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1. 发明授权

US5667853A Multilayered conductive film, and transparent electrode substrate and liquid crystal device using the same 失效
标题翻译：多层导电膜，透明电极基板及使用其的液晶装置
公开(公告)号：US5667853A
公开(公告)日：1997-09-16
申请号：US619240
申请日：1996-03-21
申请人： Kenzo Fukuyoshi , Yukihiro Kimura , Koji Imayoshi , Osamu Koga , Katsunori Horachi
发明人： Kenzo Fukuyoshi , Yukihiro Kimura , Koji Imayoshi , Osamu Koga , Katsunori Horachi
IPC分类号： C23C14/08 , G02F1/1343
CPC分类号： C23C14/086 , G02F1/13439 , G02F2203/02 , Y10T428/1095
摘要： A multilayered conductive film has a silver-based layer formed of a silver-based metallic material. A first transparent oxide layer is provided on one surface of the silver-based layer, and a second transparent oxide layer is provided on the other surface of the silver-based layer. The first and second transparent oxide layers are independently formed of a compound oxide material of indium oxide with at least one secondary metal oxide whose metallic element has substantially no solid solubility in silver.
摘要翻译：多层导电膜具有由银系金属材料形成的银基层。在银基层的一个表面上设置第一透明氧化物层，并且在银基层的另一个表面上设置第二透明氧化物层。第一透明氧化物层和第二透明氧化物层独立地由氧化铟复合氧化物材料和至少一种金属元素在银中基本上不具有固溶度的二次金属氧化物形成。

2. 发明授权

US06249082B1 Electrode plate having transparent type or reflective type multi-layered conductive film and method for manufacturing the same 失效
标题翻译：具有透明型或反射型多层导电膜的电极板及其制造方法
公开(公告)号：US06249082B1
公开(公告)日：2001-06-19
申请号：US09228644
申请日：1999-01-12
申请人： Kenzo Fukuyoshi , Yukihiro Kimura , Koji Imayoshi
发明人： Kenzo Fukuyoshi , Yukihiro Kimura , Koji Imayoshi
IPC分类号： G02F11343
CPC分类号： G02F1/13439 , G02F2203/01 , G02F2203/02 , Y10T428/2958 , Y10T428/2991
摘要： An electrode plate for display device includes a substrate and a multi-layered conductive film. The multi-layered conductive film includes a lower side amorphous oxide layer, a silver-based layer, and an upper side amorphous oxide layer. The lower side amorphous oxide layer and the upper side amorphous oxide layer are formed of an amorphous and amorphous-like material. The film thickness of the upper side amorphous oxide layer is not larger than 20 nm.
摘要翻译：用于显示装置的电极板包括基板和多层导电膜。多层导电膜包括下侧无定形氧化物层，银基层和上侧无定形氧化物层。下侧无定形氧化物层和上侧无定形氧化物层由无定形和非晶态材料形成。上侧无定形氧化物层的膜厚不大于20nm。

3. 发明申请

US20070226715A1 Application server system and computer product 有权
标题翻译：应用服务器系统和计算机产品
公开(公告)号：US20070226715A1
公开(公告)日：2007-09-27
申请号：US11477165
申请日：2006-06-28
申请人： Yukihiro Kimura , Masakazu Hayashi , Masafumi Hashiguchi , Hidetoshi Hattori
发明人： Yukihiro Kimura , Masakazu Hayashi , Masafumi Hashiguchi , Hidetoshi Hattori
IPC分类号： G06F9/45
CPC分类号： G06F9/45516
摘要： A recovery virtual machine acquires execution frequency information from a file, and converts a procedure, of which execution frequency is high in the execution frequency information acquired, to native code, and the time for starting the conversion is thereby reduced. Furthermore, by performing conversion at a timing at which a target procedure is invoked, load occurring due to the conversion is distributed, to prevent occurrence of failure in execution of an application caused by the load occurring due to the conversion.
摘要翻译：恢复虚拟机从文件获取执行频率信息，并且将所获取的执行频率信息中的执行频率高的过程转换为本地代码，从而减少开始转换的时间。此外，通过在调用目标过程的定时进行转换，分配由于转换而发生的负载，以防止由于转换而产生的负载导致的应用执行失败。

4. 发明授权

US5400210A Substrate having a built-in capacitor and process for producing the same 失效
标题翻译：具有内置电容器的基板及其制造方法
公开(公告)号：US5400210A
公开(公告)日：1995-03-21
申请号：US80107
申请日：1993-06-23
申请人： Noriyasu Sugimoto , Yukihiro Kimura , Masaharu Seto
发明人： Noriyasu Sugimoto , Yukihiro Kimura , Masaharu Seto
IPC分类号： H01B3/12 , H01G4/08 , H01G4/12 , H01L23/12 , H01L23/15 , H05K1/16 , H05K3/46 , H01G4/10
CPC分类号： H01G4/08
摘要： In a substrate having built-in capacitor which is incorporated in and united with an insulator, the capacitor has a dielectric layer made of a silicon nitride-based ceramic containing silicon carbide in an amount of from 13 to 30% by weight.
摘要翻译：在具有内置电容器的衬底中，该绝缘体并入并结合在一起，该电容器具有由含有13至30重量％的碳化硅的氮化硅基陶瓷制成的电介质层。

5. 发明授权

US5250244A Method of producing sintered ceramic body 失效
标题翻译：烧结陶瓷体的制造方法
公开(公告)号：US5250244A
公开(公告)日：1993-10-05
申请号：US911782
申请日：1992-07-10
申请人： Yukihiro Kimura , Sumihito Tominaga , Rokuro Kanbe
发明人： Yukihiro Kimura , Sumihito Tominaga , Rokuro Kanbe
IPC分类号： C04B35/111 , C04B35/185 , C04B35/622 , C04B35/64
CPC分类号： C04B35/622 , C04B35/111 , C04B35/185
摘要： A method of producing a sintered body by molding a mixture of a ceramic base powder, a sintering assistant powder and an organic binder and sintering the molded body in a non-oxidizing atmosphere is disclosed in which the ceramic base powder has such a particle size distribution that the amount of powder particles not greater than 1.0 .mu.m in size is not more than 15% by weight and the average particle diameter is not greater than 5 .mu.m. According to the method, therefore, sufficient passage of gas is secured in a degreasing step, resulting in an enhanced degreasing efficiency and exellent sintering properties. Where the sintering assistant powder has such a particle size distribution that the amount of powder particles not greater than 10 .mu.m in size is not more than 5% by weight, the amount of coarse powder is extremely small and, therefore, large voids are not formed. It is thus possible to produce easily a high-quality sintered body by controlling the respective particle size distributions of the powders.
摘要翻译：公开了一种通过模制陶瓷基底粉末，烧结辅助粉末和有机粘合剂的混合物并在非氧化性气氛中烧结成型体来制造烧结体的方法，其中陶瓷基础粉末具有这样的粒度分布不大于1.0μm的粉末颗粒的量不大于15重量％，平均粒径不大于5μm。因此，根据该方法，在脱脂工序中确保充分的气体通过，从而提高脱脂效率和良好的烧结性能。当烧结辅助粉末具有这样的粒度分布，其尺寸不大于10微米的粉末颗粒的量不大于5重量％时，粗粉末的量非常小，因此，大的空隙不是形成。因此，通过控制粉末的各自的粒度分布，可以容易地制造高品质的烧结体。

6. 发明授权

US4690872A Ceramic heater 失效
标题翻译：陶瓷加热器
公开(公告)号：US4690872A
公开(公告)日：1987-09-01
申请号：US876643
申请日：1986-06-16
申请人： Norio Kato , Shunkichi Nozaki , Yukihiro Kimura , Rokuro Kambe
发明人： Norio Kato , Shunkichi Nozaki , Yukihiro Kimura , Rokuro Kambe
IPC分类号： H05B3/20 , C04B41/50 , C04B41/87 , C21B9/00 , C23C16/42 , H05B3/06 , H05B3/22
CPC分类号： C04B41/009 , C04B41/5062 , C04B41/87 , C21B9/00 , C23C16/42 , H05B3/06
摘要： A ceramic heater comprising a ceramic substrate is described which has formed thereon a layer of a silicide of an element selected from groups IVa, Va and VIa of the periodic table. The heater has stable temperature vs. resistance characteristics, has high mechanical strength and produces the desired temperature in a very short period of time.
摘要翻译：描述了一种陶瓷加热器，其包括陶瓷基板，其上形成了选自元素周期表的IVa，Va和VIa族元素的硅化物层。加热器具有稳定的温度对电阻特性，具有高的机械强度并在很短的时间内产生所需的温度。

7. 发明授权

US08332845B2 Compile timing based on execution frequency of a procedure 有权
标题翻译：基于程序的执行频率编译时序
公开(公告)号：US08332845B2
公开(公告)日：2012-12-11
申请号：US11477165
申请日：2006-06-28
申请人： Yukihiro Kimura , Masakazu Hayashi , Masafumi Hashiguchi , Hidetoshi Hattori
发明人： Yukihiro Kimura , Masakazu Hayashi , Masafumi Hashiguchi , Hidetoshi Hattori
IPC分类号： G06F9/455
CPC分类号： G06F9/45516
摘要： A recovery virtual machine acquires execution frequency information from a file, and converts a procedure, of which execution frequency is high in the execution frequency information acquired, to native code, and the time for starting the conversion is thereby reduced. Furthermore, by performing conversion at a timing at which a target procedure is invoked, load occurring due to the conversion is distributed, to prevent occurrence of failure in execution of an application caused by the load occurring due to the conversion.
摘要翻译：恢复虚拟机从文件获取执行频率信息，并且将所获取的执行频率信息中的执行频率高的过程转换为本地代码，从而减少开始转换的时间。此外，通过在调用目标过程的定时进行转换，分配由于转换而发生的负载，以防止由于转换而产生的负载导致的应用执行失败。

8. 发明授权

US07102085B2 Wiring substrate 有权
公开(公告)号：US07102085B2
公开(公告)日：2006-09-05
申请号：US10103039
申请日：2002-03-22
申请人： Sumio Ohta , Mitsuru Tamaki , Yukihiro Kimura
发明人： Sumio Ohta , Mitsuru Tamaki , Yukihiro Kimura
IPC分类号： H05K1/16
CPC分类号： H05K1/0231 , H01L23/49833 , H01L23/642 , H01L24/81 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16235 , H01L2224/81801 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19106 , H01L2924/30107 , H01L2924/3511 , H05K1/186 , H05K3/4602 , H01L2924/00 , H01L2224/05599
摘要： A wiring substrate is configured such that a build-up layer is formed only on a front surface (a single side) of a core substrate and such that the distance between a semiconductor device mounted on the front surface thereof and an electronic component mounted on the back surface thereof or incorporated therein behind the back surface is reduced to thereby enhance electrical characteristics of an electrically continuous path therebetween, and whose overall strength is enhanced so as not to be prone to deflection or warpage. The wiring substrate includes a relatively thin first core substrate 2 having a front surface 3 and a back surface 4; a relatively thick second core substrate 6 superposed on the back surface 4 of the first core substrate 2 and having a through opening 9 formed therein, the first substrate 2 and the through opening 9 defining a recess 9; and a build-up layer BU formed on the front surface 3 of the first core substrate 2 and including wiring layers 16 and 25 and dielectric layers 23 and 26.

9. 发明授权

US06979890B2 Intermediate substrate 有权
标题翻译：中间基材
公开(公告)号：US06979890B2
公开(公告)日：2005-12-27
申请号：US11127192
申请日：2005-05-12
申请人： Rokuro Kambe , Tetsuya Kasiwagi , Yukihiro Kimura , Yasuhiro Sugimoto , Kazuhiro Suzuki
发明人： Rokuro Kambe , Tetsuya Kasiwagi , Yukihiro Kimura , Yasuhiro Sugimoto , Kazuhiro Suzuki
IPC分类号： H01F5/00 , H01L23/02 , H01L23/12 , H01L23/498 , H01L23/50 , H05K1/11 , H05K3/46
CPC分类号： H01L23/50 , H01L23/49822 , H01L23/49827 , H01L23/49833 , H01L23/49838 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2224/16225 , H01L2224/16235 , H01L2924/00014 , H01L2924/01012 , H01L2924/01019 , H01L2924/01025 , H01L2924/01078 , H01L2924/09701 , H01L2924/15174 , H01L2924/15311 , H01L2924/3011 , H05K1/112 , H05K3/4602 , H05K3/4694 , H05K2201/0187 , H05K2201/10674 , H01L2224/05599
摘要： An intermediate substrate is provided which reduces the effect of the difference in the coefficients of linear expansion between the terminals of the substrate and those of a semiconductor integrated circuit device, and which thus lowers the likelihood of disconnection due to thermal stress. The intermediate substrate, which is a planar member made of a polymeric material, includes a substrate core including a main core body having formed therein a sub-core compartment, and a ceramic sub-core section accommodated in the compartment. A first terminal array on the first principal surface side includes two types of terminals, functioning either as power source terminals or ground terminals, and a signal terminal. The array occupies an area entirely included within an orthogonally projected region of the sub-core section projected onto a reference plane parallel to the planar surface of the substrate core.
摘要翻译：提供了一种中间衬底，其减小了衬底的端子与半导体集成电路器件的端子之间的线性膨胀系数的差异的影响，从而降低了由于热应力引起的断开的可能性。作为由聚合物材料制成的平面构件的中间基板包括：基材芯，其包括形成有副芯隔室的主芯体和容纳在隔室中的陶瓷副芯部。第一主表面侧的第一端子阵列包括用作电源端子或接地端子的两种类型的端子和信号端子。阵列占据完全包括在子芯部分的正交投影区域内的区域，该区域投影到平行于衬底芯的平面表面的参考平面上。

10. 发明申请

US20050207091A1 Intermediate substrate 有权
标题翻译：中间基材
公开(公告)号：US20050207091A1
公开(公告)日：2005-09-22
申请号：US11126157
申请日：2005-05-11
申请人： Rokuro Kambe , Yukihiro Kimura , Yasuhiro Sugimoto , Kazuhiro Suzuki
发明人： Rokuro Kambe , Yukihiro Kimura , Yasuhiro Sugimoto , Kazuhiro Suzuki
IPC分类号： H01L23/12 , H01G4/228 , H01L23/498 , H01L23/50 , H01L27/01 , H05K1/02 , H05K1/11 , H05K1/18 , H05K3/46
CPC分类号： H05K1/0231 , H01L23/498 , H01L23/49816 , H01L23/50 , H01L27/016 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/15174 , H01L2924/15311 , H01L2924/3011 , H05K1/112 , H05K1/185 , H05K3/4602 , H05K2201/10712 , H01L2224/05599
摘要： An intermediate substrate includes a substrate core formed by a main core body portion constructed of a sheet of polymer material and having a subsidiary core accommodation portion formed therein. A ceramic subsidiary core portion, which is constructed of a ceramic sheet, is accommodated in the subsidiary core accommodation portion and is of a thickness matching that of the main core body portion. A thin film capacitor is formed on a first main surface side of a plate-like base of the core portion and includes first and second thin film electrodes separated from each other by a thin film dielectric layer so as to provide direct current isolation between the electrodes. First and second direct current isolated terminals of a first terminal array are electrically connected to the first and second thin film electrodes.
摘要翻译：中间基板包括由主体芯体部分形成的基体芯部，所述主芯体部分由聚合物材料片构成并且具有形成在其中的副芯部容纳部分。由陶瓷片构成的陶瓷副芯部被容纳在副芯容纳部中，其厚度与主芯体部的厚度一致。在芯部的板状基体的第一主面侧形成薄膜电容器，并且包括通过薄膜电介质层彼此分离的第一和第二薄膜电极，以在电极之间提供直流隔离。第一端子阵列的第一和第二直流隔离端子电连接到第一和第二薄膜电极。

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