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1. 发明授权

US06184577B2 Electronic component parts device 有权
标题翻译：电子元器件
公开(公告)号：US06184577B2
公开(公告)日：2001-02-06
申请号：US09308525
申请日：1999-08-30
申请人： Kenzo Takemura , Itsuo Watanabe , Akira Nagai , Osamu Watanabe , Kazuyoshi Kojima , Akishi Nakaso , Kazunori Yamamoto , Yoshiyuki Tsuru , Teiichi Inada , Yasushi Shimada
发明人： Kenzo Takemura , Itsuo Watanabe , Akira Nagai , Osamu Watanabe , Kazuyoshi Kojima , Akishi Nakaso , Kazunori Yamamoto , Yoshiyuki Tsuru , Teiichi Inada , Yasushi Shimada
IPC分类号： H01L2363
CPC分类号： H05K1/0271 , H01L21/563 , H01L23/145 , H01L23/5383 , H01L2224/16225 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/45144 , H01L2224/73203 , H01L2224/73204 , H01L2224/83851 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/07811 , H01L2924/1301 , H01L2924/13034 , H05K3/323 , H05K3/4626 , H05K3/4652 , H05K3/4655 , H05K2201/0133 , H05K2201/068 , H05K2201/10674 , H01L2924/00 , H01L2924/00014
摘要： In regard to a packaging substrate on which a semiconductor chip is mounted, the surface copper foil of a double-sided copper-clad glass epoxy resin laminated sheet is subjected to circuit formation and inner-layer bonding, then an epoxy resin adhesive film with copper foil is bonded to the surface of the inner-layer circuit by press lamination, and a through hole is formed through the sheet, followed by electroless copper plating, outer-layer circuit formation by the subtractive process, and solder coating to obtain the packaging substrate. The bump electrode of the semiconductor chip and the packaging substrate are connected through an adhesive film.
摘要翻译：对于其上安装有半导体芯片的封装基板，双面覆铜玻璃环氧树脂层压片的表面铜箔进行电路形成和内层结合，然后将具有铜的环氧树脂粘合膜箔通过压力叠层结合到内层电路的表面，并且通过片形成通孔，接着进行无电镀铜，通过减法处理形成外层电路，并获得焊料涂层以获得封装基板。半导体芯片的凸起电极和封装基板通过粘合膜连接。

2. 发明授权

US5690837A Process for producing multilayer printed circuit board 失效
标题翻译：多层印刷电路板生产工艺
公开(公告)号：US5690837A
公开(公告)日：1997-11-25
申请号：US576488
申请日：1995-12-21
申请人： Akishi Nakaso , Koichi Tsuyama , Kazuhisa Otsuka , Haruo Ogino , Yoshihiro Tamura , Teiichi Inada , Kazunori Yamamoto , Akinari Kida , Atsushi Takahashi , Yoshiyuki Tsuru , Shigeharu Arike
发明人： Akishi Nakaso , Koichi Tsuyama , Kazuhisa Otsuka , Haruo Ogino , Yoshihiro Tamura , Teiichi Inada , Kazunori Yamamoto , Akinari Kida , Atsushi Takahashi , Yoshiyuki Tsuru , Shigeharu Arike
IPC分类号： H05K3/00 , H05K3/02 , H05K3/38 , H05K3/46 , B44C1/22 , C23F1/00
CPC分类号： H05K3/4652 , H05K3/0055 , H05K2201/0209 , H05K2203/063 , H05K2203/0773 , H05K2203/0789 , H05K2203/0793 , H05K2203/0796 , H05K3/025 , H05K3/381
摘要： In a process for producing a multilayer printed circuit board comprising drilling holes for via holes in a composite film material containing at least a copper foil and an insulating half-cured adhesive layer, laminating the resulting film material on an innerlayer circuit substrate, ad electrically connecting an innerlayer circuit with an outer layer copper foil, when an adhesive resin flowed into the holes is roughened, or when a composite film material having a copper foil of less than 12 .mu.m thick formed on a carrier is used, or a special cushion material is further laminated on the laminate of the innerlayer circuit substrate and the film material, electrical connection reliability is enhanced and circuit density can be increased with easy steps.
摘要翻译：在制造多层印刷电路板的方法中，该多层印刷电路板包括至少包含铜箔和绝缘半固化粘合剂层的复合膜材料中的通孔钻孔，将所得薄膜材料层叠在内层电路基板上，电连接具有外层铜箔的内层电路当流入孔中的粘合剂树脂被粗糙化时，或者当使用形成在载体上的具有小于12μm厚的铜箔的复合膜材料或特殊的缓冲材料进一步层压在内层电路基板和膜材料的层压体上，提高了电连接的可靠性，并且通过简单的步骤可以提高电路密度。

3. 发明授权

US06281450B1 Substrate for mounting semiconductor chips 有权
标题翻译：用于安装半导体芯片的基板
公开(公告)号：US06281450B1
公开(公告)日：2001-08-28
申请号：US09446674
申请日：1999-12-27
申请人： Naoyuki Urasaki , Yasusi Simada , Yoshiyuki Tsuru , Akishi Nakaso , Itsuo Watanabe
发明人： Naoyuki Urasaki , Yasusi Simada , Yoshiyuki Tsuru , Akishi Nakaso , Itsuo Watanabe
IPC分类号： H01R909
CPC分类号： H01L24/32 , H01L21/563 , H01L23/49838 , H01L23/49894 , H01L23/5386 , H01L2224/16225 , H01L2224/27013 , H01L2224/32225 , H01L2224/45144 , H01L2224/73203 , H01L2224/73204 , H01L2224/83051 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01058 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/07811 , H01L2924/12042 , H01L2924/15192 , H05K1/114 , H05K1/189 , H05K3/28 , H05K3/323 , H05K2201/09509 , H05K2201/10674 , H01L2924/00012 , H01L2924/00 , H01L2224/0401
摘要： A substrate for mounting a semiconductor chip having bumps using an adhesive thereon, said substrate being, for instance, provided with an insulating coating having an opening in the semiconductor chip mounting area so that the wiring conductors will not be exposed to the substrate surface near the boundary of the semiconductor chip mounting area, is improved in connection reliability and has high mass productivity.
摘要翻译：用于使用粘合剂安装具有凸块的半导体芯片的基板，所述基板例如设置有在半导体芯片安装区域中具有开口的绝缘涂层，使得布线导体将不会暴露于靠近基板表面的基板表面半导体芯片安装面积的边界在连接可靠性方面提高，并且具有高的批量生产率。

4. 发明授权

US5879568A Process for producing multilayer printed circuit board for wire bonding 失效
标题翻译：用于引线接合的多层印刷电路板的制造方法
公开(公告)号：US5879568A
公开(公告)日：1999-03-09
申请号：US870379
申请日：1997-06-06
申请人： Naoyuki Urasaki , Kouichi Tsuyama , Kazuhito Kobayashi , Norio Okano , Hiroshi Shimizu , Nobuyuki Ogawa , Akishi Nakaso , Toyoki Ito , Daisuke Fujimoto , Kazuhisa Otsuka , Shigeharu Arike , Yoshiyuki Tsuru
发明人： Naoyuki Urasaki , Kouichi Tsuyama , Kazuhito Kobayashi , Norio Okano , Hiroshi Shimizu , Nobuyuki Ogawa , Akishi Nakaso , Toyoki Ito , Daisuke Fujimoto , Kazuhisa Otsuka , Shigeharu Arike , Yoshiyuki Tsuru
IPC分类号： H05K1/00 , H05K3/00 , H05K3/02 , H05K3/46 , B44C1/22
CPC分类号： H05K3/4655 , H05K3/0035 , H01L2224/32225 , H01L2224/45144 , H01L2224/48227 , H01L2224/73265 , H01L2924/01078 , H05K2201/0209 , H05K2201/0248 , H05K2201/0355 , H05K2201/0358 , H05K2203/0554 , H05K3/0094 , H05K3/025 , H05K3/4652 , H05K3/4676
摘要： A multilayer printed circuit board small in interlayer thickness, capable of fine wiring, minimized in IVH and BVH diameters, high in strength and also excellent in wire bonding workability can be produced by a process comprising the steps of coating a thermosetting resin varnish compounded with electrically insulating whiskers on a roughened side of a copper foil, semi-curing the resin by heating to form a thermosetting resin layer, integrally laminating it on an interlayer board in which plated through-holes and conductor circudits have been formed, and roughening the cured thermosetting resin layer on the via hole wall surfaces with a roughening agent.
摘要翻译：可以通过包括以下步骤的方法制备层间厚度小的能够精细布线，IVH和BVH直径最小化，强度高以及引线键合加工性优异的多层印刷电路板，其中包括以下步骤：涂覆电化学复合的热固性树脂清漆在铜箔的粗糙面上的绝缘晶须，通过加热半固化以形成热固性树脂层，将其整体地层压在已经形成电镀通孔和导体环形的夹层板上，并使固化的热固性树脂树脂层在通孔壁表面上用粗糙剂。

5. 发明授权

US4548644A Electroless copper deposition solution 失效
标题翻译：无电镀铜沉积溶液
公开(公告)号：US4548644A
公开(公告)日：1985-10-22
申请号：US535057
申请日：1983-09-23
申请人： Akishi Nakaso , Kiyoshi Yamanoi , Toshiro Okamura , Yoshiyuki Tsuru
发明人： Akishi Nakaso , Kiyoshi Yamanoi , Toshiro Okamura , Yoshiyuki Tsuru
IPC分类号： C23C18/40 , C23C3/02
CPC分类号： C23C18/40
摘要： An electroless copper deposition solution comprising (a) cupric ions, a complexing agent for cupric ions, a reducing agent and a pH adjusting agent, (b) a polyoxyethylene ether and (c) at least one member selected from the group consisting of an inorganic cyanide and .alpha.,.alpha.'-dipyridyl can give a deposited film with high elongation.
摘要翻译：一种无电解铜沉积溶液，其包含（a）铜离子，铜离子络合剂，还原剂和pH调节剂，（b）聚氧乙烯醚和（c）至少一种选自无机氰化物和α，α'-二吡啶基可以产生具有高伸长率的沉积膜。

6. 发明授权

US5935452A Resin composition and its use in production of multilayer printed circuit board 失效
标题翻译：树脂组合物及其在多层印刷电路板生产中的应用
公开(公告)号：US5935452A
公开(公告)日：1999-08-10
申请号：US188905
申请日：1998-11-10
申请人： Teiichi Inada , Yoshiyuki Tsuru , Shin Takanezawa
发明人： Teiichi Inada , Yoshiyuki Tsuru , Shin Takanezawa
IPC分类号： C08L13/00 , C08L33/08 , C08L63/00 , H05K1/03 , H05K3/00 , H05K3/46 , H01B13/00
CPC分类号： H05K3/4673 , C08L13/00 , C08L33/08 , C08L63/00 , H05K3/002 , H05K3/4655 , H05K2201/0133 , H05K2201/0195 , H05K2201/0209 , H05K2201/0355 , H05K2201/0358 , H05K2203/063 , H05K2203/0759 , H05K2203/0783 , H05K2203/122 , H05K3/4644 , H05K3/4652
摘要： A resin composition comprising (a) an epoxy resin having a number average molecular weight of 1200 or less, (b) a carboxylic acid-containing acrylic or acrylonitrile-butadiene rubber, (c) a curing agent for the epoxy resin, and (d) a curing accelerator is easily chemically etched and suitable as an insulating adhesive for producing multilayer printed circuit boards.
摘要翻译：一种树脂组合物，其包含（a）数均分子量为1200以下的环氧树脂，（b）含羧酸的丙烯酸或丁腈橡胶，（c）环氧树脂的固化剂和（d ）固化促进剂易于化学蚀刻并适合作为制造多层印刷电路板的绝缘粘合剂。

7. 发明授权

US5874009A Multilayer printed circuit board with epoxy resin and carboxylated rubber as adhesive 失效
标题翻译：多层印刷电路板采用环氧树脂和羧化橡胶作粘合剂
公开(公告)号：US5874009A
公开(公告)日：1999-02-23
申请号：US514739
申请日：1995-08-14
申请人： Teiichi Inada , Yoshiyuki Tsuru , Shin Takanezawa
发明人： Teiichi Inada , Yoshiyuki Tsuru , Shin Takanezawa
IPC分类号： C08L13/00 , C08L33/08 , C08L63/00 , H05K1/03 , H05K3/00 , H05K3/46 , B32B7/12 , B32B27/04 , B32B27/38
CPC分类号： H05K3/4673 , C08L13/00 , C08L33/08 , C08L63/00 , H05K3/002 , H05K3/4655 , H05K2201/0133 , H05K2201/0195 , H05K2201/0209 , H05K2201/0355 , H05K2201/0358 , H05K2203/063 , H05K2203/0759 , H05K2203/0783 , H05K2203/122 , H05K3/4644 , H05K3/4652
摘要： A multilayered printed circuit board is produced by (a) forming a resin layer on an inner circuit substrate and abrading it to expose the circuit conductors, (b) contacting a copper foil having a layer of insulating adhesive composed of an epoxy resin, a carboxylic acid-containing acrylic or acrylonitrile-butadiene rubber, a curing agent and accelerator with the resin layer and exposed circuit conductors, (c) removing portions necessary for connection with the copper foil and insulating adhesive exposed to the holes by etching, (d) connecting the copper foil with circuits exposed to the holes and forming a surface circuit by processing the outer layer of the copper foil, and (e) repeating steps (a) to (d) to obtained a multilayered structure.
摘要翻译：通过（a）在内部电路基板上形成树脂层并研磨以暴露电路导体，（b）使具有由环氧树脂，羧酸的绝缘粘合剂层的铜箔接触而制造多层印刷电路板含酸的丙烯酸或丙烯腈 - 丁二烯橡胶，具有树脂层和暴露的电路导体的固化剂和加速剂，（c）去除与铜箔连接所需的部分和通过蚀刻暴露于孔的绝缘胶，（d）连接具有暴露于孔的电路的铜箔，通过加工铜箔的外层形成表面电路，以及（e）重复步骤（a）至（d）以获得多层结构。

8. 发明申请

US20060127832A1 Hydrogen combustion device having hydrogen pipe 审中-公开
标题翻译：具有氢管的氢燃烧装置
公开(公告)号：US20060127832A1
公开(公告)日：2006-06-15
申请号：US10540508
申请日：2003-11-21
申请人： Tamotsu Sugimoto , Koichi Yamaguchi , Yoshiyuki Tsuru
发明人： Tamotsu Sugimoto , Koichi Yamaguchi , Yoshiyuki Tsuru
IPC分类号： F23D3/40
CPC分类号： F23C13/00 , F23C2900/9901 , F23D14/58
摘要： A hydrogen combustion device includes a casing 30, a hydrogen source, a hydrogen pipe 39 to supply hydrogen gas from the hydrogen source into the casing 30, a mixer 10 on the downstream side of the pipe 39, for stirring a mixed gas and a combustion catalyst 20. The hydrogen pipe 39 has a hydrogen pipe body 40 and a hydrogen ejecting part 41 with hydrogen ejecting orifices 42. In the hydrogen combustion device, the hydrogen ejecting part 41 is positioned at a substantial center in the cross section of an air passage in the casing 30, extending along the flowing direction of the airflow in the air passage. The hydrogen ejecting orifices 40 are arranged so that their axes extend in the radial direction of the hydrogen ejecting part 41, substantially perpendicularly to the flowing direction of the airflow.
摘要翻译：氢燃烧装置包括壳体30，氢源，从氢源向壳体30供给氢气的氢管39，在管39的下游侧的混合器10，用于搅拌混合气体和燃烧催化剂20。氢管39具有氢管主体40和具有氢喷射孔42的氢喷射部41。在氢燃烧装置中，氢气喷射部41位于壳体30的空气通路的截面中的大致中央，沿空气通路内的气流的流动方向延伸。氢喷射孔40被布置成使得它们的轴线大致垂直于气流的流动方向在氢喷射部分41的径向方向上延伸。

9. 发明授权

US6042685A Multiple wire printed circuit board and process for making the same 有权
标题翻译：多线印刷电路板及其制造方法
公开(公告)号：US6042685A
公开(公告)日：2000-03-28
申请号：US192213
申请日：1998-11-16
申请人： Eiichi Shinada , Shigeharu Arike , Takayuki Suzuki , Yoshiyuki Tsuru
发明人： Eiichi Shinada , Shigeharu Arike , Takayuki Suzuki , Yoshiyuki Tsuru
IPC分类号： C09J163/00 , C09J179/08 , H05K1/00 , H05K3/10 , H05K3/38 , H05K3/42 , H05K3/46 , H05K3/00
CPC分类号： H05K3/4626 , H05K3/429 , H05K2201/0154 , H05K2201/09536 , H05K2201/10287 , H05K3/103 , H05K3/386 , H05K3/4623 , H05K3/4676 , Y10S428/901 , Y10T29/49144 , Y10T428/24322 , Y10T428/24843 , Y10T428/2495 , Y10T428/287 , Y10T428/2887
摘要： A multiple wire printed circuit board including printed conductor circuit layers, adhesive layers with wires having insulating coating embedded and fixed therein, insulating layers, and connecting through-holes formed at locations where connections will be made, wherein the conductor circuit layers are insulated from other circuit conductors, and the difference in glass transition point between each adhesive layer and the adjoining insulating layer is within the range of 60.degree. C., remains free of peel and voids despite heat history applied to the board, and is capable of high-density wiring, multiplication of circuit layers and a reduction of the number of the manufacturing steps.
摘要翻译：包括印刷导体电路层的多线印刷电路板，具有嵌入并固定其中的绝缘涂层的线的粘合剂层，绝缘层和形成在连接处的连接通孔，其中导体电路层与其它绝缘层绝缘电路导体，并且每个粘合剂层和相邻的绝缘层之间的玻璃化转变点的差异在60℃的范围内，尽管热历史施加到板上仍然没有剥离和空隙，并且能够高密度布线，电路层的乘法和制造步骤的数量的减少。

10. 发明授权

US5914649A Chip fuse and process for production thereof 失效
标题翻译：芯片保险丝及其制造方法
公开(公告)号：US5914649A
公开(公告)日：1999-06-22
申请号：US991601
申请日：1997-12-16
申请人： Tadashi Isono , Yoshiyuki Tsuru , Yutaka Taniguchi , Fumio Suzuki
发明人： Tadashi Isono , Yoshiyuki Tsuru , Yutaka Taniguchi , Fumio Suzuki
IPC分类号： H01H85/041 , H01H85/046 , H01H85/06 , H01H85/08
CPC分类号： H01H85/0411 , H01H85/046
摘要： A chip fuse comprising an organic resin-made insulating substrate, a pair of electrodes formed at terminals of said organic resin-made insulating substrate, current protecting element wiring portions and a current protecting element positioned between said pair of electrodes and housed in said organic resin-made insulating substrate, said current protecting element having a thickness of 3-8 .mu.m and being supported on an organic resin layer having a high tracking resistance, and at least one space being formed at least on the current protecting element side, does not cause ignition nor smoking and is excellent in clearing characteristics.
摘要翻译：一种芯片熔丝，包括有机树脂制绝缘基板，在所述有机树脂制绝缘基板的端子处形成的一对电极，电流保护元件布线部分和位于所述一对电极之间的电流保护元件，并且容纳在所述有机树脂所述电流保护元件的厚度为3-8μm，并且被支撑在具有高跟踪电阻的有机树脂层上，并且至少一个至少形成在当前保护元件侧的空间不是引起点火或吸烟，清除特性极好。

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