专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06377463B1 Retention module for processor and chipset thermal solutions 失效
标题翻译：处理器和芯片组热解决方案的保留模块
公开(公告)号：US06377463B1
公开(公告)日：2002-04-23
申请号：US09735254
申请日：2000-12-12
申请人： Ketan R. Shah
发明人： Ketan R. Shah
IPC分类号： H05K720
CPC分类号： H01L23/40 , H01L2924/0002 , H01L2924/00
摘要： A heat sink apparatus includes a first heat sink thermally coupled with at least a first component of a substrate, and a second heat sink thermally coupled with at least a second component of the substrate. The apparatus further includes a unitary retention module coupled with the first heat sink and the second heat sink, where the unitary retention module is also coupled with the substrate.
摘要翻译：散热装置包括与衬底的至少第一部件热耦合的第一散热器和与衬底的至少第二部件热耦合的第二散热器。该装置还包括与第一散热器和第二散热器耦合的整体保持模块，其中整体保持模块也与基板耦合。

2. 发明申请

US20130285545A1 THERMAL MANAGEMENT FOR LIGHT-EMITTING DIODES 有权
标题翻译：用于发光二极管的热管理
公开(公告)号：US20130285545A1
公开(公告)日：2013-10-31
申请号：US13977400
申请日：2011-12-21
申请人： Ketan R. Shah , Sean M. Halton
发明人： Ketan R. Shah , Sean M. Halton
IPC分类号： F21V29/00
CPC分类号： F21V29/506 , F21K9/135 , F21K9/232 , F21V3/02 , F21V3/0418 , F21V3/0436 , F21V3/061 , F21V3/062 , F21V29/70 , F21V29/71 , F21V29/74 , F21V29/745 , F21V29/77 , F21V29/773 , F21V29/78 , F21V29/83 , F21V29/85 , F21V29/87 , F21V29/89 , F21Y2101/00 , F21Y2101/02 , F21Y2115/10 , H01L33/642 , H01L2924/00 , H01L2924/0002
摘要： Embodiments of the invention provide lighting systems that employ light-emitting diode (LED) chips as active lighting elements. Heat management components for the LED chips employed in the lighting sources are provided. In embodiments of the invention, LED chips are cooled by one or more heatspreaders and heat sinks attached to a substrate that houses the LED chip and/or the topside of the LED chip.
摘要翻译：本发明的实施例提供采用发光二极管（LED）芯片作为有源照明元件的照明系统。提供了用于照明源的LED芯片的热管理组件。在本发明的实施例中，LED芯片由附接到容纳LED芯片和/或LED芯片的顶侧的基板的一个或多个散热器和散热器来冷却。

3. 发明申请

US20120216029A1 METHOD, APPARATUS, AND SYSTEM FOR ENERGY EFFICIENCY AND ENERGY CONSERVATION INCLUDING CONFIGURABLE MAXIMUM PROCESSOR CURRENT 有权
标题翻译：用于能源效率和能源保护的方法，装置和系统，包括可配置的最大处理器电流
公开(公告)号：US20120216029A1
公开(公告)日：2012-08-23
申请号：US13326105
申请日：2011-12-14
申请人： Ketan R. Shah , Eric Distefano , Stephen H. Gunther , Jeremy J. Shrall
发明人： Ketan R. Shah , Eric Distefano , Stephen H. Gunther , Jeremy J. Shrall
IPC分类号： G06F9/00 , G06F1/26
CPC分类号： G06F1/3243 , G06F1/3206 , G06F1/324 , G06F9/4401 , G06F9/4411 , G06F9/455 , Y02D10/126 , Y02D10/152 , Y02D50/20
摘要： An apparatus, method and system is described herein for providing multiple maximum current configuration options including corresponding turbo frequencies for a processing device. Available options for a processor are determined by initialization code. And based on platform electrical capabilities, an optimal one of the multiple current configuration options is selected. Moreover, during runtime another current configuration is dynamically selected based on current configuration considerations to provide high flexibility and best possible performance per part and computing platform.
摘要翻译：本文描述了一种用于提供多个最大电流配置选项的装置，方法和系统，包括用于处理设备的对应的turbo频率。处理器的可用选项由初始化代码确定。并且基于平台电气功能，选择多个当前配置选项中的最佳一个。此外，在运行期间，基于当前配置注意事项动态地选择当前配置，以提供每个部件和计算平台的高灵活性和最佳性能。

4. 发明授权

US07188418B2 Method of making split fin heat sink 有权
标题翻译：制作散热片散热片的方法
公开(公告)号：US07188418B2
公开(公告)日：2007-03-13
申请号：US10701582
申请日：2003-11-05
申请人： Ketan R. Shah
发明人： Ketan R. Shah
IPC分类号： B21D53/02 , B21D53/06
CPC分类号： H01L23/467 , B21C23/10 , F28F2215/10 , H01L23/3672 , H01L2924/0002 , Y10T29/4935 , Y10T29/49378 , Y10T29/49385 , H01L2924/00
摘要： A heat sink for dissipating heat from an electronic component includes a core and a plurality of fins extending outwardly from the core. The fins may be at least partially curved. Each fin may split into a plurality of tines that extend away from the core.
摘要翻译：用于散发来自电子部件的热量的散热器包括芯部和从芯部向外延伸的多个翅片。翅片可以至少部分弯曲。每个翅片可以分成多个从芯部延伸出来的尖齿。

5. 发明授权

US09052901B2 Method, apparatus, and system for energy efficiency and energy conservation including configurable maximum processor current 有权
标题翻译：能量效率和节能的方法，装置和系统，包括可配置的最大处理器电流
公开(公告)号：US09052901B2
公开(公告)日：2015-06-09
申请号：US13326105
申请日：2011-12-14
申请人： Ketan R. Shah , Eric Distefano , Stephen H. Gunther , Jeremy J. Shrall
发明人： Ketan R. Shah , Eric Distefano , Stephen H. Gunther , Jeremy J. Shrall
IPC分类号： G06F1/32 , G06F9/44 , G06F9/455
CPC分类号： G06F1/3243 , G06F1/3206 , G06F1/324 , G06F9/4401 , G06F9/4411 , G06F9/455 , Y02D10/126 , Y02D10/152 , Y02D50/20
摘要： An apparatus, method and system is described herein for providing multiple maximum current configuration options including corresponding turbo frequencies for a processing device. Available options for a processor are determined by initialization code. And based on platform electrical capabilities, an optimal one of the multiple current configuration options is selected. Moreover, during runtime another current configuration is dynamically selected based on current configuration considerations to provide high flexibility and best possible performance per part and computing platform.
摘要翻译：本文描述了一种用于提供多个最大电流配置选项的装置，方法和系统，包括用于处理设备的对应的turbo频率。处理器的可用选项由初始化代码确定。并且基于平台电气功能，选择多个当前配置选项中的最佳一个。此外，在运行期间，基于当前配置注意事项动态地选择当前配置，以提供每个部件和计算平台的高灵活性和最佳性能。

6. 发明申请

US20130007440A1 METHOD AND APPARATUS FOR CONFIGURABLE THERMAL MANAGEMENT 有权
公开(公告)号：US20130007440A1
公开(公告)日：2013-01-03
申请号：US13175081
申请日：2011-07-01
申请人： Ketan R. Shah , Tawfik M. Rahal-Arabi , Eric Distefano , James G. Hermerding, II
发明人： Ketan R. Shah , Tawfik M. Rahal-Arabi , Eric Distefano , James G. Hermerding, II
IPC分类号： G06F9/06
CPC分类号： G06F1/206 , G06F1/26 , G06F1/3203 , Y02D10/16
摘要： Embodiments of an apparatus, system and method are described for configurable processor thermal management. An apparatus may comprise, for example, a processor arranged to operate in a plurality of thermal modes comprising a thermal limit down mode, a normal thermal limit mode and a thermal limit up mode, and thermal management logic operative to select a thermal mode based on one or more properties of the apparatus. Other embodiments are described and claimed.

7. 发明授权

US07677052B2 Systems for improved passive liquid cooling 有权
标题翻译：改进被动液体冷却系统
公开(公告)号：US07677052B2
公开(公告)日：2010-03-16
申请号：US11091267
申请日：2005-03-28
申请人： Ketan R. Shah , Russell S. Aoki
发明人： Ketan R. Shah , Russell S. Aoki
IPC分类号： F25D23/12
CPC分类号： H01L23/427 , F28D15/02 , F28D15/0266 , F28F3/048 , F28F13/187 , H01L2924/0002 , H01L2924/00
摘要： According to some embodiments, systems for improved passive liquid cooling may be provided. In some embodiments, a system may comprise an evaporator and a condenser. According to some embodiments, the evaporator may comprise a first side to receive heat, a second side, and one or more fins protruding from the second side. In some embodiments, the condenser may comprise an inner surface defining a cavity and one or more grooves, a first end coupled to the evaporator such that the one or more fins of the evaporator are disposed within the cavity, and a second end, wherein the one or more grooves extend at least partially between the first and second ends of the condenser.
摘要翻译：根据一些实施例，可以提供用于改进被动液体冷却的系统。在一些实施例中，系统可以包括蒸发器和冷凝器。根据一些实施例，蒸发器可以包括接收热量的第一侧，第二侧和从第二侧突出的一个或多个翅片。在一些实施例中，冷凝器可以包括限定空腔和一个或多个凹槽的内表面，联接到蒸发器的第一端使得蒸发器的一个或多个翅片设置在空腔内，以及第二端，其中一个或多个凹槽至少部分地在冷凝器的第一和第二端之间延伸。

8. 发明授权

US06714415B1 Split fin heat sink 有权
标题翻译：分散散热片散热片
公开(公告)号：US06714415B1
公开(公告)日：2004-03-30
申请号：US10388153
申请日：2003-03-13
申请人： Ketan R. Shah
发明人： Ketan R. Shah
IPC分类号： H05K720
CPC分类号： H01L23/467 , B21C23/10 , F28F2215/10 , H01L23/3672 , H01L2924/0002 , Y10T29/4935 , Y10T29/49378 , Y10T29/49385 , H01L2924/00
摘要： A heat sink for dissipating heat from an electronic component includes a core and a plurality of fins extending outwardly from the core. The fins may be at least partially curved. Each fin may split into a plurality of tines that extend away from the core.
摘要翻译：用于散发来自电子部件的热量的散热器包括芯部和从芯部向外延伸的多个翅片。翅片可以至少部分弯曲。每个翅片可以分成多个从芯部延伸出来的尖齿。

9. 外观设计

USD455951S1 Clip for attaching heatsinks 失效
标题翻译：夹子用于连接散热器
公开(公告)号：USD455951S1
公开(公告)日：2002-04-23
申请号：US29124093
申请日：2000-05-31
申请人： Kazimierz L. Kozyra , Ketan R. Shah
设计人： Kazimierz L. Kozyra , Ketan R. Shah

10. 发明授权

US07950607B1 Small munitions adaptor rack for releasing small munitions from an aircraft 有权
标题翻译：用于从飞机上释放小型弹药的小型弹药适配器支架
公开(公告)号：US07950607B1
公开(公告)日：2011-05-31
申请号：US11401526
申请日：2006-04-10
申请人： Michael L Dickerson , Ketan R. Shah
发明人： Michael L Dickerson , Ketan R. Shah
IPC分类号： B64D1/12
CPC分类号： B64D1/06 , F41F3/06
摘要： An adapter for converting a full size aircraft bomb rack into a rack capable of supporting reduced size bombs or stores. The full size bomb rack includes a bomb ejection mechanism capable of delivering an ejection force to a full size bomb. The adapter includes an elongated plate having a body portion defining a planar center portion and end portions. The end portions include laterally extending sway braces for reducing lateral swaying of the reduced size store or bomb. The adapter plate is mounted between the reduced size store and the full size adapter rack. The body portion of the adapter rack includes apparatus for ejecting a reduced size store from the elongated plate. A first opening is arranged adjacent to one end portion of the elongated plate for receiving fasteners carried by the reduced size store which attach the store to the full size bomb rack. These fasteners are passed through an opening in the elongated plate. An ejection mechanism at an end of the elongated plate operates to transfer the ejection force from the full size bomb rack to the store.
摘要翻译：用于将全尺寸飞机炸弹架转换成能够支撑减小尺寸炸弹或存储的机架的适配器。全尺寸炸弹架包括能够向全尺寸炸弹输送喷射力的炸弹弹出机构。适配器包括具有限定平面中心部分和端部的主体部分的细长板。端部包括横向延伸的摆动支架，用于减小尺寸减小的仓库或炸弹的横向摆动。适配器板安装在减小尺寸的存储器和全尺寸适配器机架之间。适配器机架的主体部分包括用于从细长板弹出减小尺寸的存储器的装置。第一开口邻近细长板的一个端部设置，用于接收由减小尺寸的商店承载的紧固件，该紧固件将商店连接到全尺寸的炸弹架上。这些紧固件穿过细长板中的开口。在细长板的端部处的弹出机构用于将全尺寸炸弹架的喷射力传递到商店。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式