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    • 1. 发明授权
    • Combined board level shielding and thermal management
    • 组合板级屏蔽和热管理
    • US07317618B2
    • 2008-01-08
    • US11415460
    • 2006-05-01
    • Kenneth M. RobinsonJames E. Kline
    • Kenneth M. RobinsonJames E. Kline
    • H05K7/20
    • H01L23/552H01L23/40H01L2924/0002H01L2924/3011H01L2924/00
    • An exemplary apparatus generally includes a fence, a heat sink, and a thermal interface. The fence includes walls defining at least one opening along an upper portion of the fence. The walls are configured to be disposed generally about one or more electrical components of a board. The heat sink includes resilient fingers connected to a lid portion, and configured to engage openings of the fence and/or the board. The lid portion is configured to substantially entirely cover the at least one opening of the fence for cooperatively shielding the one or more electrical components within the interior defined by the lid portion and the fence's walls. The thermal interface is configured such that engagement of the resilient fingers with the openings compresses the thermal interface between the lid portion and the one or more electrical components, thereby forming a thermally-conducting heat path from the one or more electrical components to the heat sink.
    • 示例性装置通常包括围栏,散热器和热界面。 围栏包括沿着栅栏上部限定至少一个开口的墙壁。 壁被构造成大致围绕板的一个或多个电气部件设置。 散热器包括连接到盖部分的弹性指状物,并且构造成接合栅栏和/或板的开口。 盖部分被构造成基本上完全覆盖围栏的至少一个开口,用于协调地屏蔽由盖部分和围栏壁限定的内部内的一个或多个电气部件。 热界面被构造成使得弹性指状物与开口的接合压缩盖部分和一个或多个电气部件之间的热界面,由此形成从一个或多个电气部件到散热器的热传导热路径 。