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1. 发明授权

US07540078B1 Method for recycling wastes of an electrical appliance 有权
标题翻译：回收电器废物的方法
公开(公告)号：US07540078B1
公开(公告)日：2009-06-02
申请号：US09889167
申请日：2000-01-07
申请人： Kenichiro Suetsugu , Shunji Hibino , Masato Hirano , Atsushi Yamaguchi , Mikiya Nakata
发明人： Kenichiro Suetsugu , Shunji Hibino , Masato Hirano , Atsushi Yamaguchi , Mikiya Nakata
IPC分类号： H01R43/00
CPC分类号： C22B25/06 , C22B13/00 , H01H2009/0077 , H05K1/0266 , H05K1/18 , H05K3/3463 , H05K13/0465 , H05K2201/09936 , H05K2203/178 , Y02P10/214 , Y02P10/228 , Y02P70/611 , Y02P70/613 , Y10T29/49117 , Y10T29/49819 , Y10T29/49821 , Y10T29/49822
摘要： A recycling method of wastes of an electrical appliance containing an article having a circuit soldered with parts soldered with a lead free solder. The method includes discriminating a first article having a circuit soldered with lead free parts from a second article having a circuit soldered with lead containing parts; recovering, grinding and melting each of the first and second articles to separate materials of the first article and materials of the second article; recycling reusable valuables contained in the materials of the first article and second article; and shredding a portion of the first and second article not containing the reusable valuables and burying/treating the portion at a stabilizing dumping ground or a controlled dumping ground for disposal.
摘要翻译：一种电器废物的再循环方法，包括具有焊接有焊接无铅焊料的部件的电路的物品。该方法包括区分具有焊接有无铅部件的电路的第一制品，其具有焊接有含铅部件的电路的第二制品; 回收，研磨和熔化第一和第二制品中的每一个以分离第一制品的材料和第二制品的材料; 回收第一篇文章和第二篇材料中包含的可重复使用的贵重物品; 并将不包含可重复使用的贵重物品的第一和第二物品的一部分切碎，并将该部分埋在/处理在稳定倾倒地或受控倾倒地面处理。

2. 发明申请

US20080210604A1 ARTICLE HAVING A CIRCUIT SOLDERED WITH PARTS AND METHOD FOR RECYCLING WASTES OF THE SAME 审中-公开
标题翻译：具有与零件一起焊接的电路的物品及其回收废物的方法
公开(公告)号：US20080210604A1
公开(公告)日：2008-09-04
申请号：US12109877
申请日：2008-04-25
申请人： Kenichiro Suetsugu , Shunji Hibino , Masato Hirano , Atsushi Yamaguchi , Mikiya Nakata
发明人： Kenichiro Suetsugu , Shunji Hibino , Masato Hirano , Atsushi Yamaguchi , Mikiya Nakata
IPC分类号： B07C5/34 , H05K1/00 , H05K5/00
CPC分类号： C22B25/06 , C22B13/00 , H01H2009/0077 , H05K1/0266 , H05K1/18 , H05K3/3463 , H05K13/0465 , H05K2201/09936 , H05K2203/178 , Y02P10/214 , Y02P10/228 , Y02P70/611 , Y02P70/613 , Y10T29/49117 , Y10T29/49819 , Y10T29/49821 , Y10T29/49822
摘要： The disclosure provides an article having a circuit mounted with parts characterized by comprising an electronic part soldered with a lead free solder and having an identification marking indicating no inclusion of lead and an electrical appliance including the same. The present invention also provides a recycling method of wastes of the same. The present invention can offer an article having a circuit mounted with parts and an electrical appliance including the same both of which facilitate identification whether lead which is poisonous to human body is contained or not.
摘要翻译：本公开提供了一种具有电路的物品，其具有部件，其特征在于包括用无铅焊料焊接的电子部件，并且具有指示不包括引线的识别标记和包括其的电器。本发明还提供了一种废物的回收方法。本发明可以提供具有安装有部件的电路和包括该电路的电器的物品，两者都有助于识别是否含有对人体有毒的铅。

3. 发明授权

US06702175B1 Method of soldering using lead-free solder and bonded article prepared through soldering by the method 失效
标题翻译：使用该方法通过焊接制备的使用无铅焊料和接合制品的焊接方法
公开(公告)号：US06702175B1
公开(公告)日：2004-03-09
申请号：US10009168
申请日：2001-12-07
申请人： Kazumi Matsushige , Toshihisa Horiuchi , Takashi Ikari , Kenichiro Suetsugu , Masato Hirano , Shunji Hibino , Atsushi Yamaguchi
发明人： Kazumi Matsushige , Toshihisa Horiuchi , Takashi Ikari , Kenichiro Suetsugu , Masato Hirano , Shunji Hibino , Atsushi Yamaguchi
IPC分类号： B23K106
CPC分类号： B23K1/06 , B23K1/20 , B23K35/262 , B23K2101/40 , B23K2101/42 , H05K3/3463
摘要： There are provided a method of soldering a lead-free solder which lowers a melting point of the lead-free solder and prevents deterioration of a joining strength at a portion joined by the lead-free solder, and a joined object soldered with the use of the soldering method. The lead-free solder as an alloy of tin with no lead contained is melted, and ultrasonic vibration is acted at least either to the join object to be joined by the lead-free solder or to the lead-free solder when the molten lead-free solder is solidified. Therefore crystals of contained components in the lead-free solder are made fine and the contained components are prevented from being segregated at a joining interface of the joined object, so that the joining strength at the joining interface can be increased.
摘要翻译：提供了一种焊接无铅焊料的方法，其降低无铅焊料的熔点并防止在由无铅焊料接合的部分处的接合强度的劣化，以及使用焊接方法。作为不含铅的锡的合金的无铅焊料熔化，并且当熔融的铅 - 铅焊料作为熔融的铅 - 铅焊料时，超声波振动至少与通过无铅焊料接合的接合体或无铅焊料起作用，自由焊料固化。因此，无铅焊料中含有的成分的晶体变细，并且防止了被包含的部件在接合物的接合界面处偏析，从而可以提高接合界面处的接合强度。

4. 发明授权

US5962133A Solder, electronic component mounted by soldering, and electronic circuit board 失效
标题翻译：焊接，通过焊接安装的电子部件和电子电路板
公开(公告)号：US5962133A
公开(公告)日：1999-10-05
申请号：US981565
申请日：1997-12-19
申请人： Atsushi Yamaguchi , Kenichiro Suetsugu , Tetsuo Fukushima , Akio Furusawa
发明人： Atsushi Yamaguchi , Kenichiro Suetsugu , Tetsuo Fukushima , Akio Furusawa
IPC分类号： B23K35/02 , B23K35/14 , B23K35/26 , H01L23/495 , H05K3/24 , H05K3/34 , B32B5/16 , B32B15/00
CPC分类号： H05K3/244 , B23K35/0227 , B23K35/0244 , B23K35/26 , H01L23/49582 , H05K3/3463 , H05K3/3484 , B23K35/025 , H01L2924/0002 , H05K2201/0218 , H05K2201/10636 , H05K2203/0425 , H05K3/3421 , Y02P70/611 , Y10T428/24917 , Y10T428/2938 , Y10T428/294 , Y10T428/2951 , Y10T428/2991
摘要： The occurrence of partial chip detachment is reduced by improving wettability for increasing the bonding strength, and by enabling gradual melting of the solder. Solder material, electronic components, and electronic circuit boards with higher performance and higher reliability are offered. The surface of a solder core, lead-frame surface and electrode surface of electronic components, and copper (Cu) land surface of electronic circuit boards are coated with metal element, which is either indium (In) or bismuth (Bi).
摘要翻译： PCT No.PCT / JP96 / 01680 Sec。 371 1997年12月19日第 102（e）1997年12月19日PCT PCT 1996年6月19日PCT公布。出版物WO97 / 00753 日期1997年1月9日通过提高粘合强度的润湿性，并且能够使焊料逐渐熔化，从而降低部分切屑剥离的发生。提供了具有更高性能和更高可靠性的焊料，电子元件和电子电路板。焊料芯，引线框架表面和电子部件的电极表面以及电子电路板的铜（Cu）表面的表面涂覆有铟（In）或铋（Bi）的金属元素。

5. 发明授权

US06074894A Mounting method of semiconductor device 失效
标题翻译：半导体器件的安装方法
公开(公告)号：US06074894A
公开(公告)日：2000-06-13
申请号：US919036
申请日：1997-08-27
申请人： Kenichiro Suetsugu , Atsushi Yamaguchi
发明人： Kenichiro Suetsugu , Atsushi Yamaguchi
IPC分类号： B23K26/00 , C23C14/28 , H01L21/56 , H01L21/60 , H01L23/31 , H01L23/485 , H05K3/04 , H05K3/28 , H05K3/34 , H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L24/16 , H01L21/56 , H01L23/3121 , H01L24/11 , H05K3/284 , H05K3/3457 , H01L2224/11552 , H01L2224/13099 , H01L2224/16 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01018 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01068 , H01L2924/01074 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H05K2201/0108 , H05K2203/0338 , H05K2203/107 , H05K2203/1105 , H05K3/046
摘要： A bump electrode made of an alloy of two or more kinds of metals is formed on an electrode pad portion of a semiconductor device by the laser ablation method and the bump electrode is reflow-soldered to electrically bond the bump electrode to a terminal electrode section on a circuit board. The semiconductor device and the terminal electrode section are encapsulated in resin by the laser ablation method.
摘要翻译：通过激光烧蚀法在半导体器件的电极焊盘部分上形成由两种或更多种金属的合金构成的凸块电极，并且将凸起电极回流焊接以将凸块电极电连接到端子电极部分上电路板。半导体器件和端子电极部分通过激光烧蚀法封装在树脂中。

6. 发明授权

US06325279B1 Solder alloy of electrode for joining electronic parts and soldering method 失效
标题翻译：用于接合电子零件的电极焊接合金和焊接方法
公开(公告)号：US06325279B1
公开(公告)日：2001-12-04
申请号：US09569064
申请日：2000-05-10
申请人： Yoshinori Sakai , Kenichiro Suetsugu , Atsushi Yamaguchi
发明人： Yoshinori Sakai , Kenichiro Suetsugu , Atsushi Yamaguchi
IPC分类号： B23K3102
CPC分类号： B23K35/262 , B23K2101/36 , H05K3/3442 , H05K3/3463 , H05K2201/10909
摘要： A lead-free solder alloy of electrode for joining electronic parts fine in texture and excellent in thermal fatigue resistant characteristic is presented. This is a solder alloy of electrode for joining electronic parts comprising Sn, Ag and Cu as principal components, and more particularly a solder alloy of electrode for joining electronic parts containing 92 to 97 wt. % of Sn, 3.0 to 6.0 wt. % of Ag, and 0.1 to 2.0 wt. % of Cu. By adding a small amount of Ag to the solder mainly composed of Sn, a fine alloy texture is formed, and texture changes are decreased, so that an alloy excellent in thermal fatigue resistance is obtained. Further, by adding a small amount of Cu, an intermetallic compound is formed, and the junction strength is improved.
摘要翻译：提出了一种无电极焊接合金，用于接合电子部件质地细腻，耐热疲劳特性优异的电极。这是用于接合包含Sn，Ag和Cu的电子部件作为主要成分的电极用焊料合金，更具体地说，是用于接合含有92〜97重量％的电子部件的电极用焊料合金。 Sn的％，3.0〜6.0重量％的Ag，0.1〜2.0重量％。％的铜。通过向主要由Sn组成的焊料中添加少量的Ag，形成微细的合金织构，并且纹理变化减小，从而获得耐热疲劳性优异的合金。此外，通过添加少量的Cu，形成金属间化合物，结合强度提高。

7. 发明授权

US6077477A Solder alloy of electrode for joining electronic parts and soldering method 失效
标题翻译：用于接合电子零件的电极焊接合金和焊接方法
公开(公告)号：US6077477A
公开(公告)日：2000-06-20
申请号：US011393
申请日：1998-02-05
申请人： Yoshinori Sakai , Kenichiro Suetsugu , Atsushi Yamaguchi
发明人： Yoshinori Sakai , Kenichiro Suetsugu , Atsushi Yamaguchi
IPC分类号： B23K35/26 , H05K3/34 , C22C13/02
CPC分类号： B23K35/262 , H05K3/3463 , B23K2201/36 , H05K2201/10909 , H05K3/3442
摘要： A lead-free solder alloy of electrode for joining electronic parts fine in texture and excellent in thermal fatigue resistant characteristic is presented. This is a solder alloy for joining electronic parts comprising Sn, Ag, Bi, Cu and In as principal components, and more particularly a solder alloy of electrode for joining electronic parts containing 81 to 91 wt. % of Sn, 3.0 to 6.0 wt. % of Ag, and 0.1 to 2.0 wt. % of Cu. By adding a small amount of Ag to the solder mainly composed of Sn, a fine alloy texture is formed, and texture changes are decreased, so that an alloy excellent in thermal fatigue resistance is obtained. Further, by adding a small amount of Cu, an intermetallic compound is formed, and the junction strength is improved.
摘要翻译： PCT No.PCT / JP97 / 01969 Sec。 371日期：1998年2月5日 102（e）日期1998年2月5日PCT提交1997年6月6日PCT公布。公开号WO97 / 46350 PCT 日期1997年12月11日提出了一种用于接合电子部件质地细小且耐热疲劳特性优异的电极的无铅焊料合金。这是用于连接包含Sn，Ag，Bi，Cu和In的电子部件作为主要组分的焊料合金，更具体地说，用于接合含有81至91重量％的电子部件的电极用焊料合金。 Sn的％，3.0〜6.0重量％的Ag，0.1〜2.0重量％。％的铜。通过向主要由Sn组成的焊料中添加少量的Ag，形成微细的合金织构，并且纹理变化减小，从而获得耐热疲劳性优异的合金。此外，通过添加少量的Cu，形成金属间化合物，结合强度提高。

8. 发明授权

US06428745B2 Solder, solder paste and soldering method 有权
标题翻译：焊锡，焊膏和焊接方法
公开(公告)号：US06428745B2
公开(公告)日：2002-08-06
申请号：US09818905
申请日：2001-03-28
申请人： Atsushi Yamaguchi , Tetsuo Fukushima , Kenichiro Suetsugu , Akio Furusawa
发明人： Atsushi Yamaguchi , Tetsuo Fukushima , Kenichiro Suetsugu , Akio Furusawa
IPC分类号： C22C1302
CPC分类号： B23K35/262 , B23K35/025
摘要： Disclosed are a solder and a solder paste used for soldering an electronic part to a circuit board. This solder comprises 2.0 to 3.5 wt % of Ag, 5 to 18 wt % of Bi and Sn for the rest. Alternatively, it further contains at least one element selected from the group consisting of 0.1 to 1.5 wt % of In, 0.1 to 0.7 wt % of Cu and 0.1 to 10 wt % of Zn.
摘要翻译：公开了用于将电子部件焊接到电路板的焊料和焊膏。该焊料包含2.0〜3.5重量％的Ag，5〜18重量％的Bi和Sn用于其余部分。或者，其还含有选自由0.1至1.5重量％的In，0.1至0.7重量％的Cu和0.1至10重量％的Zn中的至少一种元素。

9. 发明授权

US06267823B1 Solder, solder paste and soldering method 失效
标题翻译：焊锡，焊膏和焊接方法
公开(公告)号：US06267823B1
公开(公告)日：2001-07-31
申请号：US09125013
申请日：1998-11-12
申请人： Atsushi Yamaguchi , Tetsuo Fukushima , Kenichiro Suetsugu , Akio Furusawa
发明人： Atsushi Yamaguchi , Tetsuo Fukushima , Kenichiro Suetsugu , Akio Furusawa
IPC分类号： B23K3526
CPC分类号： B23K35/262 , B23K35/025
摘要： Disclosed are a solder and a solder paste used for soldering an electronic part to a circuit board. This solder comprises 2.0 to 3.5 wt % of Ag, 5 to 18 wt % of Bi and Sn for the rest. Alternatively, it further contains at least one element selected from the group consisting of 0.1 to 1.5 wt % of In, 0.1 to 0.7 wt % of Cu and 0.1 to 10 wt % of Zn.
摘要翻译：公开了用于将电子部件焊接到电路板的焊料和焊膏。该焊料包含2.0〜3.5重量％的Ag，5〜18重量％的Bi和Sn用于其余部分。或者，其还含有选自由0.1至1.5重量％的In，0.1至0.7重量％的Cu和0.1至10重量％的Zn中的至少一种元素。

10. 发明授权

US07150387B2 Process and apparatus for flow soldering 失效
标题翻译：流动焊接的工艺和设备
公开(公告)号：US07150387B2
公开(公告)日：2006-12-19
申请号：US10668355
申请日：2003-09-24
申请人： Atsushi Yamaguchi , Masato Hirano , Yoshinori Sakai
发明人： Atsushi Yamaguchi , Masato Hirano , Yoshinori Sakai
IPC分类号： B23K1/00
CPC分类号： B23K1/08 , B23K1/0016 , B23K2101/36 , H05K3/3447 , H05K3/3468 , H05K2203/1121
摘要： An apparatus for mounting an electric component onto a board by means of a lead-free solder material. The apparatus of the present invention has a solder material supplying chamber in which a melt of the solder material is supplied to the board by a solder material supplying unit such that the solder material adheres to a predetermined portion of the board. The apparatus further includes a cooling chamber in which the board is cooled by a cooling unit such that the solder material adhering to the board is rapidly cooled to solidify. A conditioning chamber can also be positioned between the solder material supplying chamber and the cooling chamber. The conditioning chamber conditions the board such that the solder material adhering to the board is ensured to be a completely molten condition at least before the rapid cooling of the solder material.
摘要翻译：一种通过无铅焊料将电气部件安装在基板上的装置。本发明的装置具有焊料供给室，其中焊料材料的熔体通过焊料供给单元供应到板，使得焊料材料粘附到板的预定部分。该设备还包括冷却室，其中板被冷却单元冷却，使得粘附到板上的焊料材料被快速冷却以固化。调节室也可以位于焊料供应室和冷却室之间。调节室对板进行调节，使得至少在焊料材料的快速冷却之前，确保粘附到板的焊料是完全熔融的状态。

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