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1. 发明授权

US5311402A Semiconductor device package having locating mechanism for properly positioning semiconductor device within package 失效
标题翻译：半导体器件封装具有用于将半导体器件适当地定位在封装内的定位机构
公开(公告)号：US5311402A
公开(公告)日：1994-05-10
申请号：US16938
申请日：1993-02-12
申请人： Kenzi Kobayashi , Hajime Mori , Yukio Yamaguti
发明人： Kenzi Kobayashi , Hajime Mori , Yukio Yamaguti
IPC分类号： H01L21/52 , H01L21/58 , H01L21/60 , H01L23/055 , H01L23/10 , H05K7/02
CPC分类号： H01L24/83 , H01L21/52 , H01L23/055 , H01L23/10 , H01L24/29 , H01L24/81 , H01L2224/1134 , H01L2224/13111 , H01L2224/16225 , H01L2224/29111 , H01L2224/2919 , H01L2224/32245 , H01L2224/73253 , H01L2224/81801 , H01L2224/8319 , H01L2224/83805 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/14 , H01L2924/15174 , H01L2924/15311 , H01L2924/15312 , H01L2924/1579 , H01L2924/16152 , H01L2924/16251 , H01L2924/16315 , H01L2924/351
摘要： A semiconductor device having an IC (Integrated Circuit) chip packaged on a circuit board, and a cap for hermetically sealing the chip. The cap is bonded to the circuit board at the edges of an open end thereof and bonded to the chip at the underside or bottom thereof. To accurately position the chip on the circuit board, the circuit board is provided with a groove or a shoulder in a position where it faces the edges of the open end of the cap. After the chip has been positioned on the circuit board, the cap is bonded to the circuit board via the groove or the shoulder.
摘要翻译：具有封装在电路板上的IC（集成电路）芯片的半导体器件和用于气密密封芯片的盖。盖在其开口端的边缘处接合到电路板，并在其底面或底部与芯片接合。为了将芯片精确地定位在电路板上，电路板在其面向盖的开口端的边缘的位置处设置有凹槽或肩部。芯片定位在电路板上之后，盖通过槽或肩部与电路板接合。

2. 发明申请

US20090020870A1 ELECTRONIC DEVICE PROVIDED WITH WIRING BOARD, METHOD FOR MANUFACTURING SUCH ELECTRONIC DEVICE AND WIRING BOARD FOR SUCH ELECTRONIC DEVICE 审中-公开
标题翻译：用布线板提供的电子装置，用于制造这种电子装置的方法和用于这种电子装置的布线板
公开(公告)号：US20090020870A1
公开(公告)日：2009-01-22
申请号：US11908460
申请日：2006-03-14
申请人： Shinji Watanabe , Yukio Yamaguti
发明人： Shinji Watanabe , Yukio Yamaguti
IPC分类号： H01L23/485 , H01L21/60 , H05K1/02
CPC分类号： H01L23/5389 , H01L21/563 , H01L23/3128 , H01L23/49833 , H01L23/544 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/742 , H01L24/83 , H01L24/90 , H01L25/03 , H01L25/0657 , H01L25/105 , H01L2223/54426 , H01L2224/1134 , H01L2224/13099 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/24226 , H01L2224/2919 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48472 , H01L2224/73203 , H01L2224/73204 , H01L2224/75251 , H01L2224/75252 , H01L2224/83121 , H01L2224/83192 , H01L2224/83194 , H01L2224/838 , H01L2225/06517 , H01L2225/06582 , H01L2225/1035 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/09701 , H01L2924/15192 , H01L2924/15311 , H01L2924/3025 , H05K1/0313 , H05K1/183 , H05K1/185 , H05K3/305 , H05K3/325 , H05K3/4688 , H05K2201/0129 , H05K2201/0133 , H05K2201/10515 , H05K2201/10674 , H05K2201/10977 , H05K2203/1189 , H01L2924/00 , H01L2924/00012 , H01L2224/05599
摘要： An electronic device (1) is provided with a wiring board (2) and a semiconductor chip (5). The wiring board (2) is provided with a first resin layer (3a) and a second resin layer (3b) stacked one over another by having a wiring (4) in between. The semiconductor chip (5) has bumps (6) on one side and is connected with the wiring (4) by entering into the first resin layer (3a) to bring the bumps (6) into contact with the wiring (4). The first resin layer (3a) includes a thermoplastic resin, and the second resin layer (3b) has an elasticity of 1 GPa or higher at a melting point of the first resin layer (3a).
摘要翻译：电子设备（1）设置有布线板（2）和半导体芯片（5）。布线板（2）具有通过在其间具有布线（4）而彼此堆叠的第一树脂层（3a）和第二树脂层（3b）。半导体芯片（5）在一侧具有凸块（6），并通过进入第一树脂层（3a）与布线（4）连接，使凸块（6）与布线（4）接触。第一树脂层（3a）包括热塑性树脂，第二树脂层（3b）在第一树脂层（3a）的熔点具有1GPa或更高的弹性。

3. 发明授权

US06922190B2 Portable information terminal 失效
标题翻译：便携式信息终端
公开(公告)号：US06922190B2
公开(公告)日：2005-07-26
申请号：US10395277
申请日：2003-03-25
申请人： Yukio Yamaguti , Hideo Mitsuhashi
发明人： Yukio Yamaguti , Hideo Mitsuhashi
IPC分类号： G06F15/02 , G06F1/16 , H04M1/02 , G09G5/00
CPC分类号： H04M1/026 , G06F1/1626 , G06F1/1656
摘要： A portable information terminal according to the present invention uses a main board and a memory sheet. The main board has a complicated configuration. The memory sheet has silicon chips for memory. The memory sheet comprises a film-shaped circuit board and the silicon chips mounted on the film-shaped circuit board. A contact for the memory sheet is connected to a connecting terminal of the main board. This configuration allows the mounting of a large capacity of memory while keeping the thickness of the portable information terminal in a thin state. As a result, a portability-improved portable information terminal can be obtained in which a large capacity of memory was contained and miniaturization, thickness reduction and weight reduction were achieved.
摘要翻译：根据本发明的便携式信息终端使用主板和存储器片。主板具有复杂的配置。记忆板具有用于存储器的硅芯片。记忆片包括膜形电路板和安装在膜状电路板上的硅芯片。记忆片的触点连接到主板的连接端子。该配置允许安装大容量的存储器，同时将便携式信息终端的厚度保持在薄的状态。结果，可以获得便携式改进的便携式信息终端，其中包含大容量的存储器并且实现了小型化，减薄和减轻重量。

4. 发明授权

US4709301A Package 失效
标题翻译：包
公开(公告)号：US4709301A
公开(公告)日：1987-11-24
申请号：US900532
申请日：1986-08-26
申请人： Yukio Yamaguti
发明人： Yukio Yamaguti
IPC分类号： H01L23/04 , H01L23/24 , H01L25/065 , H02B1/00 , H05K7/20
CPC分类号： H01L23/24 , H01L23/04 , H01L25/0655 , H01L2924/0002
摘要： A method for forming a package, and corresponding package structure are disclosed. An electronic component is mounted on a substrate via a spacer, and the component is electrically connected to wiring embedded in the substrate. A space is defined in between the component, the spacer, and the substrate by the electrical connecting path. A first silicone material is filled within said defined space, and a second relatively more hardened silicone material is disposed in an area outside of said defined space and covering the electrical connecting path and portions of the upper surface of the substrate. More particularly, some first silicone material may also be disposed outside the defined space, and covered by the second silicone material. The second silicone material is at first in liquid form and of less viscosity than the first silicone material when originally disposed, and is subsequently hardened by either heating or irradiation.
摘要翻译：公开了一种用于形成封装的方法和相应的封装结构。电子部件通过间隔件安装在基板上，并且该部件电连接到嵌入在基板中的布线。通过电连接路径在组件，间隔件和衬底之间限定空间。第一硅氧烷材料填充在所述限定的空间内，并且第二相对更硬化的硅氧烷材料设置在所述限定空间外部的区域中并且覆盖电连接路径和衬底的上表面的部分。更具体地，一些第一硅氧烷材料也可以设置在限定的空间的外部并被第二硅氧烷材料覆盖。第一硅氧烷材料首先为液体形式，并且在最初设置时的粘度低于第一硅氧烷材料，并随后通过加热或照射而硬化。

5. 发明授权

US06271480B1 Electronic device 失效
标题翻译：电子设备
公开(公告)号：US06271480B1
公开(公告)日：2001-08-07
申请号：US09073854
申请日：1998-05-07
申请人： Yukio Yamaguti , Hironobu Ikeda
发明人： Yukio Yamaguti , Hironobu Ikeda
IPC分类号： H01L2348
CPC分类号： H05K3/303 , H01L23/32 , H01L2924/0002 , H05K1/181 , H05K3/308 , H05K3/3415 , H05K3/3421 , H05K2201/10545 , H05K2201/10659 , H05K2201/10704 , H05K2203/167 , Y02P70/613 , Y10T29/53174 , H01L2924/00
摘要： The electronic device is provide that includes a body having an underside; a plurality of conducting members for transferring electronic signals; and at least two alignment pins mounted perpendicularly on the underside. Each of the alignment pins has a flexible portion that is more easily bendable than the other portions.
摘要翻译：该电子装置的设置包括具有下侧的主体; 用于传送电子信号的多个导电构件; 以及垂直安装在下侧上的至少两个对准销。每个对准销具有比其他部分更容易弯曲的柔性部分。

6. 发明授权

US5973930A Mounting structure for one or more semiconductor devices 失效
标题翻译：一个或多个半导体器件的安装结构
公开(公告)号：US5973930A
公开(公告)日：1999-10-26
申请号：US111871
申请日：1998-07-08
申请人： Hironobu Ikeda , Yukio Yamaguti
发明人： Hironobu Ikeda , Yukio Yamaguti
IPC分类号： H01L21/60 , H01L21/56 , H01L23/32 , H01L23/498 , H01L23/538 , H01L25/065 , H05K1/14 , H05K1/18 , H05K3/28 , H05K3/34 , H05K3/36 , H05K1/11 , H01L23/488 , H05K7/06
CPC分类号： H05K3/3436 , H01L21/563 , H01L23/49827 , H01L23/49833 , H01L23/5385 , H01L25/0655 , H05K1/141 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/10253 , H01L2924/15311 , H05K2201/049 , H05K2201/10378 , H05K2201/10734 , H05K2201/10977 , H05K3/284 , H05K3/368 , Y02P70/613
摘要： A mounting structure wherein, in a semiconductor package mounting position on a wiring board, a package bearing substrate whose external size is substantially equal to or larger than that of the semiconductor package and which has on its upper surface pads for connection to a semiconductor package and on its lower surface pads for connection to the wiring board is arranged, the pads on the wiring board and those on the lower surface of the package bearing substrate are connected by soldering, and the soldered junction is filled and fixed with an under-fill.
摘要翻译：一种安装结构，其中在布线板上的半导体封装安装位置中，其外部尺寸基本上等于或大于半导体封装尺寸的封装承载基板，并且其上表面焊盘用于连接到半导体封装，在其布置用于连接到布线板的下表面焊盘上，通过焊接连接布线板上的焊盘和封装轴承衬底的下表面上的焊盘，并且焊接的接合处被填充和固定。

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