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1. 发明授权

US6121579A Heating apparatus, and processing apparatus 失效
标题翻译：加热装置和加工装置
公开(公告)号：US6121579A
公开(公告)日：2000-09-19
申请号：US807772
申请日：1997-02-27
申请人： Kazutsugu Aoki , Wataru Okase , Hironori Yagi , Masamichi Nomura
发明人： Kazutsugu Aoki , Wataru Okase , Hironori Yagi , Masamichi Nomura
IPC分类号： C23C16/48 , C30B25/10 , C30B25/14 , H01L21/00 , F27B11/00
CPC分类号： H01L21/67115 , C23C16/481 , C30B25/10 , C30B25/14
摘要： A heat treating apparatus comprises a process chamber within which a wafer is subjected to a heat treatment. A supporting plate for supporting the wafer is arranged within the process chamber. A process gas is supplied from above into the process chamber. A main heating means for heating the wafer is arranged below the process chamber, with a transmitting window interposed therebetween. The main heating means includes a plurality of heating sources for irradiating the supporting plate with heat rays so as to heat the wafer indirectly and a rotatable table having the heating sources arranged on the front surface thereof. The heat treating apparatus also comprises an auxiliary heating means for compensating for an uneven temperature caused on the surface of the wafer by the main heating means. The heating source of the auxiliary heating means is arranged on the surface of the rotatable table together with the heating sources of the main heating means, and the heat output from the heating source of the auxiliary heating means can be controlled independently of the heat output from the heating sources of the main heating means.
摘要翻译：热处理装置包括处理室，在该处理室内对晶片进行热处理。用于支撑晶片的支撑板布置在处理室内。处理气体从上方供应到处理室中。用于加热晶片的主加热装置布置在处理室的下方，其间插入有透射窗。主加热装置包括多个加热源，用于向支撑板照射热射线以间接加热晶片，并且具有布置在其前表面上的加热源的可旋转工作台。热处理装置还包括用于补偿由主加热装置在晶片表面引起的不均匀温度的辅助加热装置。辅助加热装置的加热源与主加热装置的加热源一起布置在可旋转工作台的表面上，并且可以独立于来自辅助加热装置的加热源的热源的输出来控制从辅助加热装置的加热源输出的热量主要加热装置的加热源。

2. 发明授权

US06473993B1 Thermal treatment method and apparatus 失效
标题翻译：热处理方法及装置
公开(公告)号：US06473993B1
公开(公告)日：2002-11-05
申请号：US09537768
申请日：2000-03-30
申请人： Yasushi Yagi , Takeshi Sakuma , Wataru Okase , Masayuki Kitamura , Hironori Yagi , Eisuke Morisaki
发明人： Yasushi Yagi , Takeshi Sakuma , Wataru Okase , Masayuki Kitamura , Hironori Yagi , Eisuke Morisaki
IPC分类号： F26B304
CPC分类号： H01L21/67109
摘要： A semiconductor wafer is mounted on a susceptor disposed in a processing chamber, the wafer is heated at a temperature on the order of 1000° C. for annealing, and a gas is supplied from a gas supply device disposed opposite to the wafer. When raising the temperature of the wafer and/or when lowering the temperature of the wafer, intra-surface temperature difference is limited to a small value to suppress the occurrence of slips. A gas supply device is divided into sections corresponding to a central part and a peripheral part, respectively, of the wafer to supply the gas at different flow rates onto the central part and the peripheral part, respectively. When raising the temperature of the wafer, for example, a gas of a temperature higher (lower) than that of the wafer is supplied at a flow rate per unit area greater (lower) than that at which the gas is supplied to the peripheral part to the central part. When lowering the temperature of the wafer, for example, a gas of a temperature higher (lower) than that of the wafer is supplied at a flow rate per unit area lower (higher) than that at which the gas is supplied to the peripheral part to the central part.
摘要翻译：将半导体晶片安装在设置在处理室中的基座上，将晶片在约1000℃的温度下加热退火，并且从与晶片相对设置的气体供给装置供给气体。当提高晶片的温度和/或当降低晶片的温度时，将表面内温度差限制在较小的值以抑制滑移的发生。气体供给装置分别对应于晶片的中心部分和周边部分，以将不同流量的气体分别供应到中心部分和周边部分。当提高晶片的温度时，例如以比晶片的温度更高（低于）的温度的气体以比将气体供应到周边部分的流量更大（下）到中部。当降低晶片的温度时，例如以比晶片的温度更高（更低）的温度的气体以比供应气体的周边部分低的（高）的单位面积的流量被供给到中部。

3. 发明授权

US5938850A Single wafer heat treatment apparatus 失效
标题翻译：单晶片热处理设备
公开(公告)号：US5938850A
公开(公告)日：1999-08-17
申请号：US689035
申请日：1996-07-30
申请人： Junichi Arami , Hironori Yagi , Kazutsugu Aoki
发明人： Junichi Arami , Hironori Yagi , Kazutsugu Aoki
IPC分类号： C23C16/44 , C23C16/455 , C23C16/458 , C23C16/48 , H01L21/00 , H01L21/205 , C23C16/00
CPC分类号： C23C16/45521 , C23C16/45561 , C23C16/4585 , C23C16/481 , H01L21/67017 , H01L21/67115
摘要： A single wafer heat treatment apparatus in which an object to be treated placed on a susceptor supported on a heat insulating member is heat-treated by indirectly heating the object to be treated by means of heating lamps disposed under the susceptor, characterized in that a gas entry preventive member for preventing process gas from being turned about the back surface of the susceptor is provided on a peripheral edge portion of the back surface of the susceptor. With this, process gas having entered the back surface of the susceptor is consumed by the adherence of a formed film to the surface of the gas entry preventive member.
摘要翻译：一种单晶片热处理设备，其中放置在支撑在绝热构件上的基座上的待处理物体通过利用设置在基座下方的加热灯间接加热被处理物体进行热处理，其特征在于，气体在基座的背面的周缘部设置用于防止处理气体绕基座的背面转动的入口防止部件。由此，进入基座的背面的处理气体被成膜的粘附物消耗到气体入口防止部件的表面。

4. 发明申请

US20050145404A1 Cooling system, electronic equipment, and external unit 有权
标题翻译：冷却系统，电子设备和外部设备
公开(公告)号：US20050145404A1
公开(公告)日：2005-07-07
申请号：US10991163
申请日：2004-11-16
申请人： Hironori Yagi , Yasuhiro Ootori
发明人： Hironori Yagi , Yasuhiro Ootori
IPC分类号： G06F1/20 , H05K5/00 , H05K7/20
CPC分类号： G06F1/20
摘要： Electronic equipment (3) has an electronic equipment main body (1) and an external device (2) attached to this electronic equipment main body (1). A first side face (21B) of a housing (21) for the external device (2) adjoins an exhaust port (112) of the electronic equipment main body (1). A first opening (211B) is formed on this first side face (21B). A second opening (211D) is formed on a third side face (21D) facing the first side face (21B). Because of the rotation of an exhaust fan (113) and the air exhausted from the exhaust port (112), negative pressure is generated near the first opening (211B), and air flows from the second opening (211D) to the first opening (211B).
摘要翻译：电子设备（3）具有安装在该电子设备主体（1）上的电子设备主体（1）和外部设备（2）。用于外部设备（2）的壳体（21）的第一侧面（21B）与电子设备主体（1）的排气口（112）相邻。第一开口（211B）形成在该第一侧面（21B）上。第二开口（211D）形成在面对第一侧面（21B）的第三侧面（21D）上。由于排气风扇113的旋转和从排气口112排出的空气，在第一开口211b附近产生负压，空气从第二开口211D流向第一开口211。开放（211B）。

5. 发明授权

US5591269A Vacuum processing apparatus 失效
标题翻译：真空加工设备
公开(公告)号：US5591269A
公开(公告)日：1997-01-07
申请号：US265134
申请日：1994-06-23
申请人： Junichi Arami , Kenji Ishikawa , Youichi Deguchi , Hironori Yagi , Nobuo Kawada , Isao Yanagisawa
发明人： Junichi Arami , Kenji Ishikawa , Youichi Deguchi , Hironori Yagi , Nobuo Kawada , Isao Yanagisawa
IPC分类号： C23C16/458 , C23C16/46 , C23C16/00
CPC分类号： C23C16/463 , C23C16/4586 , C23C16/46 , C23C16/466
摘要： A vacuum processing apparatus includes: a processing chamber for performing a film formation process to a semiconductor wafer in a vacuum; a mounting member provided in the processing chamber and having a mounting surface for mounting a target object; an electrostatic chuck, provided to the mounting surface of the mounting member, for chucking the semiconductor wafer; a heating mechanism for heating the semiconductor wafer; and a processing gas supply mechanism for supplying a processing gas for performing the film formation process to the semiconductor wafer into the processing chamber. The mounting member has a base, a first insulating layer formed on the surface of the base, and a second insulating layer formed on the first insulating layer, and has a conductive layer between the first insulating layer and the second insulating layer on the mounting surface side of the mounting member to obtain the above electrostatic chuck constituted by the first insulating layer, the second insulating layer, and the conductive layer, and the heating mechanism has a heating member provided between the first insulating layer and the second insulating layer on the lower surface side of the mounting member.
摘要翻译：真空处理装置包括：处理室，用于在真空中对半导体晶片进行成膜处理; 设置在所述处理室中并具有用于安装目标物体的安装表面的安装构件; 设置在安装构件的安装表面上的用于夹持半导体晶片的静电卡盘; 用于加热半导体晶片的加热机构; 以及处理气体供给机构，用于将用于进行成膜处理的处理气体供给到半导体晶片进入处理室。安装构件具有底座，形成在基座表面上的第一绝缘层和形成在第一绝缘层上的第二绝缘层，并且在安装表面上的第一绝缘层和第二绝缘层之间具有导电层以获得由第一绝缘层，第二绝缘层和导电层构成的上述静电卡盘，并且加热机构具有设置在第一绝缘层和下层的第二绝缘层之间的加热构件安装构件的表面侧。

6. 发明授权

US07245487B2 Cooling system, electronic equipment, and external unit 有权
标题翻译：冷却系统，电子设备和外部设备
公开(公告)号：US07245487B2
公开(公告)日：2007-07-17
申请号：US10991163
申请日：2004-11-16
申请人： Hironori Yagi , Yasuhiro Ootori
发明人： Hironori Yagi , Yasuhiro Ootori
IPC分类号： H05K7/20
CPC分类号： G06F1/20
摘要： Electronic equipment (3) has an electronic equipment main body (1) and an external device (2) attached to this electronic equipment main body (1). A first side face (21B) of a housing (21) for the external device (2) adjoins an exhaust port (112) of the electronic equipment main body (1). A first opening (211B) is formed on this first side face (21B). A second opening (211D) is formed on a third side face (21D) facing the first side face (21B). Because of the rotation of an exhaust fan (113) and the air exhausted from the exhaust port (112), negative pressure is generated near the first opening (211B), and air flows from the second opening (211D) to the first opening (211B).
摘要翻译：电子设备（3）具有安装在该电子设备主体（1）上的电子设备主体（1）和外部设备（2）。用于外部设备（2）的壳体（21）的第一侧面（21B）与电子设备主体（1）的排气口（112）相邻。第一开口（211B）形成在该第一侧面（21B）上。第二开口（211D）形成在面对第一侧面（21B）的第三侧面（21D）上。由于排气风扇113的旋转和从排气口112排出的空气，在第一开口211b附近产生负压，空气从第二开口211D流向第一开口211。开放（211B）。

7. 发明授权

US07113061B2 Tuner unit having a tuner board within the height limit of a tuner signal connector 有权
标题翻译：调谐器单元具有调谐器信号连接器的高度限制内的调谐器板
公开(公告)号：US07113061B2
公开(公告)日：2006-09-26
申请号：US10991164
申请日：2004-11-16
申请人： Yasuhiro Ootori , Kenichi Nagase , Mitsuyuki Tokusashi , Tomonori Hasegawa , Hironori Yagi
发明人： Yasuhiro Ootori , Kenichi Nagase , Mitsuyuki Tokusashi , Tomonori Hasegawa , Hironori Yagi
IPC分类号： H05K5/02
CPC分类号： H04B1/08 , H01R24/50 , H05K1/144 , H05K1/18 , H05K9/006 , H05K2201/10189 , H05K2201/10446
摘要： A receiver (2) includes tuner units (1) and (3), and a circuit board (21). The tuner unit (1) includes a connector (11), a tuner board (12), and a housing (13) for accommodating them. The tuner board (12) is positioned within the limit of a height dimension L perpendicular to the direction of connection (depicted by an arrow P) of the connector (11). In addition, a recess (141B) is formed in the housing (13), in which the circuit board (21) disposed on the recess (141B) is also positioned within the limit of the height dimension L perpendicular to the direction of connection (depicted by an arrow P) of the connector (11).
摘要翻译：接收器（2）包括调谐器单元（1）和（3）以及电路板（21）。调谐器单元（1）包括连接器（11），调谐器板（12）和用于容纳它们的壳体（13）。调谐器板（12）位于垂直于连接器（11）的连接方向（由箭头P表示）的高度尺寸L的限度内。此外，在壳体（13）中形成凹部（141B），其中设置在凹部（141B）上的电路板（21）也位于与垂直于凹部（141B）的方向垂直的高度尺寸L的极限内连接器（11）的连接（由箭头P描绘）。

8. 发明申请

US20050162242A1 Tuner unit, receiver, electronic apparatus 有权
标题翻译：调谐器单元，接收器，电子设备
公开(公告)号：US20050162242A1
公开(公告)日：2005-07-28
申请号：US10991164
申请日：2004-11-16
申请人： Yasuhiro Ootori , Kenichi Nagase , Mitsuyuki Tokusashi , Tomonori Hasegawa , Hironori Yagi
发明人： Yasuhiro Ootori , Kenichi Nagase , Mitsuyuki Tokusashi , Tomonori Hasegawa , Hironori Yagi
IPC分类号： H04B1/08 , H04N5/64 , H05K1/14 , H05K1/18 , H05K5/00 , H05K9/00
CPC分类号： H04B1/08 , H01R24/50 , H05K1/144 , H05K1/18 , H05K9/006 , H05K2201/10189 , H05K2201/10446
摘要： A receiver (2) includes tuner units (1) and (3), and a circuit board (21). The tuner unit (1) includes a connector (11), a tuner board (12), and a housing (13) for accommodating them. The tuner board (12) is positioned within the limit of a height dimension L perpendicular to the direction of connection (depicted by an arrow P) of the connector (11). In addition, a recess (141B) is formed in the housing (13), in which the circuit board (21) disposed on the recess (141B) is also positioned within the limit of the height dimension L perpendicular to the direction of connection (depicted by an arrow P) of the connector (11).
摘要翻译：接收器（2）包括调谐器单元（1）和（3）以及电路板（21）。调谐器单元（1）包括连接器（11），调谐器板（12）和用于容纳它们的壳体（13）。调谐器板（12）位于垂直于连接器（11）的连接方向（由箭头P表示）的高度尺寸L的限度内。此外，在壳体（13）中形成凹部（141B），其中设置在凹部（141B）上的电路板（21）也位于与垂直于凹部（141B）的方向垂直的高度尺寸L的极限内连接器（11）的连接（由箭头P描绘）。

9. 发明授权

US07029301B2 Connection device, connector unit, connectors, and electronic equipment 有权
标题翻译：连接装置，连接器单元，连接器和电子设备
公开(公告)号：US07029301B2
公开(公告)日：2006-04-18
申请号：US10990337
申请日：2004-11-16
申请人： Yasuhiro Ootori , Kenichi Nagase , Mitsuyuki Tokusashi , Tomonori Hasegawa , Hironori Yagi
发明人： Yasuhiro Ootori , Kenichi Nagase , Mitsuyuki Tokusashi , Tomonori Hasegawa , Hironori Yagi
IPC分类号： H01R13/74
CPC分类号： H01R13/6315 , H01R13/518 , H01R13/74 , H01R13/743 , H01R13/748
摘要： A socket (333) of a connector (33) of an adapter (2) has a projecting portion (loose-fit portion) (333B) inserted into a hole (353A) of a base member (35) to support the connector (33) in loosely fitted manner. A diameter (L3) of the projecting portion (333B) is smaller than a diameter L4 of a hole (353A) of the base member (35). A length (L5) along an insertion direction into the hole (353A) is greater than a thickness of the connector attachment side (353).The connector (32) of the adapter (2) has an insertion portion (323) inserted into a cutout portion (353B) of the base member (35). A length (L8) of an extending direction of an insertion body (323A) of the insertion portion (323) is greater than the thickness (L9) of the connector attachment side, while its width (L6) is smaller than a width (L7) of the cutout portion (353B).
摘要翻译：适配器（2）的连接器（33）的插座（333）具有插入到基座构件（35）的孔（353A）中的突出部分（松动配合部分）（333B），以支撑连接器（33）松散配合。突出部（333B）的直径（L 3）小于基部构件（35）的孔（353A）的直径L 4。沿插入方向进入孔（353A）的长度（L 5）大于连接器安装侧（353）的厚度。适配器（2）的连接器（32）具有插入到基部构件（35）的切口部（353B）中的插入部分（323）。插入部（323）的插入体（323A）的延伸方向的长度（L8）大于连接器安装侧的厚度（L 9），而宽度（L 6）小于切口部（353B）的宽度（L 7）。

10. 发明申请

US20050148224A1 Connection device, connector unit, connectors, and electronic equipment 有权
标题翻译：连接装置，连接器单元，连接器和电子设备
公开(公告)号：US20050148224A1
公开(公告)日：2005-07-07
申请号：US10990337
申请日：2004-11-16
申请人： Yasuhiro Ootori , Kenichi Nagase , Mitsuyuki Tokusashi , Tomonori Hasegawa , Hironori Yagi
发明人： Yasuhiro Ootori , Kenichi Nagase , Mitsuyuki Tokusashi , Tomonori Hasegawa , Hironori Yagi
IPC分类号： H01R13/518 , H01R13/631 , H01R13/74 , H01R3/08
CPC分类号： H01R13/6315 , H01R13/518 , H01R13/74 , H01R13/743 , H01R13/748
摘要： A socket (333) of a connector (33) of an adapter (2) has a projecting portion (loose-fit portion) (333B) inserted into a hole (353A) of a base member (35) to support the connector (33) in loosely fitted manner. A diameter (L3) of the projecting portion (333B) is smaller than a diameter L4 of a hole (353A) of the base member (35). A length (L5) along an insertion direction into the hole (353A) is greater than a thickness of the connector attachment side (353). The connector (32) of the adapter (2) has an insertion portion (323) inserted into a cutout portion (353B) of the base member (35). A length (L8) of an extending direction of an insertion body (323A) of the insertion portion (323) is greater than the thickness (L9) of the connector attachment side, while its width (L6) is smaller than a width (L7) of the cutout portion (353B).
摘要翻译：适配器（2）的连接器（33）的插座（333）具有插入到基座构件（35）的孔（353A）中的突出部分（松动配合部分）（333B），以支撑连接器（33）松散配合。突出部（333B）的直径（L 3）小于基部构件（35）的孔（353A）的直径L 4。沿插入方向进入孔（353A）的长度（L 5）大于连接器安装侧（353）的厚度。适配器（2）的连接器（32）具有插入到基部构件（35）的切口部（353B）中的插入部分（323）。插入部（323）的插入体（323A）的延伸方向的长度（L8）大于连接器安装侧的厚度（L 9），而宽度（L 6）小于切口部（353B）的宽度（L 7）。

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