会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 2. 发明申请
    • MODULAR SOLID-STATE MILLIMETER WAVE (MMW) RF POWER SOURCE
    • 模块化固态毫米波(MMW)射频电源
    • US20100210225A1
    • 2010-08-19
    • US12371857
    • 2009-02-16
    • Reid F. LowellKenneth W. BrownDarin M. GrittersAndrew K. BrownMichael J. SoteloWilliam E. DolashTravis B. Feenstra
    • Reid F. LowellKenneth W. BrownDarin M. GrittersAndrew K. BrownMichael J. SoteloWilliam E. DolashTravis B. Feenstra
    • H04B1/40
    • H01Q3/46H01P5/12H01Q21/0025H01Q21/0075H01Q21/064H03F3/602H03F2200/321
    • A modular solid-state MMW power source based on a topology of the lens array amplifier provides both the flexibility to scale output power and effective thermal management. The modular power source includes a single submodule that uses one or more power dividers and one or more solid-state amplification stages to divide and amplify an RF input signal into R amplified RF signals. The submodule is mounted (suitably in the X-Y plane) on the surface of a heat sink, suitably coupled to a cold backplane, to remove heat. R 1:N low loss power dividers route the amplified RF signals to R*N radiating elements. Each of the 1:N power dividers suitably reside in the X-Z plane and are stacked in the Y direction to provide a planar output of the R*N radiating elements in the Y-Z plane. Placement of the amplifier chips on the single submodule decouples the number of amplifier chips, hence output power, from the number of radiating elements. Placement of the amplifier chips away from the radiating face provides a short path with large thermal cross-section through the heat sink to the backplane to remove heat. The topology can produce high output power combined with a high antenna gain to produce large power-aperture products previously only achievable with a Gyrotron. As amplifier chips become more powerful, the topology can be adapted to use fewer chips.
    • 基于透镜阵列放大器的拓扑结构的模块化固态MMW电源提供了扩展输出功率和有效热管理的灵活性。 模块化电源包括单个子模块,其使用一个或多个功率分配器和一个或多个固态放大级来将RF输入信号分频和放大为R个放大的RF信号。 子模块安装在散热器的表面上(适当地在X-Y平面中),适当地耦合到冷底板以去除热量。 R 1:N低损耗功率分配器将放大的RF信号路由到R * N个辐射元件。 1:N功率分配器中的每一个适当地驻留在X-Z平面中并且在Y方向上堆叠以提供Y-Z平面中的R * N个辐射元件的平面输出。 放大器芯片在单个子模块上的放置将放大器芯片的数量(因此输出功率)与辐射元件的数量进行去耦。 放大器芯片远离辐射面的放置提供了一个短路径,通过散热器到背板具有大的热横截面以去除热量。 拓扑结构可以产生高输出功率和高天线增益,从而产生以前只能用Gyrotron实现的大功率孔径产品。 随着放大器芯片变得越来越强大,拓扑可以适应于使用较少的芯片。
    • 3. 发明授权
    • Modular solid-state millimeter wave (MMW) RF power source
    • 模块化固态毫米波(MMW)射频电源
    • US08107894B2
    • 2012-01-31
    • US12371857
    • 2009-02-16
    • Reid F. LowellKenneth W. BrownDarin M. GrittersAndrew K. BrownMichael J. SoteloWilliam E. DolashTravis B. Feenstra
    • Reid F. LowellKenneth W. BrownDarin M. GrittersAndrew K. BrownMichael J. SoteloWilliam E. DolashTravis B. Feenstra
    • H04B1/38
    • H01Q3/46H01P5/12H01Q21/0025H01Q21/0075H01Q21/064H03F3/602H03F2200/321
    • A modular solid-state MMW power source based on a topology of the lens array amplifier provides both the flexibility to scale output power and effective thermal management. The modular power source includes a single submodule that uses one or more power dividers and one or more solid-state amplification stages to divide and amplify an RF input signal into R amplified RF signals. The submodule is mounted (suitably in the X-Y plane) on the surface of a heat sink, suitably coupled to a cold backplane, to remove heat. R 1:N low loss power dividers route the amplified RF signals to R*N radiating elements. Each of the 1:N power dividers suitably reside in the X-Z plane and are stacked in the Y direction to provide a planar output of the R*N radiating elements in the Y-Z plane. Placement of the amplifier chips on the single submodule decouples the number of amplifier chips, hence output power, from the number of radiating elements. Placement of the amplifier chips away from the radiating face provides a short path with large thermal cross-section through the heat sink to the backplane to remove heat. The topology can produce high output power combined with a high antenna gain to produce large power-aperture products previously only achievable with a Gyrotron. As amplifier chips become more powerful, the topology can be adapted to use fewer chips.
    • 基于透镜阵列放大器的拓扑结构的模块化固态MMW电源提供了扩展输出功率和有效热管理的灵活性。 模块化电源包括单个子模块,其使用一个或多个功率分配器和一个或多个固态放大级来将RF输入信号分频和放大为R个放大的RF信号。 子模块安装在散热器的表面上(适当地在X-Y平面中),适当地耦合到冷底板以去除热量。 R 1:N低损耗功率分配器将放大的RF信号路由到R * N个辐射元件。 1:N功率分配器中的每一个适当地驻留在X-Z平面中并且在Y方向上堆叠以提供Y-Z平面中的R * N个辐射元件的平面输出。 放大器芯片在单个子模块上的放置将放大器芯片的数量(因此输出功率)与辐射元件的数量进行去耦。 放大器芯片远离辐射面的放置提供了一个短路径,通过散热器到背板具有大的热横截面以去除热量。 拓扑结构可以产生高输出功率和高天线增益,从而产生以前只能用Gyrotron实现的大功率孔径产品。 随着放大器芯片变得越来越强大,拓扑可以适应于使用较少的芯片。
    • 7. 发明授权
    • Transparent metallic millimeter-wave window
    • 透明金属毫米波窗
    • US06522226B2
    • 2003-02-18
    • US09892093
    • 2001-06-26
    • David D. CrouchKenneth W. BrownWilliam E. Dolash
    • David D. CrouchKenneth W. BrownWilliam E. Dolash
    • H01P108
    • H01P1/08
    • A millimeter-wave window is constructed from a high conductivity metal plate. The metallic plate is made transparent over a range of frequencies by perforating it with a periodic array of slots. In one embodiment, the millimeter-wave window is used in a gyrotron as the output window. In such a case, one suitable periodic array of slots comprises an equilateral triangular array of slots for operation at 95 GHz. By proper choice of the hole spacing and diameter, the window can be made transparent at any desired frequency. In addition to being transparent, however, the window must also be vacuum tight, as the pressure inside a gyrotron is on the order of 10−9 torr. The present invention solves this problem by covering the surface of the window with a thin layer of a suitable dielectric material, such as fused quartz.
    • 毫米波窗由高导电性金属板构成。 金属板通过以周期性的槽阵列穿孔而在一定频率范围内变得透明。 在一个实施例中,在陀螺仪中使用毫米波窗口作为输出窗口。 在这种情况下,一个合适的周期性阵列阵列包括用于在95GHz操作的等边三角形阵列阵列。 通过适当选择孔间距和直径,窗口可以以任何所需的频率透明。 然而,除了透明外,窗口也必须是真空密封的,因为陀螺仪内的压力在10 -9乇的数量级。 本发明通过用合适的电介质材料(例如熔融石英)的薄层覆盖窗的表面来解决这个问题。
    • 10. 发明申请
    • MILLIMETER-WAVE MONOLITHIC INTEGRATED CIRCUIT AMPLIFIER WITH OPPOSITE DIRECTION SIGNAL PATHS AND METHOD FOR AMPLIFYING MILLIMETER-WAVE SIGNALS
    • 具有对角线方向信号波形的单波整体集成电路放大器和放大微波信号的方法
    • US20110025423A1
    • 2011-02-03
    • US12904568
    • 2010-10-14
    • Kenneth W. BrownAndrew K. Brown
    • Kenneth W. BrownAndrew K. Brown
    • H03F3/04
    • H03F3/195H03F3/211
    • Embodiments of a high-frequency millimeter-wave amplifier are generally described herein. The high-frequency millimeter-wave amplifier may be constructed on a substrate to operate at a frequency of at least 75 GHz. In some embodiments, the millimeter-wave amplifier may include at least first, second, third and fourth amplifier stages coupled in series. A single drain bias bond pad provided on the substrate to provide a drain bias voltage to the drains of the first, second, third and fourth amplifier stages. Drain bias lines may be electrically coupled to the single drain bias bond pad and extend at least partially alongside and between some of the amplifier stages. A signal path through the second amplifier stage extends in a direction opposite of signal paths through the first and third amplifier stages. In some embodiments, a 95 GHz amplifier is provided and configured occupy an area on the substrate of no greater than approximately four square millimeters.
    • 这里通常描述高频毫米波放大器的实施例。 高频毫米波放大器可以构造在衬底上以至少75GHz的频率工作。 在一些实施例中,毫米波放大器可以包括串联耦合的至少第一,第二,第三和第四放大器级。 单个漏极偏置接合焊盘,设置在衬底上以向第一,第二,第三和第四放大器级的漏极提供漏极偏置电压。 漏极偏置线可以电耦合到单个漏极偏置接合焊盘,并且至少部分地在一些放大器级之间并且在一些放大器级之间延伸。 通过第二放大器级的信号路径沿着与通过第一和第三放大器级的信号路径相反的方向延伸。 在一些实施例中,95GHz放大器被提供和配置占据基板上不大于约四平方毫米的区域。