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1. 发明授权

US06242838B1 Commutator and method of manufacturing the same 有权
标题翻译：换向器及其制造方法
公开(公告)号：US06242838B1
公开(公告)日：2001-06-05
申请号：US09241291
申请日：1999-02-01
申请人： Kenzo Kiyose , Yoshio Ebihara , Keiichi Yamashita , Mutsumi Yoshino , Yoshitsugu Sakamoto , Motoya Ito
发明人： Kenzo Kiyose , Yoshio Ebihara , Keiichi Yamashita , Mutsumi Yoshino , Yoshitsugu Sakamoto , Motoya Ito
IPC分类号： H02K1306
CPC分类号： H02K13/04 , H01R39/06 , H01R39/32
摘要： A commutator is composed of a contact unit, a base member made of insulation material and a terminal unit. The contact unit has a flat brush-contact surface and a connection surface opposite the brush contact surface. The contact unit also has a plurality of commutator segments. The terminal unit has a plurality of conductive terminal members. The base member supports the commutator segments. The commutator also has an electrical connection structure having a set of a convex member and a concave member and a plurality of connection members disposed between the convex member and the concave member to connect the plurality of the commutator segments and terminal members respectively.
摘要翻译：换向器由接触单元，由绝缘材料制成的基座构件和端子单元构成。接触单元具有平坦的电刷接触表面和与电刷接触表面相对的连接表面。接触单元还具有多个换向片段。端子单元具有多个导电端子构件。基座构件支撑换向器段。换向器还具有一个电气连接结构，其具有一组凸起部件和凹形部件，以及多个连接部件，分别设置在凸部件和凹部件之间，以分别连接多个换向器部件和端子部件。

2. 发明授权

US07829387B2 Electronic apparatus and method of manufacturing the same 有权
标题翻译：电子设备及其制造方法
公开(公告)号：US07829387B2
公开(公告)日：2010-11-09
申请号：US12385693
申请日：2009-04-16
申请人： Masashi Yamasaki , Mutsumi Yoshino
发明人： Masashi Yamasaki , Mutsumi Yoshino
IPC分类号： H01L21/00
CPC分类号： H05K7/142 , H05K3/202 , H05K3/341 , H05K2201/091 , H05K2201/10598 , H05K2203/175 , Y10T29/49144
摘要： An electronic apparatus includes metal wiring plates placed together in the same plane to provide a wiring circuit, electronic devices mounted to the wiring plates through a solder, a case having a base portion and columnar portions extending from the base portion. The wiring plates are fixed to the columnar portions such that the wiring circuit is spaced from the base portion. The wiring plates have an enough thickness to resist a large current for operating the electronic devices and to release heat generated by the electronic devices. The wiring circuit is spaced from the base portion of the case so that the heat generated by the electronic devices is released in the space efficiently. The electronic devices are soldered to the wiring plates at once in a thermal reflow process.
摘要翻译：电子设备包括在同一平面上放置在一起以提供布线电路的金属布线板，通过焊料安装到布线板的电子设备，具有从基部延伸的基部和柱状部分的壳体。布线板固定在柱状部分上，使得布线电路与基部间隔开。布线板具有足够的厚度以抵抗用于操作电子设备的大电流并且释放由电子设备产生的热量。布线电路与壳体的基部间隔开，使得由电子设备产生的热量有效地释放在空间中。电子器件在热回流工艺中立即焊接到布线板上。

3. 发明授权

US08054647B2 Electronic device mounting structure for busbar 失效
标题翻译：母线电子装置安装结构
公开(公告)号：US08054647B2
公开(公告)日：2011-11-08
申请号：US12203408
申请日：2008-09-03
申请人： Akio Yasuda , Mutsumi Yoshino
发明人： Akio Yasuda , Mutsumi Yoshino
IPC分类号： H05K1/11 , H05K1/14
CPC分类号： H05K3/3421 , H05K1/056 , H05K1/111 , H05K3/202 , H05K3/4092 , H05K2201/0382 , H05K2201/0397 , H05K2201/10272 , Y02P70/611 , Y02P70/613
摘要： An electronic device mounting structure includes an electronic device, a busbar, and a solder. The electronic device has a body and a lead protruding from the body. The busbar has a flat portion and a wall portion rising from a periphery of the flat portion. The flat portion of the busbar extends parallel to a tip portion of the lead and is in contact with a back surface of the tip portion. The wall portion of the busbar faces a side surface of the tip portion with a predetermined space. The solder is located in the space and joins the side surface of the tip portion and the wall portion of the busbar.
摘要翻译：电子装置安装结构包括电子装置，母线和焊料。电子设备具有从主体突出的主体和引线。母线具有平坦部分和从平坦部分的周边上升的壁部分。母线的平坦部分平行于引线的尖端部分延伸并与尖端部分的后表面接触。母线的壁部分以预定的空间面对尖端部分的侧表面。焊料位于该空间中并且连接在顶端部分的侧表面和母线的壁部分上。

4. 发明申请

US20090199400A1 Electronic apparatus and method of manufacturing the same 有权
标题翻译：电子设备及其制造方法
公开(公告)号：US20090199400A1
公开(公告)日：2009-08-13
申请号：US12385693
申请日：2009-04-16
申请人： Masashi Yamasaki , Mutsumi Yoshino
发明人： Masashi Yamasaki , Mutsumi Yoshino
IPC分类号： H05K3/34
CPC分类号： H05K7/142 , H05K3/202 , H05K3/341 , H05K2201/091 , H05K2201/10598 , H05K2203/175 , Y10T29/49144
摘要： An electronic apparatus includes metal wiring plates placed together in the same plane to provide a wiring circuit, electronic devices mounted to the wiring plates through a solder, a case having a base portion and columnar portions extending from the base portion. The wiring plates are fixed to the columnar portions such that the wiring circuit is spaced from the base portion. The wiring plates have an enough thickness to resist a large current for operating the electronic devices and to release heat generated by the electronic devices. The wiring circuit is spaced from the base portion of the case so that the heat generated by the electronic devices is released in the space efficiently. The electronic devices are soldered to the wiring plates at once in a thermal reflow process.
摘要翻译：电子设备包括在同一平面上放置在一起以提供布线电路的金属布线板，通过焊料安装到布线板的电子设备，具有从基部延伸的基部和柱状部分的壳体。布线板固定在柱状部分上，使得布线电路与基部间隔开。布线板具有足够的厚度以抵抗用于操作电子设备的大电流并且释放由电子设备产生的热量。布线电路与壳体的基部间隔开，使得由电子设备产生的热量有效地释放在空间中。电子器件在热回流工艺中立即焊接到布线板上。

5. 发明申请

US20090071683A1 ELECTRONIC DEVICE MOUNTING STRUCTURE AND METHOD OF MAKING THE SAME 审中-公开
标题翻译：电子设备安装结构及其制造方法
公开(公告)号：US20090071683A1
公开(公告)日：2009-03-19
申请号：US12209513
申请日：2008-09-12
申请人： Akio Yasuda , Mutsumi Yoshino
发明人： Akio Yasuda , Mutsumi Yoshino
IPC分类号： H02G5/00 , H01R43/00
CPC分类号： H05K1/0263 , H01L2924/0002 , H05K1/056 , H05K1/144 , H05K3/202 , H05K3/3447 , H05K2201/0397 , H05K2201/10272 , H05K2201/10409 , H05K2201/10689 , H05K2201/10757 , Y10T29/49117 , H01L2924/00
摘要： An electronic device mounting structure includes a printed circuit board, a busbar, and an electronic device mounted on the busbar. The busbar includes a parallel portion extending parallel to the printed circuit board and a bent portion extending from the parallel portion toward the printed circuit board. The bent portion of the busbar includes a first bent portion, a second bent portion, and a tip portion A thickness direction of the first bent portion is substantially parallel to a length direction of the parallel portion A thickness direction of the second bent portion is substantially parallel to a width direction of the parallel portion. The tip portion stands substantially at a right angle with respect to the second bent portion and is soldered to the printed circuit board.
摘要翻译：电子装置安装结构包括印刷电路板，母线和安装在母线上的电子装置。母线包括平行于印刷电路板延伸的平行部分和从平行部分向印刷电路板延伸的弯曲部分。母线的弯曲部分包括第一弯曲部分，第二弯曲部分和尖端部分A，第一弯曲部分的厚度方向基本上平行于平行部分A的长度方向。第二弯曲部分的厚度方向基本上相等平行于平行部分的宽度方向。尖端部相对于第二弯曲部基本上成直角地固定，并被焊接到印刷电路板。

6. 发明申请

US20090059548A1 ELECTRONIC DEVICE MOUNTING STRUCTURE FOR BUSBAR 失效
标题翻译：用于母线的电子设备安装结构
公开(公告)号：US20090059548A1
公开(公告)日：2009-03-05
申请号：US12203408
申请日：2008-09-03
申请人： Akio Yasuda , Mutsumi Yoshino
发明人： Akio Yasuda , Mutsumi Yoshino
IPC分类号： H05K7/04
CPC分类号： H05K3/3421 , H05K1/056 , H05K1/111 , H05K3/202 , H05K3/4092 , H05K2201/0382 , H05K2201/0397 , H05K2201/10272 , Y02P70/611 , Y02P70/613
摘要： An electronic device mounting structure includes an electronic device, a busbar, and a solder. The electronic device has a body and a lead protruding from the body. The busbar has a flat portion and a wall portion rising from a periphery of the flat portion. The flat portion of the busbar extends parallel to a tip portion of the lead and is in contact with a back surface of the tip portion. The wall portion of the busbar faces a side surface of the tip portion with a predetermined space. The solder is located in the space and joins the side surface of the tip portion and the wall portion of the busbar
摘要翻译：电子装置安装结构包括电子装置，母线和焊料。电子设备具有从主体突出的主体和引线。母线具有平坦部分和从平坦部分的周边上升的壁部分。母线的平坦部分平行于引线的尖端部分延伸并与尖端部分的后表面接触。母线的壁部分以预定的空间面对尖端部分的侧表面。焊料位于该空间中并且连接在顶端部分的侧表面和母线的壁部分上

7. 发明申请

US20070127218A1 Electronic apparatus and method of manufacturing the same 失效
标题翻译：电子设备及其制造方法
公开(公告)号：US20070127218A1
公开(公告)日：2007-06-07
申请号：US11607922
申请日：2006-12-04
申请人： Masashi Yamasaki , Mutsumi Yoshino
发明人： Masashi Yamasaki , Mutsumi Yoshino
IPC分类号： H05K5/00
CPC分类号： H05K7/142 , H05K3/202 , H05K3/341 , H05K2201/091 , H05K2201/10598 , H05K2203/175 , Y10T29/49144
摘要： An electronic apparatus includes metal wiring plates placed together in the same plane to provide a wiring circuit, electronic devices mounted to the wiring plates through a solder, a case having a base portion and columnar portions extending from the base portion. The wiring plates are fixed to the columnar portions such that the wiring circuit is spaced from the base portion. The wiring plates have an enough thickness to resist a large current for operating the electronic devices and to release heat generated by the electronic devices. The wiring circuit is spaced from the base portion of the case so that the heat generated by the electronic devices is released in the space efficiently. The electronic devices are soldered to the wiring plates at once in a thermal reflow process.
摘要翻译：电子设备包括在同一平面上放置在一起以提供布线电路的金属布线板，通过焊料安装到布线板的电子设备，具有从基部延伸的基部和柱状部分的壳体。布线板固定在柱状部分上，使得布线电路与基部间隔开。布线板具有足够的厚度以抵抗用于操作电子设备的大电流并且释放由电子设备产生的热量。布线电路与壳体的基部间隔开，使得由电子设备产生的热量有效地释放在空间中。电子器件在热回流工艺中立即焊接到布线板上。

8. 发明授权

US6033189A Control valve 失效
标题翻译：控制阀
公开(公告)号：US6033189A
公开(公告)日：2000-03-07
申请号：US078270
申请日：1998-05-13
申请人： Shintaro Miura , Ken Suitou , Masahiro Kawaguchi , Tetsuhiko Fukanuma , Hiroshi Kubo , Ryo Matsubara , Masatoshi Hiramatsu , Michiyasu Nosaka , Kazuhito Miyagawa , Shinya Miura , Mutsumi Yoshino
发明人： Shintaro Miura , Ken Suitou , Masahiro Kawaguchi , Tetsuhiko Fukanuma , Hiroshi Kubo , Ryo Matsubara , Masatoshi Hiramatsu , Michiyasu Nosaka , Kazuhito Miyagawa , Shinya Miura , Mutsumi Yoshino
IPC分类号： F16K31/06 , F04B1/26
CPC分类号： F16K31/0655
摘要： An improved displacement control valve incorporated in a variable displacement compressor. The control valve includes a valve body and a solenoid for actuating the valve body. The coil of the solenoid is wound about a bobbin made of insulating synthetic resin. A base plate integrally protrudes from the bobbin. A pair of conducting plates are secured to the base plate. Each plate has a clamping block. The coil has a pair of terminal wires. Each terminal wire is secured to and electrically corrected to one of the clamping blocks. Each terminal wire is wound about a holder formed in each plate between the bobbin and the corresponding clamping block. A diode is secured to the holders and is connected in parallel with the coil. A pair of terminals of the diode are secured to the corresponding holders by soldering and crimping. The holders prevent tension in the terminal wires from being applied to electrical joints formed between the wires and the clamping blocks, which makes the valve more reliable.
摘要翻译：一种结合在可变排量压缩机中的改进的排量控制阀。控制阀包括阀体和用于致动阀体的螺线管。螺线管的线圈缠绕在由绝缘合成树脂制成的线轴上。底板从筒管一体地突出。一对导电板固定在基板上。每个板都有一个夹紧块。线圈有一对端子线。每个端子线被固定到一个夹紧块并且被电校正。每个端子线缠绕在形成在每个板之间的保持架上，在线轴和相应的夹紧块之间。二极管固定在支架上并与线圈并联连接。二极管的一对端子通过焊接和压接固定到相应的保持器上。保持器防止端子线中的张力施加到形成在电线和夹紧块之间的电接头，这使得阀更可靠。

9. 发明授权

US07679170B2 Electronic apparatus with wiring plates fixed directly to columns to space wiring circuit from base 失效
标题翻译：具有布线板的电子设备直接固定在列上，以将布线电路与基座隔开
公开(公告)号：US07679170B2
公开(公告)日：2010-03-16
申请号：US11607922
申请日：2006-12-04
申请人： Masashi Yamasaki , Mutsumi Yoshino
发明人： Masashi Yamasaki , Mutsumi Yoshino
IPC分类号： H05K3/34 , H01L23/48
CPC分类号： H05K7/142 , H05K3/202 , H05K3/341 , H05K2201/091 , H05K2201/10598 , H05K2203/175 , Y10T29/49144
摘要： An electronic apparatus includes metal wiring plates placed together in the same plane to provide a wiring circuit, electronic devices mounted to the wiring plates through a solder, a case having a base portion and columnar portions extending from the base portion. The wiring plates are fixed to the columnar portions such that the wiring circuit is spaced from the base portion. The wiring plates have an enough thickness to resist a large current for operating the electronic devices and to release heat generated by the electronic devices. The wiring circuit is spaced from the base portion of the case so that the heat generated by the electronic devices is released in the space efficiently. The electronic devices are soldered to the wiring plates at once in a thermal reflow process.
摘要翻译：电子设备包括在同一平面上放置在一起以提供布线电路的金属布线板，通过焊料安装到布线板的电子设备，具有从基部延伸的基部和柱状部分的壳体。布线板固定在柱状部分上，使得布线电路与基部间隔开。布线板具有足够的厚度以抵抗用于操作电子设备的大电流并且释放由电子设备产生的热量。布线电路与壳体的基部间隔开，使得由电子设备产生的热量有效地释放在空间中。电子器件在热回流工艺中立即焊接到布线板上。

10. 发明授权

US07582552B2 Electronic apparatus with busbar assembly and electronic component mounted thereon by soldering 有权
标题翻译：具有母线组合的电子设备和通过焊接安装在其上的电子部件
公开(公告)号：US07582552B2
公开(公告)日：2009-09-01
申请号：US11976988
申请日：2007-10-30
申请人： Masashi Yamasaki , Mutsumi Yoshino
发明人： Masashi Yamasaki , Mutsumi Yoshino
IPC分类号： H01L21/44 , H01L21/50 , H01L21/48 , H01L23/52 , H01L23/48 , H01L29/40 , H01L23/488
CPC分类号： H05K3/3421 , H01L23/49551 , H01L23/49575 , H01L23/49582 , H01L2924/0002 , H05K3/202 , H05K3/3463 , H05K2201/10689 , Y02P70/613 , Y10T29/49002 , H01L2924/00
摘要： In an electronic apparatus, a busbar assembly is composed of busbars made of at least one previously selected metal material. Each of the busbars has one surface. A solder joint is made of an alloy of previously selected metal materials and placed on the one surface of at least one busbar. The solder joint is changed from a molten state to a solid state to thereby mechanically and electrically connect an electronic component to the one surface of the at least one busbar. The at least one previously selected metal material of the at least one busbar and the previously selected metal materials of the alloy of the solder joint determine that a contact angle of the molten solder joint to the one surface of the at least one busbar is within an angular range of 40 to 60 degrees.
摘要翻译：在电子设备中，母线组件由由至少一个先前选择的金属材料制成的母线组成。每个母线都有一个表面。焊接接头由先前选择的金属材料的合金制成并且放置在至少一个母线的一个表面上。焊接点从熔融状态改变为固态，从而将电子部件机械地和电气地连接到至少一个母线的一个表面。至少一个母线的至少一个先前选择的金属材料和焊料接头的合金的先前选择的金属材料确定熔融焊接接头与至少一个母线的一个表面的接触角在角度范围为40至60度。

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