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1. 发明授权

US06640768B1 Lubrication system for direct injected engine 失效
标题翻译：直喷式发动机润滑系统
公开(公告)号：US06640768B1
公开(公告)日：2003-11-04
申请号：US09570632
申请日：2000-05-15
申请人： Kazutoshi Takashima , Takao Nagai , Noriyoshi Hiraoka
发明人： Kazutoshi Takashima , Takao Nagai , Noriyoshi Hiraoka
IPC分类号： F01M1102
CPC分类号： F02B61/045 , F01M3/02 , F02B2075/025
摘要： A lubrication system for a direct injected V-type two-cycle engine is disclosed having a lubricant pump adapted to discharge lubricant into each crankcase chamber of the engine through ports positioned adjacent the downstream side of reed valves of the air intake system. Ports supplying lubricant to cylinders in the right cylinder bank of the engine extend through a left wall of the corresponding crankcase chamber. Ports supplying lubricant to cylinders in the left cylinder bank of the engine extend through a right wall of the corresponding crankcase chamber. During engine assembly, the lubricant pump is manually driven before it is mechanically installed so as to fill the attached supply hoses with lubricant. The pump delivers lubricant to each crankcase chamber at a rate high enough to avoid lubricant carbonization at engine idle and low enough to avoid lubricant resistance to crankshaft rotation, which may make the engine difficult to start.
摘要翻译：公开了一种用于直接喷射的V型双冲程发动机的润滑系统，其具有润滑剂泵，其适于通过邻近进气系统的簧片阀的下游侧的端口将润滑剂排放到发动机的每个曲轴箱室中。向发动机的右气缸组中的气缸供应润滑剂的端口延伸通过相应的曲轴箱室的左壁。向发动机的左气缸组中的气缸供应润滑剂的端口延伸通过相应的曲轴箱室的右壁。在发动机组装过程中，润滑泵在机械安装之前是手动驱动的，以便用润滑剂填充连接的供应软管。该泵以足够高的速率向每个曲轴箱室输送润滑剂，以避免发动机怠速时的润滑剂碳化，并足够低以避免润滑剂抵抗曲轴旋转，这可能使发动机难以起动。

2. 发明授权

US06318331B1 Lubrication system for direct injected engine 有权
标题翻译：直喷式发动机润滑系统
公开(公告)号：US06318331B1
公开(公告)日：2001-11-20
申请号：US09376793
申请日：1999-08-18
申请人： Noriyoshi Hiraoka , Kazutoshi Takashima
发明人： Noriyoshi Hiraoka , Kazutoshi Takashima
IPC分类号： F01M100
CPC分类号： F01M3/00 , F01M1/04 , F02B2075/025
摘要： A lubrication system for a direct injected two-cycle engine is disclosed having a lubricant pump adapted to discharge lubricant into each crankcase chamber of the engine through a port positioned immediately adjacent the downstream side of reed valves of the air intake system. The lubricant is injected in a direction generally coincident with the rotational direction of the crankshaft. Drain ports are positioned in the lowermost scavenge passage of each cylinder and communicate lubricant from the scavenge passage to a return port formed through the wall of a crankcase chamber.
摘要翻译：公开了一种用于直接喷射的双循环发动机的润滑系统，其具有润滑剂泵，其适于通过紧邻进气系统的簧片阀的下游侧将润滑剂排放到发动机的每个曲轴箱室中。润滑剂沿与曲轴的旋转方向大致一致的方向喷射。排水口位于每个气缸的最下面的清除通道中，并将润滑剂从清扫通道传送到通过曲轴箱室的壁形成的回流口。

3. 发明授权

US07005310B2 Manufacturing method of solid-state image sensing device 失效
标题翻译：固态摄像装置的制造方法
公开(公告)号：US07005310B2
公开(公告)日：2006-02-28
申请号：US10651087
申请日：2003-08-29
申请人： Kenji Hanada , Masaki Nakanishi , Tomoo Matsuzawa , Koji Shida , Kazutoshi Takashima
发明人： Kenji Hanada , Masaki Nakanishi , Tomoo Matsuzawa , Koji Shida , Kazutoshi Takashima
IPC分类号： H01L21/00 , H04N5/225
CPC分类号： H01L24/97 , H01L24/45 , H01L24/48 , H01L27/14618 , H01L27/14621 , H01L27/14625 , H01L31/0203 , H01L31/02325 , H01L2224/45144 , H01L2224/48227 , H01L2224/48465 , H01L2224/4848 , H01L2224/85444 , H01L2224/85447 , H01L2924/01029 , H01L2924/12043 , H01L2924/16151 , H01L2924/16152 , H01L2924/181 , H01L2924/19105 , H01L2924/3025 , H05K3/305 , H05K3/323 , H05K3/361 , H05K2201/10977 , H01L2224/48091 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A sensor chip and a lens mount accommodating therein the sensor chip are mounted on a surface of a wiring substrate and a lens holder accommodating a lens therein is coupled with the lens mount. On a rear surface of the wiring substrate, a logic chip, a memory chip and a passive component are mounted and they are sealed with a seal resin. An electrode pad of the sensor chip is electrically connected to an electrode on the surface of the wiring substrate via a bonding wire but a stud bump is also formed on the electrode at the surface of the wiring substrate and this stud bump is connected with the bonding wire. On the surface of the wiring substrate, a flexible substrate is bonded with an anisotropic conductive film and a bonding material. When a camera module is to be manufactured, the surface side of the wiring substrate is assembled after the rear surface side of the wiring substrate is assembled.
摘要翻译：传感器芯片和容纳在其中的传感器芯片的透镜架安装在布线基板的表面上，并且在其中容纳透镜的透镜架与透镜安装座联接。在布线基板的后表面上安装有逻辑芯片，存储芯片和无源部件，并用密封树脂密封。传感器芯片的电极焊盘通过接合线电连接到布线基板的表面上的电极，但是在布线基板的表面上的电极上还形成有凸块，并且该凸块与接合线。在布线基板的表面上，用各向异性导电膜和接合材料粘结柔性基板。当制造相机模块时，在组装布线基板的背面侧之后组装布线基板的表面侧。

4. 发明授权

US5050446A Vibration and torsional damping coupling for a power transmission 失效
标题翻译：用于动力传动的振动和扭转阻尼联轴器
公开(公告)号：US5050446A
公开(公告)日：1991-09-24
申请号：US146349
申请日：1988-01-21
申请人： Kazutoshi Takashima , Hiroaki Fujimoto , Masaki Okazaki
发明人： Kazutoshi Takashima , Hiroaki Fujimoto , Masaki Okazaki
IPC分类号： F16F15/12 , F16F15/124 , F16F15/126 , F16F15/136 , F16F15/14 , F16F15/167 , F16F15/173
CPC分类号： F16F15/124 , F16F15/1442 , F16F15/167 , F16F15/173 , Y10T464/50
摘要： Several embodiments of combined torsional and elastic couplings for transmitting power from an engine output shaft that experiences torque fluctuations and a driveshaft. In each embodiment, the flexible coupling includes an inertial member that is coupled either elastically or by means of a viscous body to the engine output shaft for absorbing the torsional vibrations. In addition, an elastic coupling couples the engine output shaft to the driveshaft for permitting limited relative rotation to absorb torque flux variations in the engine output shaft.
摘要翻译：用于从经受扭矩波动的发动机输出轴和驱动轴传递动力的组合的扭转和弹性联轴器的几个实施例。在每个实施例中，柔性联轴器包括惯性构件，该惯性构件弹性地或通过粘性体耦合到发动机输出轴以吸收扭转振动。此外，弹性联轴器将发动机输出轴连接到驱动轴，以允许有限的相对旋转以吸收发动机输出轴中的扭矩磁通变化。

5. 发明授权

US4857023A Cooling water drainage system for marine propulsion engine 失效
标题翻译：船用推进发动机冷却水排水系统
公开(公告)号：US4857023A
公开(公告)日：1989-08-15
申请号：US155209
申请日：1988-02-12
申请人： Kazutoshi Takashima
发明人： Kazutoshi Takashima
IPC分类号： B63H21/38 , F01P5/12 , F01P11/02
CPC分类号： F01P5/12 , F01P11/02 , B63B2770/00
摘要： An arrangement for purging the cooling jacket of a marine engine from coolant when the engine is stopped. The system comprises an electrically operated pump that is operated for a predetermined period of time once the engine is shut off so as to purge the cooling jacket.
摘要翻译：当发动机停止时，用于从冷却剂清洗船用发动机的冷却套的装置。该系统包括电动泵，其在发动机关闭之后被操作预定时间段，以便吹扫冷却套。

6. 发明申请

US20050250254A1 Method of manufacturing a semiconductor device and a fabrication apparatus for a semiconductor device 审中-公开
公开(公告)号：US20050250254A1
公开(公告)日：2005-11-10
申请号：US11178423
申请日：2005-07-12
申请人： Akio Ishizu , Kazutoshi Takashima , Shiro Oba , Yoshihiko Kobayashi , Tsutomu Ida , Shigeru Haga , Susumu Takada , Iwamichi Koujiro , Norinaga Arai , Yuji Kakegawa
发明人： Akio Ishizu , Kazutoshi Takashima , Shiro Oba , Yoshihiko Kobayashi , Tsutomu Ida , Shigeru Haga , Susumu Takada , Iwamichi Koujiro , Norinaga Arai , Yuji Kakegawa
IPC分类号： G01R31/26 , H01L21/50 , H01L21/58 , H01L21/66 , H01L21/98 , H01L23/04 , H01L23/10 , H01L23/13 , H01L23/498 , H01L23/50 , H01L23/544 , H01L25/16
CPC分类号： H01L22/20 , H01L21/50 , H01L23/04 , H01L23/10 , H01L23/13 , H01L23/49805 , H01L23/50 , H01L23/544 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L25/16 , H01L25/165 , H01L25/50 , H01L2223/54406 , H01L2223/54473 , H01L2223/54486 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83192 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10329 , H01L2924/12042 , H01L2924/1306 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15313 , H01L2924/15787 , H01L2924/16152 , H01L2924/16315 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2224/05599 , H01L2224/32245 , H01L2224/48247
摘要： A method of manufacturing a semiconductor device able to reduce the number of manufacturing steps and attain the rationalization of a manufacturing line is disclosed. The semiconductor device is a high-frequency module assembled by mounting chip parts (22) and semiconductor pellets (21) onto each of wiring substrates (2) formed on a matrix substrate (27) after inspection. A defect mark (2e) is affixed to a wiring substrate (2) as a block judged to be defective in the inspection of the matrix substrate (27), then in a series of subsequent assembling steps the defect mark (e) is recognized and the assembling work for the wiring substrate (2) with the defect mark (2e) thereon is omitted to attain the rationalization of a manufacturing line.

7. 发明授权

US5513608A Two cycle engine lubricating system 失效
标题翻译：双循环发动机润滑系统
公开(公告)号：US5513608A
公开(公告)日：1996-05-07
申请号：US112442
申请日：1993-08-26
申请人： Kazutoshi Takashima , Tomohiro Kanamaru
发明人： Kazutoshi Takashima , Tomohiro Kanamaru
IPC分类号： F01M1/02 , F01M1/10 , F01M3/00 , F02B61/04 , F02B75/02 , F02B75/22 , F01L3/00
CPC分类号： F01M1/02 , F01M3/00 , F01M1/10 , F02B2075/025 , F02B61/045 , F02B75/22 , F02F2200/06
摘要： A lubricating system for a reciprocating machine such as a two cycle internal combustion engine having the cylinder bores horizontally disposed. A drain system is provided for draining lubricant from the lowermost crankcase chambers to the upper cylinders so as to maintain uniformity of lubrication and insure even and smooth running. A check valve is provided for precluding reverse flow and the lubricant is delivered both to the crankcase chambers and to the piston through either the piston and/or cylinder liner. The lubricant supplied to the piston is supplied at its upper area so as to insure complete lubrication of its circumference and of the associated cylinder bore.
摘要翻译：用于往复运动机械的润滑系统，例如具有水平设置的气缸孔的两循环内燃机。提供一种排水系统，用于将润滑剂从最下面的曲轴箱室排出到上部气缸，以保持润滑的均匀性，并保证平稳运行。提供止回阀以防止反向流动，并且润滑剂通过活塞和/或气缸套被输送到曲轴箱室和活塞。提供给活塞的润滑剂在其上部区域供应，以确保其圆周和相关气缸孔的完全润滑。

8. 发明授权

US5067453A Piston of two-cycle engine 失效
标题翻译：双循环发动机活塞
公开(公告)号：US5067453A
公开(公告)日：1991-11-26
申请号：US578934
申请日：1990-09-07
申请人： Kazutoshi Takashima
发明人： Kazutoshi Takashima
IPC分类号： F01M1/08 , F02B25/14 , F02B75/02 , F02F1/22 , F02F3/00 , F16J1/08
CPC分类号： F02F3/00 , F02B25/14 , F02F1/22 , F01M2001/086 , F02B2075/025 , F02F2200/04 , F05C2203/0808 , F05C2253/16
摘要： Two embodiments of piston constructions for two-cycle, crankcase compression, internal combustion engines wherein the piston is formed with a blow by passage so that blow by gases escaping past the piston rings will not pass across the skirt portion of the piston to deteriorate the lubricant thereon. In one embodiment, holes formed in the piston permit the blow by gases to flow into the interior of the piston and in another embodiment, the piston pin boss is formed with a relief that permits the blow by gases to exit through one of the scavenge passages.
摘要翻译：用于双循环曲轴箱压缩的内燃机的活塞结构的两个实施例，其中活塞通过通道形成吹气，以便通过气体逸出的活塞环的吹气不会穿过活塞的裙部，从而使润滑剂变坏上。在一个实施例中，形成在活塞中的孔允许气体吹入流入活塞的内部，并且在另一个实施例中，活塞销凸起形成有浮雕，允许气体吹动通过其中一个清扫通道。

9. 发明授权

US06946306B2 Method of manufacturing a semiconductor device and a fabrication apparatus for a semiconductor device 失效
标题翻译：半导体装置的制造方法以及半导体装置的制造装置
公开(公告)号：US06946306B2
公开(公告)日：2005-09-20
申请号：US10983689
申请日：2004-11-09
申请人： Akio Ishizu , Kazutoshi Takashima , Shiro Oba , Yoshihiko Kobayashi , Tsutomu Ida , Shigeru Haga , Susumu Takada , Iwamichi Koujiro , Norinaga Arai , Yuji Kakegawa
发明人： Akio Ishizu , Kazutoshi Takashima , Shiro Oba , Yoshihiko Kobayashi , Tsutomu Ida , Shigeru Haga , Susumu Takada , Iwamichi Koujiro , Norinaga Arai , Yuji Kakegawa
IPC分类号： G01R31/26 , H01L21/50 , H01L21/58 , H01L21/66 , H01L21/98 , H01L23/04 , H01L23/10 , H01L23/13 , H01L23/498 , H01L23/50 , H01L23/544 , H01L25/16
CPC分类号： H01L22/20 , H01L21/50 , H01L23/04 , H01L23/10 , H01L23/13 , H01L23/49805 , H01L23/50 , H01L23/544 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L25/16 , H01L25/165 , H01L25/50 , H01L2223/54406 , H01L2223/54473 , H01L2223/54486 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83192 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10329 , H01L2924/12042 , H01L2924/1306 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15313 , H01L2924/15787 , H01L2924/16152 , H01L2924/16315 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2224/05599 , H01L2224/32245 , H01L2224/48247
摘要： A method of manufacturing a semiconductor device able to reduce the number of manufacturing steps and attain the rationalization of a manufacturing line is disclosed. The semiconductor device is a high-frequency module assembled by mounting chip parts (22) and semiconductor pellets (21) onto each of wiring substrates (2) formed on a matrix substrate (27) after inspection. A defect mark (2e) is affixed to a wiring substrate (2) as a block judged to be defective in the inspection of the matrix substrate (27), then in a series of subsequent assembling steps the defect mark (e) is recognized and the assembling work for the wiring substrate (2) with the defect mark (2e) thereon is omitted to attain the rationalization of a manufacturing line.
摘要翻译：公开了一种制造半导体器件的方法，该半导体器件能够减少制造步骤的数量并实现制造线的合理化。半导体器件是通过在检查后将芯片部件（22）和半导体芯片（21）安装到形成在矩阵基板（27）上的每个布线基板（2）上而组装的高频模块。作为在矩阵基板（27）的检查中被判断为有缺陷的块，在布线基板（2）上附着缺陷标记（2e），然后在一系列后续的组装步骤中识别缺陷标记（e）并且省略其上具有缺陷标记（2e）的布线基板（2）的组装工作以实现生产线的合理化。

10. 发明授权

US06852553B2 Semiconductor device fabrication method and semiconductor device fabrication apparatus 失效
标题翻译：半导体器件制造方法和半导体器件制造装置
公开(公告)号：US06852553B2
公开(公告)日：2005-02-08
申请号：US10129305
申请日：2001-02-15
申请人： Akio Ishizu , Kazutoshi Takashima , Shiro Oba , Yoshihiko Kobayashi , Tsutomu Ida , Shigeru Haga , Susumu Takada , Iwamichi Koujiro , Norinaga Arai , Yuji Kakegawa
发明人： Akio Ishizu , Kazutoshi Takashima , Shiro Oba , Yoshihiko Kobayashi , Tsutomu Ida , Shigeru Haga , Susumu Takada , Iwamichi Koujiro , Norinaga Arai , Yuji Kakegawa
IPC分类号： G01R31/26 , H01L21/50 , H01L21/58 , H01L21/66 , H01L21/98 , H01L23/04 , H01L23/10 , H01L23/13 , H01L23/498 , H01L23/50 , H01L23/544 , H01L25/16 , H01L21/00 , H01L21/44
CPC分类号： H01L22/20 , H01L21/50 , H01L23/04 , H01L23/10 , H01L23/13 , H01L23/49805 , H01L23/50 , H01L23/544 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L25/16 , H01L25/165 , H01L25/50 , H01L2223/54406 , H01L2223/54473 , H01L2223/54486 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83192 , H01L2224/92247 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10329 , H01L2924/12042 , H01L2924/1306 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15313 , H01L2924/15787 , H01L2924/16152 , H01L2924/16315 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2224/85 , H01L2224/83 , H01L2924/00 , H01L2924/00012 , H01L2224/05599 , H01L2224/32245 , H01L2224/48247
摘要： A method of manufacturing a semiconductor device able to reduce the number of manufacturing steps and attain the rationalization of a manufacturing line is disclosed. The semiconductor device is a high-frequency module assembled by mounting chip parts (22) and semiconductor pellets (21) onto each of wiring substrates (2) formed on a matrix substrate (27) after inspection. A defect mark (2e) is affixed to a wiring substrate (2) as a block judged to be defective in the inspection of the matrix substrate (27), then in a series of subsequent assembling steps the defect mark (e) is recognized and the assembling work for the wiring substrate (2) with the defect mark (2e) thereon is omitted to attain the rationalization of a manufacturing line.
摘要翻译：公开了一种制造半导体器件的方法，该半导体器件能够减少制造步骤的数量并实现制造线的合理化。半导体器件是通过在检查后将芯片部件（22）和半导体芯片（21）安装到形成在矩阵基板（27）上的每个布线基板（2）上而组装的高频模块。作为在矩阵基板（27）的检查中被判定为有缺陷的块，在布线基板（2）上附着有缺陷标记（2e），然后在一系列后续的组装步骤中识别缺陷标记（e）省略了具有缺陷标记（2e）的布线基板（2）的组装工作，以实现生产线的合理化。

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