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    • 3. 发明申请
    • METHOD AND SYSTEM FOR PROVIDING QUALITY CONTROL ON WAFERS RUNNING ON A MANUFACTURING LINE
    • 用于提供生产线上运行过程中质量控制的方法和系统
    • US20050267705A1
    • 2005-12-01
    • US10709805
    • 2004-05-28
    • Jeanne BickfordVernon NormanMichael OuelletteMark StyduharBrian Worth
    • Jeanne BickfordVernon NormanMichael OuelletteMark StyduharBrian Worth
    • G01R31/28G06F19/00H01L21/66
    • G01R31/2831H01L22/14
    • A method for providing quality control on wafers running on a manufacturing line is disclosed. The resistances on a group of manufacturing test structures within a wafer running on a wafer manufacturing line are initially measured. Then, an actual distribution value is obtained based on the result of the measured resistances on the group of manufacturing test structures. The difference between the actual distribution value and a predetermined distribution value is recorded. The predetermined distribution value is previously obtained based on a ground rule resistance. Next, the resistances on a group of design test structures within the wafer are measured. The measured resistances of the group of design test structures are correlated to the measured resistances of the group of manufacturing test structures in order to obtain an offset value. The resistance of an adjustable resistor circuit within the wafer is then adjusted accordingly, and subsequent wafers running on the wafer manufacturing line are also adjusted according to the offset value.
    • 公开了一种用于对在生产线上运行的晶片进行质量控制的方法。 初始测量在晶片生产线上运行的晶片内的一组制造测试结构的电阻。 然后,基于制造试验结构体的测定电阻的结果,求出实际的分布值。 记录实际分布值与预定分布值之间的差。 基于接地规则电阻预先获得预定分布值。 接下来,测量晶片内的一组设计测试结构的电阻。 设计测试结构组的测量电阻与制造测试结构组的测量电阻相关,以获得偏移值。 然后相应地调节晶片内的可调节电阻电路的电阻,并且还根据偏移值来调整在晶片制造线上运行的后续晶片。