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    • 8. 发明授权
    • Methods of overplating surfaces of microelectromechanical structure
    • 微机电结构表面超镀的方法
    • US06596147B2
    • 2003-07-22
    • US09809538
    • 2001-03-15
    • Edward HillRobert L. WoodRamaswamy Mahadevan
    • Edward HillRobert L. WoodRamaswamy Mahadevan
    • C25D502
    • H02N10/00B81B3/0024B81B3/0081H01H1/0036H01H2001/0042
    • MEMS structures are provided that compensate for ambient temperature changes, process variations, and the like, and can be employed in many applications. These structures include an active microactuator adapted for thermal actuation to move in response to the active alteration of its temperature. The active microactuator may be further adapted to move in response to ambient temperature changes. These structures also include a temperature compensation element, such as a temperature compensation microactuator or frame, adapted to move in response to ambient temperature changes. The active microactuator and the temperature compensation element move cooperatively in response to ambient temperature changes. Thus, a predefined spatial relationship is maintained between the active microactuator and the associated temperature compensation microactuator over a broad range of ambient temperatures absent active alteration of the temperature of the active microactuator. In an alternative embodiment wherein the active microactuator is suspended within a frame above the substrate, the MEMS structure holds at least a portion of the active microactuator in a fixed position relative to the substrate over a broad range of ambient temperatures absent active alteration of the temperature of the active microactuator. By actively altering the temperature of the active microactuator, the active microactuator can be controllably moved relative to the temperature compensation microactuator and/or the underlying substrate. Related methods of compensating for the effects of ambient temperature variations are provided. Further, an overplating technique is provided for precisely sizing a gap defined within a MEMS structure.
    • 提供了补偿环境温度变化,工艺变化等的MEMS结构,并且可以用于许多应用中。 这些结构包括适于热致动以响应于其温度的主动改变而移动的主动微型致动器。 活性微致动器可以进一步适于响应于环境温度变化而移动。 这些结构还包括适于响应于环境温度变化而移动的温度补偿元件,例如温度补偿微致动器或框架。 活动微型致动器和温度补偿元件响应于环境温度变化而协同运动。 因此,在活动微型致动器的温度的有效改变的情况下,在宽的环境温度范围内,在有源微致动器和相关联的温度补偿微致动器之间保持预定的空间关系。 在其中将活性微致动器悬挂在衬底上方的框架内的MEMS替代实施例中,MEMS结构将活性微致动器的至少一部分在宽的环境温度范围内保持在相对于衬底的固定位置,而没有主动改变温度 的活性微致动器。 通过主动地改变活性微致动器的温度,可以相对于温度补偿微致动器和/或底层衬底可控地移动活性微致动器。 提供了补偿环境温度变化影响的相关方法。 此外,提供了一种用于精确地确定在MEMS结构内限定的间隙的过平面技术。
    • 10. 发明授权
    • Methods of fabricating microneedle arrays using sacrificial molds
    • 使用牺牲模具制造微针阵列的方法
    • US06511463B1
    • 2003-01-28
    • US09442827
    • 1999-11-18
    • Robert L. WoodHenry A. WynandsKaren W. Markus
    • Robert L. WoodHenry A. WynandsKaren W. Markus
    • A61M500
    • B81C99/0085A61B5/14514A61B5/150022A61B5/150282A61B5/150984A61M37/0015A61M2037/003A61M2037/0053B81B2201/055Y10T29/302Y10T29/49222
    • Microneedle arrays are fabricated by providing a sacrificial mold including a substrate and an array of posts, preferably solid posts, projecting therefrom. A first material is coated on the sacrificial mold including on the substrate and on the array of posts. The sacrificial mold is removed to provide an array of hollow tubes projecting from a base. The inner and outer surfaces of the array of hollow tubes are coated with a second material to create the array of microneedles projecting from the base. The sacrificial mold may be fabricated by fabricating a master mold, including an array of channels that extend into the master mold from a face thereof. A third material is molded into the channels and on the face of the master mold, to create the sacrificial mold. The sacrificial mold then is separated from the master mold. Alternatively, wire bonding may be used to wire bond an array of wires to a substrate to create the sacrificial mold. The first material preferably is coated on the sacrificial mold by plating. Prior to plating, a plating base preferably is formed on the sacrificial mold including on the substrate and on the array of posts. The inner and outer surfaces of the array of hollow tubes preferably are coated with the second material by overplating the second material on the inner and outer surfaces of the array of hollow tubes.
    • 微针阵列通过提供包括基底和从其突出的柱的阵列(优选固体柱)的牺牲模具来制造。 第一材料涂覆在牺牲模具上,包括在基板上和柱阵列上。 去除牺牲模具以提供从基部突出的中空管阵列。 中空管阵列的内表面和外表面涂覆有第二材料以产生从基底突出的微针阵列。 牺牲模具可以通过制造主模具来制造,该模具包括从其表面延伸到主模具中的通道阵列。 将第三种材料模制到通道中并在母模的表面上,以形成牺牲模具。 然后将牺牲模具与主模具分离。 或者,引线接合可用于将线阵列引线接合到基底以产生牺牲模。 第一种材料优选通过电镀涂覆在牺牲模具上。 在电镀之前,优选在包括在基板和柱阵列上的牺牲模具上形成镀覆基底。 优选地,中空管阵列的内表面和外表面通过在中空管阵列的内表面和外表面上的第二材料的上镀敷而涂覆有第二材料。