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    • 3. 发明申请
    • FUEL PUMP
    • 燃油泵
    • US20070264117A1
    • 2007-11-15
    • US11737959
    • 2007-04-20
    • Shigeru YOSHIDASatoshi MIURA
    • Shigeru YOSHIDASatoshi MIURA
    • F04D5/00
    • F02M37/048F04D5/005F04D5/006F04D29/445
    • A vapor lock in a fuel pump can be prevented by reducing the formation of vapor within the fuel. A first group of concavities may be formed in an inner circumferential region of an intake side face of an impeller, and a second group of concavities may be formed concentrically in a region outside of the first group of concavities. A third group of concavities that communicates with the second group of concavities may be formed in a discharge side face of the impeller. The impeller is housed within a casing. A first groove that faces the first group of concavities and a second groove that faces the second group of concavities may be formed in the face of the casing that faces the intake side face of the impeller. A third groove that faces the third group of concavities may be formed in the face of the casing that faces the discharge side face of the impeller.
    • 可以通过减少燃料内的蒸汽的形成来防止燃料泵中的蒸气锁。 第一组凹部可以形成在叶轮的进气侧面的内周区域中,并且第二组凹部可以同心地形成在第一组凹部之外的区域中。 可以在叶轮的排出侧面形成与第二组凹部连通的第三组凹部。 叶轮容纳在外壳内。 面对第一组凹部的第一凹槽和面向第二组凹部的第二凹槽可以形成在面向叶轮的进气侧面的壳体的表面中。 面向第三组凹部的第三凹槽可以形成在面向叶轮的排出侧面的壳体的表面中。
    • 5. 发明申请
    • PROCESSING CONDITION OBTAINING METHOD AND THIN-FILM FORMING METHOD
    • 加工条件获得方法和薄膜成型方法
    • US20080121513A1
    • 2008-05-29
    • US11680780
    • 2007-03-01
    • Takumi UESUGITetsuro SASAKISatoshi MIURA
    • Takumi UESUGITetsuro SASAKISatoshi MIURA
    • C23C14/34C23C14/52
    • C23C14/545C23C14/34
    • A processing condition obtaining method obtains a processing condition that makes it possible to form an extremely thin film of a desired thickness. This processing condition obtaining method obtains the processing condition, which shows the relationship between the processing time of a thin-film forming process and the thickness of a thin film formed by such process, by measuring the thickness Ta of a thin film formed by carrying out the thin-film forming process Na times (where Na is a natural number of two or greater) with the processing time set at L seconds (where L is a real number), measuring the thickness Tb of a film formed by carrying out the thin-film forming process Nb times (where Nb is a natural number of two or greater) with the processing time set at M seconds (where M is a real number that differs to L), and obtaining the processing condition with the thickness of a thin film formed by the thin-film forming process with the processing time set at L seconds as Ta/Na and the thickness of a thin film formed by the thin-film forming process with the processing time set at M seconds as Tb/Nb.
    • 处理条件获得方法获得能够形成期望厚度的极薄膜的处理条件。 该处理条件获得方法获得处理条件,该处理条件示出了薄膜形成处理的处理时间与通过这种处理形成的薄膜的厚度之间的关系,通过测量通过执行形成的薄膜的厚度Ta 薄膜形成处理Na(自然数为2以上),处理时间设定为L秒(L为实数),测定通过进行薄膜形成的薄膜的厚度Tb 膜形成处理Nb(其中Nb是2以上的自然数),处理时间设定为M秒(其中M是与L不同的实数),并获得厚度薄的处理条件 通过薄膜形成工艺形成的薄膜形成工艺,其处理时间设定为L秒,作为Ta / Na,以及通过薄膜形成工艺形成的薄膜的厚度,处理时间设定为M秒作为Tb / Nb。
    • 6. 发明申请
    • SIGNAL CONVERTING CIRCUIT
    • 信号转换电路
    • US20100141302A1
    • 2010-06-10
    • US12706412
    • 2010-02-16
    • Satoshi MIURAMakoto MASUDA
    • Satoshi MIURAMakoto MASUDA
    • H03K5/22
    • H03F3/45183H03F1/223H03F3/345H03F3/45475H03F3/505H03F2203/45288H03F2203/45352H03F2203/45612H03F2203/45652H03F2203/45702H03K17/04106
    • A signal conversion circuit 2 comprises a differential amplifier portion 10 and a source follower portion 20. When differential voltage signals INp and INn are input to a first input terminal 5 and second input terminal 6 respectively, operations occurs either in a mode in which only the differential amplifier portion 10 operates, or a mode in which both the differential amplifier portion 10 and the source follower portion 20 operate, or a mode in which only the source follower portion 20 operates, according to the levels of the differential voltage signals INp and INn. The differential amplifier portion 10 and source follower portion 20 have fewer components compared with a circuit comprising two differential amplifier circuits. By this means, the circuit area can be reduced, and in addition current consumption can be reduced. Also, because the source follower portion 20 performs non-inverting amplification of the differential voltage signals INp and INn, high-speed operation is possible.
    • 信号转换电路2包括差分放大器部分10和源极跟随器部分20.当差分电压信号INp和INn分别输入到第一输入端子5和第二输入端子6时,操作发生在只有 差分放大器部分10或者差分放大器部分10和源极跟随器部分20工作的模式或仅源极跟随器部分20工作的模式,根据差分电压信号INp和INn的电平 。 与包括两个差分放大器电路的电路相比,差分放大器部分10和源极跟随器部分20具有较少的部件。 通过这种方式,可以减少电路面积,并且可以减少电流消耗。 此外,由于源极跟随器部分20执行差分电压信号INp和INn的非反相放大,因此可以进行高速操作。