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1. 发明授权

US09391050B2 Semiconductor light emitting device and fabrication method for same 有权
标题翻译：半导体发光器件及其制造方法
公开(公告)号：US09391050B2
公开(公告)日：2016-07-12
申请号：US14376414
申请日：2013-02-01
申请人： Kenji Imazu , Yuzuru Wada
发明人： Kenji Imazu , Yuzuru Wada
IPC分类号： H01L25/075 , H01L33/50 , H01L33/54 , H01L33/60 , H01L33/62 , H01L23/00 , H01L33/46
CPC分类号： H01L25/0753 , H01L24/81 , H01L24/95 , H01L24/97 , H01L25/0756 , H01L33/46 , H01L33/505 , H01L33/507 , H01L33/54 , H01L33/60 , H01L33/62 , H01L2224/16 , H01L2224/48091 , H01L2924/00011 , H01L2924/01322 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2224/81805 , H01L2924/00012
摘要： The purpose of the present invention is to provide a double-sided light emitting type semiconductor light emitting device that can be easily fabricated even if a semiconductor light emitting element is flip-chip mounted, and to provide a fabrication process for the same. The semiconductor light emitting device has a plurality of lead frames, a plurality of semiconductor light emitting elements connected to the plurality of lead frames, and a covering member that covers the plurality of semiconductor light emitting elements. The semiconductor light emitting device is characterized in that the edge of one lead frame among the plurality of lead frames is disposed in close proximity to the edge of another lead frame so as to form a gap, and the plurality of semiconductor light emitting elements are flip-chip mounted on the front surface and rear surface of the one lead frame and the other lead frame so as to straddle the gap.
摘要翻译：本发明的目的是提供一种双面发光型半导体发光器件，其即使半导体发光元件被倒装芯片安装也能够容易地制造，并且为其提供制造工艺。半导体发光器件具有多个引线框架，连接到多个引线框架的多个半导体发光元件以及覆盖多个半导体发光元件的覆盖元件。半导体发光器件的特征在于，多个引线框架中的一个引线框架的边缘被布置成紧邻另一个引线框架的边缘以形成间隙，并且多个半导体发光元件被翻转芯片安装在一个引线框架和另一个引线框架的前表面和后表面上，以跨越间隙。

2. 发明申请

US20120302124A1 METHOD OF PRODUCING LIGHT- EMITTING DEVICE AND LIGHT-EMITTING DEVICE 有权
标题翻译：生产发光装置和发光装置的方法
公开(公告)号：US20120302124A1
公开(公告)日：2012-11-29
申请号：US13576130
申请日：2011-01-28
申请人： Kenji Imazu
发明人： Kenji Imazu
IPC分类号： H05B33/10
CPC分类号： H01L33/486 , H01L21/568 , H01L33/52 , H01L33/60 , H01L2224/04105 , H01L2224/16225 , H01L2224/19 , H01L2224/32013 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/73267 , H01L2224/96 , H01L2224/97 , H01L2924/181 , H01L2933/0033 , H01L2933/0066 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/83
摘要： It is an object to produce a thin light-emitting device in an extremely simple method that does not include a substrate on which a light-emitting element is to be mounted.A method of producing a light-emitting device, including: preparing a plurality of light-emitting elements each including element electrodes in a pair; arranging the plurality of light-emitting elements in a sealing member to expose at least one surface of each of the element electrodes in a pair provided to each of the light-emitting elements; forming external connection electrodes in a plurality of pairs on the sealing member, the external connection electrodes in each pair being electrically connected to the element electrodes in a pair provided to each of the light-emitting elements; and obtaining a plurality of light-emitting devices by dividing the sealing member with the plurality of light-emitting elements, the light-emitting devices each including a light-emitting element having element electrodes in a pair, a sealing member sealing the light-emitting element while at least one surface of each of the element electrodes in a pair is exposed, and external connection electrodes in a pair provided on the sealing member and electrically connected to the element electrodes in a pair.
摘要翻译：本发明的目的是以不需要安装发光元件的基板的非常简单的方法制造薄的发光装置。一种发光装置的制造方法，其特征在于，包括：准备多个发光元件，每个发光元件均包括一对元件电极; 将多个发光元件布置在密封构件中以使设置在每个发光元件上的每个元件电极的至少一个表面露出; 在所述密封部件上形成多对成形的外部连接电极，每对中的外部连接电极与设置在每个所述发光元件上的所述元件电极电连接; 并且通过将所述密封构件与所述多个发光元件分开来获得多个发光装置，所述发光装置各自包括具有元件电极的发光元件，密封构件密封所述发光元件元件，而一对元件电极的至少一个表面被暴露，并且一对外部连接电极成对地设置在密封构件上并与元件电极电连接。

3. 发明授权

US09159892B2 LED light source device and manufacturing method for the same 有权
标题翻译： LED光源装置及其制造方法相同
公开(公告)号：US09159892B2
公开(公告)日：2015-10-13
申请号：US13807275
申请日：2011-07-01
申请人： Mizue Fukushima , Kenji Imazu , Hiroshi Tsukada , Ryo Tamura
发明人： Mizue Fukushima , Kenji Imazu , Hiroshi Tsukada , Ryo Tamura
IPC分类号： H01L33/00 , H01L33/62 , H01L33/46 , H01L33/52 , H01L33/60 , H01L33/64
CPC分类号： H01L33/62 , H01L33/46 , H01L33/52 , H01L33/60 , H01L33/64 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48237 , H01L2924/01322 , H01L2924/15153 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An object of the invention is to provide an LED light source device and a manufacturing method for the same that can maintain high reflectance over an extended period of time notwithstanding the interaction between light and heat. More specifically, the invention provides an LED light source device that includes a substrate, an electrode formed on the substrate, a white inorganic resist layer deposited over the substrate so as to cover a surface thereof everywhere except where the electrode is formed, and an LED element connected to the electrode, wherein the white inorganic resist layer contains fine white inorganic particles dispersed or mixed into an inorganic binder, and a method for manufacturing such an LED light source device.
摘要翻译：本发明的目的是提供一种LED光源装置及其制造方法，即使在光和热之间存在相互作用的情况下，也能够在长时间内保持高的反射率。更具体地，本发明提供一种LED光源装置，其包括基板，形成在基板上的电极，淀积在基板上的白色无机抗蚀剂层，以覆盖除了形成电极之外的其它表面，以及LED 连接到电极的元件，其中白色无机抗蚀剂层包含分散或混合到无机粘合剂中的细白色无机颗粒，以及制造这种LED光源装置的方法。

4. 发明申请

US20130099276A1 LED LIGHT SOURCE DEVICE AND MANUFACTURING METHOD FOR THE SAME 有权
标题翻译： LED光源装置及其制造方法
公开(公告)号：US20130099276A1
公开(公告)日：2013-04-25
申请号：US13807275
申请日：2011-07-01
申请人： Mizue Fukushima , Kenji Imazu , Hiroshi Tsukada , Ryo Tamura
发明人： Mizue Fukushima , Kenji Imazu , Hiroshi Tsukada , Ryo Tamura
IPC分类号： H01L33/62
CPC分类号： H01L33/62 , H01L33/46 , H01L33/52 , H01L33/60 , H01L33/64 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48237 , H01L2924/01322 , H01L2924/15153 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An object of the invention is to provide an LED light source device and a manufacturing method for the same that can maintain high reflectance over an extended period of time notwithstanding the interaction between light and heat. More specifically, the invention provides an LED light source device that includes a substrate, an electrode formed on the substrate, a white inorganic resist layer deposited over the substrate so as to cover a surface thereof everywhere except where the electrode is formed, and an LED element connected to the electrode, wherein the white inorganic resist layer contains fine white inorganic particles dispersed or mixed into an inorganic binder, and a method for manufacturing such an LED light source device.
摘要翻译：本发明的目的是提供一种LED光源装置及其制造方法，即使在光和热之间存在相互作用的情况下，也能够在长时间内保持高的反射率。更具体地，本发明提供一种LED光源装置，其包括基板，形成在基板上的电极，淀积在基板上的白色无机抗蚀剂层，以覆盖除了形成电极之外的其它表面，以及LED 连接到电极的元件，其中白色无机抗蚀剂层包含分散或混合到无机粘合剂中的细白色无机颗粒，以及制造这种LED光源装置的方法。

5. 发明授权

US08556672B2 Method of producing light-emitting device and light-emitting device 有权
标题翻译：制造发光装置和发光装置的方法
公开(公告)号：US08556672B2
公开(公告)日：2013-10-15
申请号：US13576130
申请日：2011-01-28
申请人： Kenji Imazu
发明人： Kenji Imazu
IPC分类号： H01L33/56 , H05B33/10
CPC分类号： H01L33/486 , H01L21/568 , H01L33/52 , H01L33/60 , H01L2224/04105 , H01L2224/16225 , H01L2224/19 , H01L2224/32013 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/73267 , H01L2224/96 , H01L2224/97 , H01L2924/181 , H01L2933/0033 , H01L2933/0066 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/83
摘要： It is an object to produce a thin light-emitting device in an extremely simple method that does not include a substrate on which a light-emitting element is to be mounted.A method of producing a light-emitting device, including: preparing a plurality of light-emitting elements each including element electrodes in a pair; arranging the plurality of light-emitting elements in a sealing member to expose at least one surface of each of the element electrodes in a pair provided to each of the light-emitting elements; forming external connection electrodes in a plurality of pairs on the sealing member, the external connection electrodes in each pair being electrically connected to the element electrodes in a pair provided to each of the light-emitting elements; and obtaining a plurality of light-emitting devices by dividing the sealing member with the plurality of light-emitting elements, the light-emitting devices each including a light-emitting element having element electrodes in a pair, a sealing member sealing the light-emitting element while at least one surface of each of the element electrodes in a pair is exposed, and external connection electrodes in a pair provided on the sealing member and electrically connected to the element electrodes in a pair.
摘要翻译：本发明的目的是以不需要安装发光元件的基板的非常简单的方法制造薄的发光装置。一种发光装置的制造方法，其特征在于，包括：准备多个发光元件，每个发光元件均包括一对元件电极; 将多个发光元件布置在密封构件中以使设置在每个发光元件上的每个元件电极的至少一个表面露出; 在所述密封部件上形成多对成形的外部连接电极，每对中的外部连接电极与设置在每个所述发光元件上的所述元件电极电连接; 并且通过将所述密封构件与所述多个发光元件分开来获得多个发光装置，所述发光装置各自包括具有元件电极的发光元件，密封构件密封所述发光元件元件，而一对元件电极的至少一个表面被暴露，并且一对外部连接电极成对地设置在密封构件上并与元件电极电连接。

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