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    • 4. 发明申请
    • METHOD OF FABRICATING NON-VOLATILE MEMORY DEVICE HAVING CHARGE TRAPPING LAYER
    • 制造具有电荷捕获层的非易失性存储器件的方法
    • US20090004802A1
    • 2009-01-01
    • US11966231
    • 2007-12-28
    • Moon Sig JooSeung Ho PyiKi Seon ParkHeung Jae ChoYong Top Kim
    • Moon Sig JooSeung Ho PyiKi Seon ParkHeung Jae ChoYong Top Kim
    • H01L21/336
    • H01L27/11568H01L21/28282H01L27/115Y10S438/942
    • A method of fabricating a non-volatile memory device having a charge trapping layer includes forming a tunneling layer, a charge trapping layer, a blocking layer and a control gate electrode layer over a substrate, forming a mask layer pattern on the control gate electrode layer, performing an etching process using the mask layer pattern as an etching mask to remove an exposed portion of the control gate electrode layer, wherein the etching process is performed as excessive etching to remove the charge trapping layer by a specified thickness, forming an insulating layer for blocking charges from moving on the control gate electrode layer and the mask layer pattern, performing anisotropic etching on the insulating layer to form an insulating layer pattern on a sidewall of the control gate electrode layer and a partial upper sidewall of the blocking layer, and performing an etching process on the blocking layer exposed by the anisotropic etching, wherein the etching process is performed as excessive etching to remove the charge trapping layer by a specified thickness.
    • 一种制造具有电荷捕获层的非易失性存储器件的方法包括在衬底上形成隧道层,电荷俘获层,阻挡层和控制栅电极层,在控制栅电极层上形成掩模层图案 使用掩模层图案作为蚀刻掩模进行蚀刻处理以去除控制栅电极层的暴露部分,其中蚀刻工艺作为过度蚀刻进行,以将电荷捕获层除去指定厚度,形成绝缘层 用于阻止电荷在控制栅电极层和掩模层图案上移动,对绝缘层进行各向异性蚀刻,以在控制栅电极层的侧壁和阻挡层的一部分上侧壁上形成绝缘层图案,以及 对通过各向异性蚀刻暴露的阻挡层进行蚀刻处理,其中执行蚀刻处理 作为过量蚀刻以将电荷捕获层除去指定的厚度。
    • 5. 发明授权
    • Method of fabricating non-volatile memory device having charge trapping layer
    • 制造具有电荷捕获层的非易失性存储器件的方法
    • US07981786B2
    • 2011-07-19
    • US11966231
    • 2007-12-28
    • Moon Sig JooSeung Ho PyiKi Seon ParkHeung Jae ChoYong Top Kim
    • Moon Sig JooSeung Ho PyiKi Seon ParkHeung Jae ChoYong Top Kim
    • H01L21/3205H01L21/4763H01L21/302H01L21/461
    • H01L27/11568H01L21/28282H01L27/115Y10S438/942
    • A method of fabricating a non-volatile memory device having a charge trapping layer includes forming a tunneling layer, a charge trapping layer, a blocking layer and a control gate electrode layer over a substrate, forming a mask layer pattern on the control gate electrode layer, performing an etching process using the mask layer pattern as an etching mask to remove an exposed portion of the control gate electrode layer, wherein the etching process is performed as excessive etching to remove the charge trapping layer by a specified thickness, forming an insulating layer for blocking charges from moving on the control gate electrode layer and the mask layer pattern, performing anisotropic etching on the insulating layer to form an insulating layer pattern on a sidewall of the control gate electrode layer and a partial upper sidewall of the blocking layer, and performing an etching process on the blocking layer exposed by the anisotropic etching, wherein the etching process is performed as excessive etching to remove the charge trapping layer by a specified thickness.
    • 一种制造具有电荷捕获层的非易失性存储器件的方法包括在衬底上形成隧道层,电荷俘获层,阻挡层和控制栅电极层,在控制栅电极层上形成掩模层图案 使用掩模层图案作为蚀刻掩模进行蚀刻处理以去除控制栅电极层的暴露部分,其中蚀刻工艺作为过度蚀刻进行,以将电荷捕获层除去指定厚度,形成绝缘层 用于阻止电荷在控制栅电极层和掩模层图案上移动,对绝缘层进行各向异性蚀刻,以在控制栅电极层的侧壁和阻挡层的一部分上侧壁上形成绝缘层图案,以及 对通过各向异性蚀刻暴露的阻挡层进行蚀刻处理,其中执行蚀刻处理 作为过量蚀刻以将电荷捕获层除去指定的厚度。