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1. 发明申请

US20080099536A1 MICRO COMPONENT REMOVING METHOD AND MICRO COMPONENT REMOVING APPARATUS 有权
标题翻译：微元件拆卸方法和微型元件拆卸设备
公开(公告)号：US20080099536A1
公开(公告)日：2008-05-01
申请号：US11966410
申请日：2007-12-28
申请人： Keiichi YAMAMOTO , Masakazu TAKESUE , Masanao FUJII , Toru OKADA
发明人： Keiichi YAMAMOTO , Masakazu TAKESUE , Masanao FUJII , Toru OKADA
IPC分类号： B23K1/018 , B23K1/20
CPC分类号： H05K3/303 , H05K3/3494 , H05K13/0486 , H05K2203/0195 , H05K2203/176 , Y02P70/613
摘要： A method and a apparatus for removing a micro component surely and leveling solder remaining on a substrate without imposing thermal damage to solder lands, the substrate and components on the periphery. A thermosetting adhesive (15) is provided on the surface (12a) of a micro component (12) opposite to the side of a substrate (11), and the distal end of a component holding pin (13) having cross-section area falling within the surface (12a) of the micro component (12) opposite to the side of the surface (11) is passed through the thermosetting adhesive (15) to abut against the surface (12a) of the micro component (12). Subsequently, solder (16) between the micro component (12) and the substrate (11) is heated to melt and the component holding pin (13) is moved in the direction receding from the substrate (11). Consequently, the micro component (12) is removed from the substrate (11).
摘要翻译：一种用于清除微量部件并且保持在衬底上的焊料平整化的方法和装置，而不会对焊盘，衬底和周边部件造成热损伤。在与基板（11）侧相对的微型部件（12）的表面（12a）上设置有热固性粘合剂（15），并且部件保持销（13）的前端具有横截面积落在微型部件（12）的与表面（11）侧相反的表面（12a）内的部分通过热固性粘合剂（15）以抵靠微型部件（12）的表面（12a）。随后，加热微型部件（12）和基板（11）之间的焊料（16）熔化，使部件保持销（13）从基板（11）退出的方向移动。因此，从基板（11）移除微型部件（12）。

2. 发明申请

US20100213248A1 MICRO COMPONENT REMOVING METHOD 有权
标题翻译：微元件拆卸方法
公开(公告)号：US20100213248A1
公开(公告)日：2010-08-26
申请号：US12774881
申请日：2010-05-06
申请人： Keiichi YAMAMOTO , Masakazu TAKESUE , Masanao FUJII , Toru OKADA
发明人： Keiichi YAMAMOTO , Masakazu TAKESUE , Masanao FUJII , Toru OKADA
IPC分类号： B23K1/018
CPC分类号： H05K3/303 , H05K3/3494 , H05K13/0486 , H05K2203/0195 , H05K2203/176 , Y02P70/613
摘要： A method and an apparatus for removing a micro component surely and leveling solder remaining on a substrate without imposing thermal damage to solder lands, the substrate and components on the periphery. A thermosetting adhesive (15) is provided on the surface (12a) of a micro component (12) opposite to the side of a substrate (11), and the distal end of a component holding pin (13) having cross-section area falling within the surface (12a) of the micro component (12) opposite to the side of the surface (11) is passed through the thermosetting adhesive (15) to abut against the surface (12a) of the micro component (12). Subsequently, solder (16) between the micro component (12) and the substrate (11) is heated to melt and the component holding pin (13) is moved in the direction receding from the substrate (11). Consequently, the micro component (12) is removed from the substrate (11).
摘要翻译：一种用于清除微量部件并且保持在基板上的焊料平整化的方法和装置，而不会对焊接区，基板和外围部件造成热损伤。在与基板（11）侧相对的微型部件（12）的表面（12a）上设置有热固性粘合剂（15），并且部件保持销（13）的前端具有截面积下降在微组件（12）的与表面（11）侧相反的表面（12a）内通过热固性粘合剂（15）以抵靠微组件（12）的表面（12a）。随后，加热微型部件（12）和基板（11）之间的焊料（16）熔化，使部件保持销（13）从基板（11）退出的方向移动。因此，从基板（11）移除微型部件（12）。

3. 发明申请

US20110141705A1 PRINTED WIRING BOARD AND ELECTRONIC APPARATUS 审中-公开
标题翻译：印刷线路板和电子设备
公开(公告)号：US20110141705A1
公开(公告)日：2011-06-16
申请号：US12961650
申请日：2010-12-07
申请人： Masakazu TAKESUE , Keiichi YAMAMOTO
发明人： Masakazu TAKESUE , Keiichi YAMAMOTO
IPC分类号： H05K5/00 , H05K1/11
CPC分类号： G06F1/183 , G06F1/1658 , H01L2224/16227 , H01L2924/15153 , H05K1/111 , H05K1/183 , H05K3/3436 , H05K2201/09709 , Y02P70/611
摘要： A printed wiring board supports an electronic component thereon. The printed wiring board includes an opening which is recessed from a surface of the printed wiring board. The opening has a dimension which houses the electronic component therein. A plurality of pads is disposed on a bottom surface of the opening. The plurality of pads has a skew arrangement in a grid pattern with respect to inner edges of the opening.
摘要翻译：印刷电路板在其上支撑电子部件。印刷布线板包括从印刷线路板的表面凹陷的开口。开口具有容纳电子部件的尺寸。多个垫片设置在开口的底表面上。多个焊盘相对于开口的内边缘具有格栅图案的偏斜布置。

4. 发明申请

US20110006405A1 SEMICONDUCTOR DEVICE, MANUFACTURE METHOD OF SEMICONDUCTOR DEVICE, AND ELECTRONIC APPARATUS 审中-公开
标题翻译：半导体器件，半导体器件的制造方法和电子设备
公开(公告)号：US20110006405A1
公开(公告)日：2011-01-13
申请号：US12818331
申请日：2010-06-18
申请人： Keiichi YAMAMOTO , Takashi FUKUDA
发明人： Keiichi YAMAMOTO , Takashi FUKUDA
IPC分类号： H01L23/00 , H01L21/71
CPC分类号： H05K1/0271 , H01L23/498 , H01L23/562 , H01L2924/0002 , H05K1/181 , H05K2201/09909 , H05K2201/10204 , H05K2201/10689 , H05K2201/2009 , H01L2924/00
摘要： A semiconductor device includes a substrate, an electronic component and a resin member. The substrate has a first electrode. The electronic component is provided on the substrate, and has a second electrode electrically connected to the first electrode. The resin member alleviates an external stress to the second electrode of the electronic component. The resin member is disposed on the substrate at a region separated from the electronic component.
摘要翻译：半导体器件包括基板，电子部件和树脂部件。基板具有第一电极。电子部件设置在基板上，并且具有与第一电极电连接的第二电极。树脂构件减轻对电子部件的第二电极的外部应力。树脂构件在与电子部件分离的区域处设置在基板上。

5. 发明申请

US20080129136A1 AXIAL GAP TYPE MOTOR 失效
标题翻译：轴孔式电机
公开(公告)号：US20080129136A1
公开(公告)日：2008-06-05
申请号：US11947260
申请日：2007-11-29
申请人： Shoei ABE , Hirofumi ATARASHI , Keiichi YAMAMOTO , Shigeru TAJIMA , Makoto KAWAKAMI , Takeo FUKUDA
发明人： Shoei ABE , Hirofumi ATARASHI , Keiichi YAMAMOTO , Shigeru TAJIMA , Makoto KAWAKAMI , Takeo FUKUDA
IPC分类号： H02K16/04 , H02K21/00
CPC分类号： H02K21/042 , H02K16/04 , H02K21/04
摘要： An axial gap type motor according to the present invention includes: a rotor; and a pair of stators which are arranged to face each other and hold the rotor from both sides thereof along a rotation axis. The rotor includes: electromagnets which are provided on the rotor as main magnets, and arranged along a circumferential direction so that directions of magnetic fluxes thereof are parallel to the rotation axis; and sub permanent magnets which are provided on the rotor, arranged in the vicinities of circumferential end portions of the main magnets, and are magnetized orthogonal to the rotation axis and a radial direction.
摘要翻译：根据本发明的轴向间隙型电动机包括：转子; 以及一对定子，其被布置成彼此面对并且沿着旋转轴线从其两侧保持转子。转子包括：电磁体，其设置在转子上作为主磁体，沿圆周方向布置，使得其磁通方向平行于旋转轴线; 以及设置在转子上的副永磁体，其设置在主磁体的周向端部附近，并且与旋转轴线和径向正交地被磁化。

6. 发明申请

US20090085688A1 Semiconductor Circuit, and Computing Device and Communications Device Using the Same 有权
标题翻译：半导体电路和使用其的计算设备和通信设备
公开(公告)号：US20090085688A1
公开(公告)日：2009-04-02
申请号：US12145829
申请日：2008-06-25
申请人： Keiichi YAMAMOTO , Norio Chujo , Toru Yazaki , Hisaaki Kanai
发明人： Keiichi YAMAMOTO , Norio Chujo , Toru Yazaki , Hisaaki Kanai
IPC分类号： H03H11/30
CPC分类号： H03F3/3028 , H01L2924/19051 , H03F1/308 , H03F2200/447 , H03F2200/453 , H03K19/017581
摘要： In a semiconductor circuit, an impedance adjustment circuit having the characteristics same as those of a circuit having the nonlinear resistance characteristics is configured to include an operating point calculation circuit automatically calculating an operating point with a reference resistance through feedback control, and an impedance calculation circuit calculating the impedance at the operating point found by the operating point calculation circuit. The impedance adjustment circuit is also provided with an impedance determination circuit that determines whether or not the impedance found by the impedance calculation circuit is in a predetermined range. These components, i.e., the operating point calculation circuit, the impedance calculation circuit, and the impedance determination circuit, are provided each two for High-side and Low-side impedance adjustment use.
摘要翻译：在半导体电路中，具有与具有非线性电阻特性的电路相同特性的阻抗调整电路被配置为包括工作点计算电路，通过反馈控制自动计算具有参考电阻的工作点，以及阻抗计算电路计算由工作点计算电路找到的工作点处的阻抗。阻抗调整电路还设置有阻抗确定电路，其确定由阻抗计算电路发现的阻抗是否在预定范围内。这两个部件，即工作点计算电路，阻抗计算电路和阻抗确定电路，每两个用于高侧和低侧阻抗调节。

7. 发明申请

US20210231906A1 CAMERA ACTUATOR, CAMERA MODULE, AND CAMERA MOUNTING DEVICE 有权
公开(公告)号：US20210231906A1
公开(公告)日：2021-07-29
申请号：US17050840
申请日：2019-04-10
申请人： Masahiro SAITO , Keiichi YAMAMOTO , Hiroshi MATSUDA
发明人： Masahiro SAITO , Keiichi YAMAMOTO , Hiroshi MATSUDA
IPC分类号： G02B7/09 , H04N5/232
摘要： A camera actuator comprises: a fixed-side member; a movable-side member provided so as to be displaced in relation to the fixed-side member, the movable-side member holding a lens unit; and a drive unit that generates drive force to displace the movable-side member within a plane including a first direction and a second direction orthogonal to the first direction, the drive unit generating as drive force a combined force obtained by combining a propulsion force that displaces the movable-side member in a specified direction that is either the first direction or the second direction, and a resistance force that resists an external force acting so as to cause the movable-side member to deviate from the specified direction.

8. 发明申请

US20100090555A1 AXIAL GAP TYPE MOTOR 有权
标题翻译：轴孔式电机
公开(公告)号：US20100090555A1
公开(公告)日：2010-04-15
申请号：US12576837
申请日：2009-10-09
申请人： Shigeru TAJIMA , Keiichi YAMAMOTO
发明人： Shigeru TAJIMA , Keiichi YAMAMOTO
IPC分类号： H02K21/24 , H02K15/03
CPC分类号： H02K1/2793 , H02K21/24 , Y10T29/49012
摘要： An axial gap type motor 10 includes: a rotor 11 having a rotor core 13, the rotor core 13 including: multiple main magnet pieces 41 respectively magnetized in a direction of the rotation axis O of the rotor, and multiple main magnet piece storing hole portions 15 respectively for holding associated main magnet pieces; and a pair of stators 12 to be mounted onto the rotor 11, wherein the rotor core 13 is structured by winding a tape-shaped magnetic plate 14, and includes a first winding layer and a second winding layer; and in portions of the first and second winding layers that are situated in the same phase from the center of rotation of the rotor core 13, the first winding layer includes an outside magnetic flux short preventive portions 62, and the second winding layer includes an outside connecting portions 61.
摘要翻译：轴向间隙型电动机10包括：具有转子铁心13的转子11，转子铁心13，其具有分别在转子的旋转轴线O方向上磁化的多个主磁体片41，以及多个主磁体片收容孔部 15分别用于固定相关的主磁片; 以及安装在转子11上的一对定子12，其中转子芯13通过缠绕带状磁性板14构成，并且包括第一绕组层和第二绕组层; 并且在从转子铁芯13的旋转中心位于同一相位的第一和第二绕组层的部分中，第一绕组层包括外部磁通量短路部62，第二绕组层包括外部连接部61。

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