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    • 10. 发明申请
    • Holding structure for electronic part
    • 电子部件保持结构
    • US20070091580A1
    • 2007-04-26
    • US10580342
    • 2004-11-19
    • Hisayoshi OkuyaKeiji Yasuda
    • Hisayoshi OkuyaKeiji Yasuda
    • H05K5/00
    • G01D11/245B29C45/14065B29C45/14639B29C45/14836B29C45/1671B29L2031/3061
    • A holding structure for an electronic part includes a first resin mold which has a positioning shape portion for the electronic part, and a second resin mold which is insert-molded to cover the first resin mold and the electronic part positioned with the first resin mold. Through holes for passing an insert resin material adapted to form the second resin mold is formed in the positioning shape portion of the first resin mold. The holding structure for the electronic part improves the positioning accuracy of the electronic part by virtue of the positioning shape portion for accommodating the electronic part, and prevents occurrence of deformations and cracks in the positioning shape portion due to insert-molding.
    • 电子部件保持结构包括具有用于电子部件的定位形状部分的第一树脂模具和嵌入成型以覆盖第一树脂模具和位于第一树脂模具的电子部件的第二树脂模具。 在第一树脂模具的定位形状部分中形成有用于使适于形成第二树脂模具的插入树脂材料通过的通孔。 用于电子部件的保持结构由于用于容纳电子部件的定位形状部分而提高了电子部件的定位精度,并且防止由于插入成型而导致定位形状部分中的变形和裂纹的发生。