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1. 发明授权

US06213852B1 Polishing apparatus and method of manufacturing a semiconductor device using the same 失效
标题翻译：抛光装置及其制造方法
公开(公告)号：US06213852B1
公开(公告)日：2001-04-10
申请号：US09350920
申请日：1999-07-12
申请人： Kazuyuki Fujii , Takanori Sasaki , Mahito Sawada , Kouichiro Tsutahara
发明人： Kazuyuki Fujii , Takanori Sasaki , Mahito Sawada , Kouichiro Tsutahara
IPC分类号： B24B2900
CPC分类号： B24B37/04 , B24B57/02
摘要： A method of manufacturing a semiconductor device using a polishing apparatus is provided. A top ring holding a wafer is arranged on a pad. A polishing chemical liquid supply line for supplying a polishing chemical liquid is arranged above the pad in a direction ahead of rotation with respect to the top ring. Around the center of rotation of the pad, a partition plate having a columnar side surface is arranged. Above the pad on a side which goes away from the top ring when the pad is rotated, a polishing chemical liquid draining mechanism is arranged extending continuously from the partition plate to the outer periphery of the pad. Accordingly, a polishing apparatus is obtained by which the amount of polishing of the surface to be polished of the semiconductor substrate is stabilized and generation of microscratches on the surface to be polished can be suppressed.
摘要翻译：提供了使用抛光装置制造半导体器件的方法。保持晶片的顶环布置在垫上。用于供给研磨用化学液的研磨用药液供给配线相对于上述环设置在相对于上述旋转方向的方向上。围绕垫的旋转中心，布置有具有柱状侧表面的隔板。在衬垫旋转时离开顶环的一侧的衬垫上方，抛光化学液排放机构被布置成从隔板连续延伸到衬垫的外周。因此，可以获得能够稳定半导体基板的被研磨面的研磨量并且能够抑制待研磨面的微细化的研磨装置。

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