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    • 4. 发明申请
    • METHOD OF MANUFACTURING TRANSFER MASK AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    • 制造转移掩模的方法和制造半导体器件的方法
    • US20110217635A1
    • 2011-09-08
    • US13122680
    • 2010-10-08
    • Masahiro HashimotoKazuya SakaiToshiyuki SuzukiKazunori Ono
    • Masahiro HashimotoKazuya SakaiToshiyuki SuzukiKazunori Ono
    • G03F1/00
    • G03F1/46G03F1/54G03F1/80G03F1/82
    • The present invention is a method of manufacturing a transfer mask with use of a mask blank in which a thin film for pattern formation and a chromium-based thin film made of a material containing chromium are stacked on a transparent substrate in this order. The thin film for pattern formation is made of material containing silicon and a transition metal other than chromium. The chromium-based thin film is made of a material containing chromium. Exposure light having a wavelength of 200 nm or less is applied to the transfer mask. In the manufacturing method, the transfer mask is produced by performing, in the following order, a process of forming a resist film having a transfer pattern on the chromium-based thin film, a process of forming a transfer pattern in the chromium-based thin film with use of a mask of the resist film having the transfer pattern, a process of forming a transfer pattern in the thin film for pattern formation with use of a mask of the chromium-based thin film having the transfer pattern, and a process of removing the chromium-based thin film by etching. The manufacturing method further includes a cleaning process of at least one of alkali solution cleaning, hot water cleaning, and ozone-containing water cleaning on the produced transfer mask until a width of the transfer pattern of the thin film for pattern formation is reduced by 4 nm or a space width of the thin film for pattern formation is increased by 4 nm.
    • 本发明是一种使用掩模坯料制造转印掩模的方法,其中用于图案形成的薄膜和由含铬材料制成的铬基薄膜依次层叠在透明基板上。 用于图案形成的薄膜由含有硅和除铬以外的过渡金属的材料制成。 铬基薄膜由含铬的材料制成。 将具有200nm以下波长的曝光光施加到转印掩模。 在制造方法中,通过以下顺序,通过在铬系薄膜上形成具有转印图案的抗蚀剂膜的工序来制造转印掩模,在铬系薄膜中形成转印图案的工序 使用具有转印图案的抗蚀剂膜的掩模的膜,使用具有转印图案的铬基薄膜的掩模在图案形成用薄膜中形成转印图案的工序,以及 通过蚀刻去除铬基薄膜。 该制造方法还包括在制造的转印掩模上进行碱溶液清洗,热水清洗和含臭氧水清洗中的至少一种的清洗处理,直到图案形成用薄膜的转印图案的宽度减少4 nm或用于图案形成的薄膜的空间宽度增加4nm。
    • 10. 发明授权
    • Method of manufacturing transfer mask and method of manufacturing semiconductor device
    • 传输掩模的制造方法和制造半导体器件的方法
    • US08197993B2
    • 2012-06-12
    • US13122680
    • 2010-10-08
    • Masahiro HashimotoKazuya SakaiToshiyuki SuzukiKazunori Ono
    • Masahiro HashimotoKazuya SakaiToshiyuki SuzukiKazunori Ono
    • G03F1/00B08B3/00
    • G03F1/46G03F1/54G03F1/80G03F1/82
    • The present invention is a method of manufacturing a transfer mask with use of a mask blank in which a thin film for pattern formation and a chromium-based thin film made of a material containing chromium are stacked on a transparent substrate in this order. The thin film for pattern formation is made of material containing silicon and a transition metal other than chromium. The chromium-based thin film is made of a material containing chromium. Exposure light having a wavelength of 200 nm or less is applied to the transfer mask. In the manufacturing method, the transfer mask is produced by performing, in the following order, a process of forming a resist film having a transfer pattern on the chromium-based thin film, a process of forming a transfer pattern in the chromium-based thin film with use of a mask of the resist film having the transfer pattern, a process of forming a transfer pattern in the thin film for pattern formation with use of a mask of the chromium-based thin film having the transfer pattern, and a process of removing the chromium-based thin film by etching. The manufacturing method further includes a cleaning process of at least one of alkali solution cleaning, hot water cleaning, and ozone-containing water cleaning on the produced transfer mask until a width of the transfer pattern of the thin film for pattern formation is reduced by 4 nm or a space width of the thin film for pattern formation is increased by 4 nm.
    • 本发明是一种使用掩模坯料制造转印掩模的方法,其中用于图案形成的薄膜和由含铬材料制成的铬基薄膜依次层叠在透明基板上。 用于图案形成的薄膜由含有硅和除铬以外的过渡金属的材料制成。 铬基薄膜由含铬的材料制成。 将具有200nm以下波长的曝光光施加到转印掩模。 在制造方法中,通过以下顺序,通过在铬系薄膜上形成具有转印图案的抗蚀剂膜的工序来制造转印掩模,在铬系薄膜中形成转印图案的工序 使用具有转印图案的抗蚀剂膜的掩模的膜,使用具有转印图案的铬基薄膜的掩模在图案形成用薄膜中形成转印图案的工序,以及 通过蚀刻去除铬基薄膜。 该制造方法还包括在制造的转印掩模上进行碱溶液清洗,热水清洗和含臭氧水清洗中的至少一种的清洗处理,直到图案形成用薄膜的转印图案的宽度减少4 nm或用于图案形成的薄膜的空间宽度增加4nm。