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1. 发明申请

US20070181902A1 TRANSPARENT EPOXY RESIN COMPOSITION FOR MOLDING OPTICAL SEMICONDUCTOR AND OPTICAL SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE USING THE SAME 有权
标题翻译：用于模制光学半导体的透明环氧树脂组合物和使用其的光学半导体集成电路器件
公开(公告)号：US20070181902A1
公开(公告)日：2007-08-09
申请号：US11668974
申请日：2007-01-30
申请人： Kenji UCHIDA , Koki Hirasawa , Katsumi Shimada , Shinjiro Uenishi , Shinya Ota
发明人： Kenji UCHIDA , Koki Hirasawa , Katsumi Shimada , Shinjiro Uenishi , Shinya Ota
IPC分类号： H01L33/00
CPC分类号： C08G59/4215 , C08G59/66 , C08G59/686 , H01L24/45 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48471 , H01L2924/00014 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/00 , H01L2924/00012 , H01L2224/4554
摘要： In an optical semiconductor integrated circuit device using a lead frame, a transparent epoxy resin composition for molding an optical semiconductor contains (A) an epoxy resin; (B) a curing agent; (C) a thiol; and (D) an amine-based curing catalyst represented by following Chemical Formula 1: R1: a hydrogen atom (—H), an alkyl group, or a phenyl group R2: an alkyl group (—CH3, —C2H5, —C3H7)
摘要翻译：在使用引线框架的光半导体集成电路装置中，用于模制光学半导体的透明环氧树脂组合物含有（A）环氧树脂; （B）固化剂; （C）硫醇; 和（D）由以下化学式1表示的胺基固化催化剂：R 1：氢原子（-H），烷基或苯基R 2，烷基：（CH 3）3，-C 2 H 5，-C 3 H， SUB> 7 ）

2. 发明申请

US20100142169A1 ELECTRONIC DEVICE AND PROCESS FOR MANUFACTURING ELECTRONIC DEVICE 失效
标题翻译：电子设备和制造电子设备的方法
公开(公告)号：US20100142169A1
公开(公告)日：2010-06-10
申请号：US12630466
申请日：2009-12-03
申请人： Kenji UCHIDA , Koki Hirasawa
发明人： Kenji UCHIDA , Koki Hirasawa
IPC分类号： H05K1/18 , B29C45/14
CPC分类号： H01L31/0203 , B29C45/1418 , B29C45/14655 , H01L24/97 , H01L27/14618 , H01L2224/48091 , H01L2224/48247 , H01L2224/97 , H01L2924/15788 , H01L2924/1815 , H01L2924/3025 , H01L2924/00014 , H01L2224/85 , H01L2924/00
摘要： The electronic device, which allows inhibiting the breaking-away of the element from the frame member, even if the temperature change of the electronic device is repeated, and the process for manufacturing the electronic device, are achieved. An electronic device includes a photo-sensitive element formed in a wafer, a frame member installed on the wafer to surround a functional unit, and an encapsulating resin layer filling a circumference of the frame member.
摘要翻译：即使重复了电子设备的温度变化，也能够实现元件从框架部件脱离的电子设备，并且实现了电子设备的制造工艺。电子设备包括形成在晶片中的感光元件，安装在晶片上以围绕功能单元的框架构件，以及填充框架构件的圆周的封装树脂层。

3. 发明申请

US20120282740A1 ELECTRONIC DEVICE AND PROCESS FOR MANUFACTURING ELECTRONIC DEVICE 有权
标题翻译：电子设备和制造电子设备的方法
公开(公告)号：US20120282740A1
公开(公告)日：2012-11-08
申请号：US13549021
申请日：2012-07-13
申请人： Kenji UCHIDA , Koki HIRASAWA
发明人： Kenji UCHIDA , Koki HIRASAWA
IPC分类号： H01L21/56
CPC分类号： H01L31/0203 , B29C45/1418 , B29C45/14655 , H01L24/97 , H01L27/14618 , H01L2224/48091 , H01L2224/48247 , H01L2224/97 , H01L2924/15788 , H01L2924/1815 , H01L2924/3025 , H01L2924/00014 , H01L2224/85 , H01L2924/00
摘要： The electronic device, which allows inhibiting the breaking-away of the element from the frame member, even if the temperature change of the electronic device is repeated, and the process for manufacturing the electronic device, are achieved. An electronic device includes a photo-sensitive element formed in a wafer, a frame member installed on the wafer to surround a functional unit, and an encapsulating resin layer filling a circumference of the frame member.
摘要翻译：即使重复了电子设备的温度变化，也能够实现元件从框架部件脱离的电子设备，并且实现了电子设备的制造工艺。电子设备包括形成在晶片中的感光元件，安装在晶片上以围绕功能单元的框架构件，以及填充框架构件的圆周的封装树脂层。

4. 发明申请

US20100096717A1 ELECTRONIC DEVICE AND PROCESS FOR MANUFACTURING ELECTRONIC DEVICE 审中-公开
标题翻译：电子设备和制造电子设备的方法
公开(公告)号：US20100096717A1
公开(公告)日：2010-04-22
申请号：US12580388
申请日：2009-10-16
申请人： Kenji UCHIDA , Koki HIRASAWA
发明人： Kenji UCHIDA , Koki HIRASAWA
IPC分类号： H01L23/02
CPC分类号： H01L27/14618 , H01L23/3135 , H01L24/97 , H01L27/14683 , H01L2224/48091 , H01L2224/48247 , H01L2224/97 , H01L2924/1815 , H01L2924/00014 , H01L2224/85
摘要： To reduce cracks in a functional unit of a semiconductor element in a process for manufacturing an electronic device, a frame member surrounds a functional unit and an optically-transparent layer is formed on a wafer. A resin layer is formed by injecting resin into a cavity of an encapsulating metallic mold while a molding surface of the encapsulating metallic mold segment contacts an upper surface of the frame member. After forming the resin layer, an optically-transparent layer is formed inside the frame member. The resin layer is formed by injecting resin while the frame member contacts the molding surface of the encapsulating metallic mold segment. Therefore, pressure applied in the encapsulation is exerted over the frame member around the functional unit. Further, the optically-transparent layer is formed after encapsulation. This avoids pressure applied to the functional unit from the contact of the encapsulating metallic mold segment with the optically-transparent layer.
摘要翻译：为了减少制造电子器件的工艺中的半导体元件的功能单元中的裂纹，框架构件围绕功能单元，并且在晶片上形成光透明层。通过将树脂注入到密封金属模具的空腔中，同时密封金属模具段的模制表面接触框架构件的上表面而形成树脂层。在形成树脂层之后，在框架构件内部形成光透明层。树脂层通过注射树脂而形成，同时框架构件接触密封金属模具段的模制表面。因此，封装中施加的压力施加在功能单元周围的框架构件上。此外，光学透明层在封装之后形成。这避免了从封装的金属模具段与光学透明层的接触施加到功能单元的压力。

5. 发明申请

US20090311485A1 ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE ELECTRONIC DEVICE 失效
标题翻译：电子设备及制造电子设备的方法
公开(公告)号：US20090311485A1
公开(公告)日：2009-12-17
申请号：US12437940
申请日：2009-05-08
申请人： Kenji UCHIDA , Koki HIRASAWA
发明人： Kenji UCHIDA , Koki HIRASAWA
IPC分类号： B32B3/00 , B32B38/10 , B32B27/38 , B32B27/30
CPC分类号： H01L27/14618 , H01L24/97 , H01L27/14683 , H01L2224/48091 , H01L2224/48247 , H01L2224/97 , H01L2924/15788 , H01L2924/16235 , Y10T428/24612 , Y10T428/24868 , Y10T428/269 , Y10T428/31511 , Y10T428/31855 , H01L2924/00014 , H01L2224/85 , H01L2924/00
摘要： An electronic device capable of balancing both light transmitting and receiving performance and mounting reliability is provided. The electronic device includes an element (light receiving element), a transparent layer, and a sealing resin layer. The element is, for example, a semiconductor element and has an optically functional region having an optical function (for example, light receiving or light emission) on one face. The transparent layer is located on the optically functional region, directly comes in contact with the one face of the light receiving element, and is optically transparent. The sealing resin layer seals sides of the transparent layer and one face of the light receiving element, does not coat an upper face of the transparent layer, and is mixed with filler that improves rigidity.
摘要翻译：提供了能够平衡光传输和接收性能以及安装可靠性的电子设备。电子设备包括元件（光接收元件），透明层和密封树脂层。该元件例如是半导体元件，并且具有在一个面上具有光学功能（例如，光接收或发光）的光学功能区域。透明层位于光学功能区域上，直接与光接收元件的一个面接触，并且是光学透明的。密封树脂层密封透明层的侧面和光接收元件的一个面，不会覆盖透明层的上表面，并与提高刚性的填料混合。

6. 发明申请

US20120286437A1 ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE ELECTRONIC DEVICE 审中-公开
标题翻译：电子设备及制造电子设备的方法
公开(公告)号：US20120286437A1
公开(公告)日：2012-11-15
申请号：US13557809
申请日：2012-07-25
申请人： Kenji UCHIDA , Koki HIRASAWA
发明人： Kenji UCHIDA , Koki HIRASAWA
IPC分类号： G02B1/12 , B29D11/00
CPC分类号： H01L27/14618 , H01L24/97 , H01L27/14683 , H01L2224/48091 , H01L2224/48247 , H01L2224/97 , H01L2924/15788 , H01L2924/16235 , Y10T428/24612 , Y10T428/24868 , Y10T428/269 , Y10T428/31511 , Y10T428/31855 , H01L2924/00014 , H01L2224/85 , H01L2924/00
摘要： An electronic device capable of balancing both light transmitting and receiving performance and mounting reliability is provided. The electronic device includes an element (light receiving element), a transparent layer, and a sealing resin layer. The element is, for example, a semiconductor element and has an optically functional region having an optical function (for example, light receiving or light emission) on one face. The transparent layer is located on the optically functional region, directly comes in contact with the one face of the light receiving element, and is optically transparent. The sealing resin layer seals sides of the transparent layer and one face of the light receiving element, does not coat an upper face of the transparent layer, and is mixed with filler that improves rigidity.
摘要翻译：提供了能够平衡光传输和接收性能以及安装可靠性的电子设备。电子设备包括元件（光接收元件），透明层和密封树脂层。该元件例如是半导体元件，并且具有在一个面上具有光学功能（例如，光接收或发光）的光学功能区域。透明层位于光学功能区域上，直接与光接收元件的一个面接触，并且是光学透明的。密封树脂层密封透明层的侧面和光接收元件的一个面，不会覆盖透明层的上表面，并与提高刚性的填料混合。

7. 发明申请

US20110096515A1 ELECTRONIC DEVICE AND FABRICATION METHOD THEREOF 有权
标题翻译：电子设备及其制造方法
公开(公告)号：US20110096515A1
公开(公告)日：2011-04-28
申请号：US12911574
申请日：2010-10-25
申请人： Kenji UCHIDA
发明人： Kenji UCHIDA
IPC分类号： H05K7/00 , H05K3/30
CPC分类号： H01L27/14618 , B81C1/00261 , H01L21/561 , H01L24/16 , H01L24/97 , H01L2224/16225 , H01L2224/97 , H01L2924/1461 , H01L2924/181 , H01L2924/351 , Y10T29/4913 , Y10T29/49139 , H01L2224/81 , H01L2924/00
摘要： Provided is an electronic device of high reliability having an exposed functional portion. An electronic device 10 comprises an electronic element 11 having an exposed functional portion 11a on a first surface, a frame member 12 having a first penetration hole 12a, and a board 13 having a second penetration hole 13a. The frame member 12 is provided on the first surface of the electronic element 11 such that the first penetration hole 12a faces at least a part of the functional portion 11a. The electronic element 11 is mounted on the board 13 such that at least a part of the functional portion 11a faces the second penetration hole 13a. The frame member 12 does not contact with the board 13.
摘要翻译：提供一种具有高可靠性的电子设备，其具有暴露的功能部分。电子设备10包括在第一表面上具有暴露的功能部分11a的电子元件11，具有第一穿透孔12a的框架构件12和具有第二穿透孔13a的板13。框架构件12设置在电子元件11的第一表面上，使得第一穿透孔12a面对功能部分11a的至少一部分。电子元件11安装在板13上，使得功能部11a的至少一部分面向第二贯通孔13a。框架构件12不与板13接触。

8. 发明申请

US20140087917A1 VEHICLE AND CONTROL METHOD FOR VEHICLE 有权
标题翻译：车辆的车辆和控制方法
公开(公告)号：US20140087917A1
公开(公告)日：2014-03-27
申请号：US14013520
申请日：2013-08-29
申请人： Nobuyuki TANAKA , Masaya AMANO , Kenji UCHIDA , Yuki HAYAKAWA , Go HAYASAKA
发明人： Nobuyuki TANAKA , Masaya AMANO , Kenji UCHIDA , Yuki HAYAKAWA , Go HAYASAKA
IPC分类号： B60K28/10 , B60W10/06 , B60W20/00
CPC分类号： B60K28/10 , B60W10/06 , B60W20/00 , B60W20/40 , B60W2030/1809 , B60W2540/10 , B60W2540/103 , Y02T10/48 , Y10T477/23 , Y10T477/679
摘要： A vehicle includes an accelerator pedal, a drive device and an electronic control unit (ECU). The drive device generates driving force for driving a wheel on the basis of an operation amount of the accelerator pedal. The ECU, while the vehicle is travelling in a ready-off state, prohibits a shift into a ready-on state until the operation amount of the accelerator pedal once becomes lower than a predetermined value.
摘要翻译：车辆包括加速器踏板，驱动装置和电子控制单元（ECU）。驱动装置基于加速踏板的操作量产生用于驱动车轮的驱动力。 ECU在车辆正在进入就绪状态的同时禁止转换到准备状态，直到加速踏板的操作量一旦变得低于预定值。

9. 发明申请

US20090285214A1 SYSTEM CONTROLLER, SEMICONDUCTOR DEVICE, AND METHOD OF TESTING INTERFACE 失效
标题翻译：系统控制器，半导体器件和测试接口的方法
公开(公告)号：US20090285214A1
公开(公告)日：2009-11-19
申请号：US12367060
申请日：2009-02-06
申请人： Kenji UCHIDA
发明人： Kenji UCHIDA
IPC分类号： H04L12/56
CPC分类号： G06F21/85
摘要： A semiconductor device capable of connecting plurality of external devices. When an interface with a first external device that can be connected to the semiconductor device is tested, a packet to be transferred from the first external device to another second external device is artificially generated. The generated packet is transferred to the second external device, and a response is monitored. Thus, the interface for connection to the first external device is tested while avoiding an actual packet transfer between the semiconductor device and the first external device.
摘要翻译：一种能够连接多个外部设备的半导体器件。当测试可以连接到半导体器件的具有第一外部设备的接口时，将从第一外部设备传送到另一第二外部设备的分组被人为地生成。生成的数据包被传送到第二个外部设备，并且监视响应。因此，用于连接到第一外部设备的接口被测试，同时避免半导体器件和第一外部设备之间的实际分组传送。

10. 发明申请

US20080226295A1 LIGHT MODULATING APPARATUS 审中-公开
标题翻译：光调制装置
公开(公告)号：US20080226295A1
公开(公告)日：2008-09-18
申请号：US11944679
申请日：2007-11-26
申请人： Akira MIURA , Kenji UCHIDA , Masahiro IZUKA , Hirotoshi KODAKA , Tsuyoshi YAKIHARA , Katsuya IKEZAWA , Daisuke TANIMURA , Chie SATO , Kentaro TEZUKA , Morio WADA
发明人： Akira MIURA , Kenji UCHIDA , Masahiro IZUKA , Hirotoshi KODAKA , Tsuyoshi YAKIHARA , Katsuya IKEZAWA , Daisuke TANIMURA , Chie SATO , Kentaro TEZUKA , Morio WADA
IPC分类号： H04J14/02
CPC分类号： G02F1/0121 , G02F2201/16 , H04B10/5051 , H04B10/50577 , H04B10/5162 , H04B10/58
摘要： A light modulating apparatus which is to be used in a transmission system using wavelength division multiplexing has: a signal generating section for producing a transmission signal and the like; a first light modulating section for modulating light emitted from a light source, on the basis of the transmission signal; a variable phase shifter which changes a phase of a light quantity control signal; a second light modulating section for modulating a light signal emitted from the first light modulating section, on the basis of an output of the variable phase shifter; a branching section for branching a light signal emitted from the second light modulating section, into an output light signal and an electric signal; and an analysis controlling section for sampling the electric signal, controlling the variable phase shifter on the basis of sampled data, and adjusting a timing of the modulation in the second light modulating section.
摘要翻译：用于使用波分复用的传输系统中的光调制装置具有：产生传输信号等的信号产生部分; 第一光调制部分，用于根据发射信号调制从光源发射的光; 改变光量控制信号的相位的可变移相器; 第二光调制部分，用于根据可变移相器的输出调制从第一光调制部分发射的光信号; 分支部分，用于将从第二光调制部分发射的光信号分支为输出光信号和电信号; 以及分析控制部分，用于对电信号进行采样，基于采样数据控制可变移相器，并调整第二光调制部分中的调制定时。

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