝缘层，暴露金属线的另一端的第二绝缘层，形成在暴露金属的另一端的导电球导线以及安装球的基板，从而能够通过减小包装的尺寸和重量来提高包装依赖性。

5. 发明申请

US20050049353A1 Nanoporous organic polymer composite and preparation method thereof and its application for catalyst 失效
标题翻译：纳米有机聚合物复合材料及其制备方法及其在催化剂中的应用
公开(公告)号：US20050049353A1
公开(公告)日：2005-03-03
申请号：US10869013
申请日：2004-06-15
申请人： Ryong Ryoo , Minkee Choi , Shin Choi
发明人： Ryong Ryoo , Minkee Choi , Shin Choi
IPC分类号： C08K3/04 , C08K3/34
CPC分类号： C08K3/34 , C08K3/04
摘要： Provided are a nanoporous organic polymer and preparation method thereof, and its application for catalyst. More particularly, provided is a nanoporous organic polymer composite comprising a mesoporous molecular sieve having micropores within mesopore walls, and an organic polymer impregnated within the micropores of the molecular sieve and coated on the wall surfaces of the molecular sieve. Also, provided is a method for preparing a nanoporous organic polymer composite comprising preparing a mesoporous molecular sieve having micropores within mesopore walls; impregnating an organic monomer diluted in solvent into the molecular sieve; and polymerizing the molecular sieve impregnated with the organic monomers to form organic polymers within the micropores and on the wall surfaces of the mesoporous molecular sieves. Further, provided are properties of catalytic reaction of the material as applicable representative examples of the nanoporous organic polymer.
摘要翻译：提供一种纳米多孔有机聚合物及其制备方法及其在催化剂中的应用。更具体地，提供了一种纳米多孔有机聚合物复合材料，其包含在中孔壁内具有微孔的介孔分子筛，以及浸渍在分子筛的微孔内并涂覆在分子筛的壁表面上的有机聚合物。此外，提供了制备纳米多孔有机聚合物复合材料的方法，其包括制备在中孔壁内具有微孔的介孔分子筛; 将稀释在溶剂中的有机单体浸入分子筛中; 并且将浸渍有机单体的分子筛聚合以在微孔内和介孔分子筛的壁表面上形成有机聚合物。此外，提供了作为纳米多孔有机聚合物的适用的代表性实例的材料的催化反应的性质。

6. 发明授权

US06198164B1 Ultra high density integrated circuit semiconductor package and method for fabricating the same 有权
标题翻译：超高密度集成电路半导体封装及其制造方法
公开(公告)号：US06198164B1
公开(公告)日：2001-03-06
申请号：US09191193
申请日：1998-11-13
申请人： Shin Choi
发明人： Shin Choi
IPC分类号： H01L2334
CPC分类号： H01L25/50 , H01L23/467 , H01L24/16 , H01L24/73 , H01L25/0657 , H01L2224/13144 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45144 , H01L2224/48227 , H01L2224/4826 , H01L2224/73215 , H01L2224/73265 , H01L2225/0651 , H01L2225/0652 , H01L2225/06551 , H01L2225/06575 , H01L2225/06582 , H01L2225/06586 , H01L2225/06589 , H01L2225/1029 , H01L2924/14 , H01L2924/1515 , H01L2924/15311 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2224/48247 , H01L2924/00014
摘要： A semiconductor package and method for fabricating same is provided that includes a printed circuit board having an electrical circuit formed therein, a plurality of semiconductor chips vertically attached at fixed intervals to the printed circuit board and conductive connecting members that couple bonding pads on each semiconductor chip to pads on the printed circuit board. An encapsulation body encapsulates the semiconductor chips and the conductive connecting members above the printed circuit board. External connection terminals can be attached on a lower side of the printed circuit board for electrical connection to the semiconductor chips through the electrical circuit in the printed circuit board. The semiconductor package and method has increased mechanical and electrical reliability. The semiconductor package is preferably an ultra high density integrated circuit semiconductor package.
摘要翻译：提供了一种半导体封装及其制造方法，其包括：印刷电路板，其中形成有电路;多个半导体芯片，以固定的间隔垂直地安装到印刷电路板;以及导电连接构件，其连接每个半导体芯片上的焊盘到印刷电路板上的焊盘。封装体将半导体芯片和导电连接构件封装在印刷电路板上。外部连接端子可以安装在印刷电路板的下侧，用于通过印刷电路板中的电路与半导体芯片电连接。半导体封装和方法增加了机电可靠性。半导体封装优选为超高密度集成电路半导体封装。

7. 发明申请

US20060078965A1 Chinese hamster ovary cell line transfected with 30K gene 审中-公开
标题翻译：中国仓鼠卵巢细胞系用30K基因转染
公开(公告)号：US20060078965A1
公开(公告)日：2006-04-13
申请号：US10963770
申请日：2004-10-14
申请人： Tai Park , Shin Choi
发明人： Tai Park , Shin Choi
IPC分类号： C12N5/06 , C12P21/06
CPC分类号： C07K14/505 , C07K14/43586 , C12N2510/02
摘要： The present invention relates to a CHO (Chinese hamster ovary) cell line transfected with 30 K gene. More particularly, the present invention is directed to a CHO cell line transfected with 30 K genes obtained from the silkworm Bombyx Mori, which has anti-apoptotic property.
摘要翻译：本发明涉及用30K基因转染的CHO（中国仓鼠卵巢）细胞系。更具体地，本发明涉及由具有抗凋亡特性的家蚕家蚕获得的30K基因转染的CHO细胞系。

8. 发明授权

US06969906B2 Multi-chip package and method for manufacturing the same 失效
标题翻译：多芯片封装及其制造方法
公开(公告)号：US06969906B2
公开(公告)日：2005-11-29
申请号：US10787499
申请日：2004-02-26
申请人： Shin Choi
发明人： Shin Choi
IPC分类号： H01L23/12 , H01L21/50 , H01L23/02 , H01L23/48 , H01L23/492 , H01L23/538 , H01L25/00 , H01L25/065
CPC分类号： H01L25/065 , H01L23/5387 , H01L24/45 , H01L24/48 , H01L25/0657 , H01L2224/32145 , H01L2224/32245 , H01L2224/45144 , H01L2224/4826 , H01L2224/73215 , H01L2225/06517 , H01L2225/06579 , H01L2225/06582 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： Disclosed are a multi-chip package and a method for manufacturing the multi-chip package. The multi-chip package comprises: a circuit substrate consisting of first, second and third areas which surround three sides of the multi-chip package; and at least two semiconductor chips which are positioned within an internal space of the package defined by the internal surfaces of the above three areas, wherein the semiconductor chips are physically bonded and electrically connected to each other. The method for manufacturing a multi-chip package comprises the steps of: providing a circuit substrate matrix formed with a plurality of unit circuit substrates, each substrate consisting of first, second and third areas; bonding semiconductor chips each unit circuit substrate, so that those chips are physically bonded and electrically connected to the unit circuit substrate; separating unit circuit substrates from the circuit substrate matrix; and folding the unit circuit substrate.
摘要翻译：公开了一种多芯片封装以及用于制造多芯片封装的方法。所述多芯片封装包括：由围绕所述多芯片封装的三边的第一，第二和第三区域构成的电路基板; 以及位于由上述三个区域的内表面限定的封装的内部空间内的至少两个半导体芯片，其中半导体芯片物理地结合并彼此电连接。制造多芯片封装的方法包括以下步骤：提供形成有多个单位电路基板的电路基板矩阵，每个基板由第一，第二和第三区域组成; 将每个单位电路基板的半导体芯片接合，使得那些芯片物理结合并电连接到单位电路基板; 将电路基板与电路基板分离; 并折叠单元电路基板。

9. 发明授权

US06724090B2 Multi-chip package and method for manufacturing the same 失效
标题翻译：多芯片封装及其制造方法
公开(公告)号：US06724090B2
公开(公告)日：2004-04-20
申请号：US10338202
申请日：2003-01-08
申请人： Shin Choi
发明人： Shin Choi
IPC分类号： H01L2348
CPC分类号： H01L25/065 , H01L23/5387 , H01L24/45 , H01L24/48 , H01L25/0657 , H01L2224/32145 , H01L2224/32245 , H01L2224/45144 , H01L2224/4826 , H01L2224/73215 , H01L2225/06517 , H01L2225/06579 , H01L2225/06582 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： Disclosed are a multi-chip package and a method for manufacturing the multi-chip package. The multi-chip package comprises: a circuit substrate consisting of first, second and third areas which surround three sides of the multi-chip package; and at least two semiconductor chips which are positioned within an internal space of the package defined by the internal surfaces of the above three areas, wherein the semiconductor chips are physically bonded and electrically connected to each other. The method for manufacturing a multi-chip package comprises the steps of: providing a circuit substrate matrix formed with a plurality of unit circuit substrates, each substrate consisting of first, second and third areas; bonding semiconductor chips each unit circuit substrate, so that those chips are physically bonded and electrically connected to the unit circuit substrate; separating unit circuit substrates from the circuit substrate matrix; and folding the unit circuit substrate.
摘要翻译：公开了一种多芯片封装以及用于制造多芯片封装的方法。多芯片封装包括：由围绕多芯片封装的三边的第一，第二和第三区域组成的电路基板; 以及位于由上述三个区域的内表面限定的封装的内部空间内的至少两个半导体芯片，其中半导体芯片物理地结合并彼此电连接。制造多芯片封装的方法包括以下步骤：提供形成有多个单位电路基板的电路基板矩阵，每个基板由第一，第二和第三区域组成; 将每个单位电路基板的半导体芯片接合，使得那些芯片物理结合并电连接到单位电路基板; 将电路基板与电路基板分离; 并折叠单元电路基板。

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