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    • 2. 发明授权
    • Resin magnetic compound and molded article thereof
    • 树脂磁性复合物及其成型体
    • US5562852A
    • 1996-10-08
    • US270420
    • 1994-07-05
    • Masahito TadaKeiichiro Suzuki
    • Masahito TadaKeiichiro Suzuki
    • H01F1/08H01F1/113H01F1/00H01F1/26
    • H01F1/083H01F1/113
    • A resin magnetic compound is disclosed, comprising (i) from 65 to 77% by weight of a magnetic powder having been surface treated with from 0.01 to 5% by weight, based on the magnetic powder, of a mercaptosilane represented by the following formula (I) or a hydrolysis product of the mercaptosilane:(RO).sub.n R'.sub.(3-n) SiR"SH (I)wherein R and R' each represents an alkyl group having 1 or 2 carbon atoms; R" represents an alkylene group having from 2 to 6 carbon atoms; and n represents 2 or 3, (ii) from 14 to 30% by weight of polyphenylene sulfide resin, and (iii) from 9 to 21% by weight of glass fiber. The resin magnetic compound and a molded article obtained from the compound are excellent in thermal shock resistance, magnetic characteristics, and heat resistance.
    • 公开了一种树脂磁性化合物,其包含(i)65〜77重量%的以磁铁粉为基准,以0.01〜5重量%进行表面处理的磁性粉末的下式所示的巯基硅烷( I)或巯基硅烷的水解产物:(RO)nR'(3-n)SiR''SH(I)其中R和R'各自表示具有1或2个碳原子的烷基; R“表示碳原子数2〜6的亚烷基。 n表示2或3,(ii)14〜30重量%的聚苯硫醚树脂,(iii)9〜21重量%的玻璃纤维。 树脂磁性化合物和由该化合物得到的成型体的耐热冲击性,磁特性和耐热性优异。
    • 6. 发明授权
    • Resin composition and molded or formed product
    • 树脂组合物和模制或成型产品
    • US06342557B1
    • 2002-01-29
    • US09389902
    • 1999-09-03
    • Keiichiro SuzukiMasahito Tada
    • Keiichiro SuzukiMasahito Tada
    • C08K332
    • H01F41/0246H01F1/37
    • A resin composition comprising a synthetic resin and a powdered magnetic material, wherein (1) the powdered magnetic material is soft ferrite powder having a rate of permeability change by temperature ranging from −0.040 to 0.010%/° C. in a temperature range of from 20° C. to 80° C. and an average particle diameter ranging from 2 to 1,000 &mgr;m, and (2) the powdered magnetic material is contained in a proportion of 50 to 1,400 parts by weight per 100 parts by weight of the synthetic resin, and a molded or formed product which is formed from the resin composition and exhibits a permeability stable to changes in environmental temperature.
    • 一种包含合成树脂和粉末状磁性材料的树脂组合物,其中(1)所述粉末状磁性材料是软磁铁氧体粉末,其磁导率的变化温度范围为-0.040至0.010%/℃,温度范围为 20℃〜80℃,平均粒径为2〜1000μm,(2)相对于合成树脂100重量份,粉末状磁性体的比例为50〜1400重量份 ,以及由该树脂组合物形成且呈现出对环境温度变化稳定的渗透性的成型品。
    • 7. 发明授权
    • Resinous soft magnetic composition
    • 树脂软磁组合物
    • US5510412A
    • 1996-04-23
    • US199706
    • 1994-02-22
    • Keiichiro SuzukiMasahito Tada
    • Keiichiro SuzukiMasahito Tada
    • C08K3/22C08L23/06C08L81/02H01F1/37C08J5/10C08K3/08C08L81/04
    • H01F1/37C08L81/02C08L23/06
    • A resinous soft magnetic composition is constituted by (a) 80-95 wt. % of a powdery soft magnetic material, and (b) 5-20 wt. % of a resin component comprising (1) 70-99.5 wt. % of a polyarylene sulfide resin, and (2) 0.5-30 wt. % of an ultrahigh-molecular weight polyethylene having a weight-average molecular weight of from about 4.times.10.sup.5 to about 7.times.10.sup.6. Because of the inclusion of the ultrahigh-molecular weight polyethylene, the magnetic composition is provided with an improved melt-flowability suitable for injection molding while retaining a sufficient soldering heat-resistance as represented by a freeness of a molded product thereof from cracking after dipping in a solder bath at about 260.degree. C. for 10 sec.
    • 树脂软磁性组合物由(a)80-95重量% %的粉状软磁性材料,和(b)5-20重量% %的树脂组分包括(1)70-99.5wt。 %的聚芳硫醚树脂,和(2)0.5-30重量% %的重均分子量为约4×10 5至约7×10 6的超高分子量聚乙烯。 由于包含超高分子量聚乙烯,磁性组合物具有改进的适于注射成型的熔体流动性,同时保持足够的焊接耐热性,如其模塑产品的游离度所示,其浸渍后的开裂 在约260℃下的焊料浴10秒。
    • 8. 发明授权
    • IC socket
    • IC插座
    • US07198734B2
    • 2007-04-03
    • US10471118
    • 2002-03-27
    • Naomitsu NishihataMasahito Tada
    • Naomitsu NishihataMasahito Tada
    • H01B1/24H01R12/14H05K7/14
    • C08K3/04H01R13/22
    • The invention provides an IC socket of synthetic resin, whose surface resistivity is strictly controlled to the desired level and which is much more improved in terms of electrical insulation properties, mechanical properties, heat resistance, chemical resistance, dimensional stability, etc. The IC socket is obtained by molding or otherwise forming a thermoplastic resin composition comprising 40 to 94% by mass of a thermoplastic resin, 5 to 30% by mass of a carbon precursor having a volume resistivity of 102 to 1010 Ω·cm and 1 to 30% by mass of an electrical conductive filler having a volume resistivity of less than 102 Ω·cm.
    • 本发明提供一种合成树脂的IC插座,其表面电阻率被严格控制到所需的水平,并且在电绝缘性能,机械性能,耐热性,耐化学性,尺寸稳定性等方面得到更多改进。 通过成型或以其他方式形成包含40〜94质量%的热塑性树脂的热塑性树脂组合物,5〜30质量%的体积电阻率为10〜10重量%的碳前体, SUP〜10Ω·cm,1〜30质量%的体积电阻率小于10Ω·cm的导电填料。