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1. 发明授权

US5359488A Packaging system for a standard electronic module 失效
标题翻译：标准电子模块的包装系统
公开(公告)号：US5359488A
公开(公告)日：1994-10-25
申请号：US79767
申请日：1993-06-21
申请人： Kevin A. Leahy , Andrew J. Piloto , John G. McKinley, IV , David B. Harris , Timothy M. Fertig , Keith W. Sparks
发明人： Kevin A. Leahy , Andrew J. Piloto , John G. McKinley, IV , David B. Harris , Timothy M. Fertig , Keith W. Sparks
IPC分类号： H01L23/367 , H01L23/40 , H01L23/58 , H05K1/02 , H05K1/03 , H05K1/18 , H05K3/32 , H05K7/14 , H05K7/20
CPC分类号： H05K7/1461 , H01L23/3672 , H01L23/40 , H01L23/585 , H05K1/183 , H05K3/325 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , H05K1/0203 , H05K1/0243 , H05K1/0306
摘要： A packaging system for a standard electronic module is provided utilizing a multi-layer, low temperature, co-fired ceramic motherboard. Device packages, such as an RF device package, are formed of low temperature, low dielectric, co-fired ceramic materials. The device packages are mounted on a composite heat sink provide on one side of the motherboard. A pressure plate provide on the opposite side of the motherboard is fastened to the heat sink to compress the device package. Pressure contact interconnects are used to make contacts between the device packages and the particular conductor layer in the multilayer motherboard. The radio frequency conductor layer in the motherboard is isolated from power and control layers by ground planes provided in the motherboard.
摘要翻译：使用多层，低温共烧陶瓷母板提供标准电子模块的封装系统。器件封装，例如RF器件封装，由低温，低电介质，共烧陶瓷材料形成。器件封装安装在主板一侧的复合散热器上。主板相对侧的压板固定在散热片上以压缩设备封装。压力接触互连用于在器件封装和多层母板中的特定导体层之间进行接触。母板中的射频导体层通过主板中提供的接地层与电源和控制层隔离。

2. 发明授权

US5382931A Waveguide filters having a layered dielectric structure 失效
标题翻译：具有分层电介质结构的波导滤波器
公开(公告)号：US5382931A
公开(公告)日：1995-01-17
申请号：US168502
申请日：1993-12-22
申请人： Andrew J. Piloto , Kevin A. Leahy , Bruce A. Flanick , Kawthar A. Zaki
发明人： Andrew J. Piloto , Kevin A. Leahy , Bruce A. Flanick , Kawthar A. Zaki
IPC分类号： H01P1/20 , H01P1/207 , H01P3/16
CPC分类号： H01P1/207 , H01P1/2002
摘要： Waveguide filters having a laminated dielectric structure for resonating at a predetermined frequency and having a series of longitudinally spaced resonators. A selected plural number of individual layers of high dielectric low temperature co-fired ceramic are laminated into a monolithic structure and then plated with a conductive material. Each of the individual layers is dimensioned and the number of layers is selected so that the unit resonates at the predetermined frequency. A waveguide filter is also described where a select plural number of contiguous layers of low temperature co-fired ceramic are laminated and plated with a conductive material. A series of vertically placed vias are positioned so as to form a perimeter of a waveguide filter. A plurality of individual layers of low temperature co-fired ceramic are laminated to the monolithic structure to form a laminated unit so that electrical components and the waveguide filter can be integrated into a single package.
摘要翻译：波导滤波器具有用于以预定频率谐振并具有一系列纵向间隔开的谐振器的叠层电介质结构。将选定的多个高介电性低温共烧陶瓷的单独层层压成单片结构，然后镀上导电材料。各个层的尺寸被确定，并且选择层的数量使得单元以预定的频率谐振。还描述了一种波导滤波器，其中选择多个连续的低温共烧陶瓷层被层叠并且镀有导电材料。一系列垂直放置的通孔被定位成形成波导过滤器的周边。将多个单独的低温共烧陶瓷层层压到单片结构上以形成层压单元，使得电子部件和波导滤波器可以集成到单个封装中。

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