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    • 3. 发明授权
    • Semiconductor memory device
    • 半导体存储器件
    • US08259523B2
    • 2012-09-04
    • US12836944
    • 2010-07-15
    • Toshifumi WatanabeTomoyuki HamanoShigefumi IshiguroKazuto Uehara
    • Toshifumi WatanabeTomoyuki HamanoShigefumi IshiguroKazuto Uehara
    • G11C7/00
    • G11C7/12G11C8/12G11C11/005
    • According to one embodiment, a semiconductor memory device includes a first memory, a second memory and a control circuit. The first memory includes a first bank number. The second memory includes a second bank number larger than the first bank number. The control circuit controls a precharge operation with respect to bit lines provided in the first and second memories. When performing, with respect to the first memory, a synchronous operation that is effected in synchronization with a clock, the control circuit changes over a second precharge operation to an operation time different from a first precharge operation during a period from the end of the initial first precharge operation to the start of the subsequent second precharge operation after receiving an address.
    • 根据一个实施例,半导体存储器件包括第一存储器,第二存储器和控制电路。 第一存储器包括第一个银行号码。 第二存储器包括大于第一存储体号的第二存储体号。 控制电路相对于设置在第一和第二存储器中的位线控制预充电操作。 当相对于第一存储器执行与时钟同步地进行的同步操作时,控制电路在初始化结束时间段内将第二预充电操作改变为与第一预充电操作不同的操作时间 在接收地址之后的第二预充电操作开始的第一预充电操作。
    • 4. 发明授权
    • Semiconductor memory device
    • 半导体存储器件
    • US08223569B2
    • 2012-07-17
    • US12836851
    • 2010-07-15
    • Tomoyuki HamanoShigefumi IshiguroToshifumi WatanabeKazuto Uehara
    • Tomoyuki HamanoShigefumi IshiguroToshifumi WatanabeKazuto Uehara
    • G11C7/00
    • G11C8/04G11C11/41G11C2029/0411
    • According to one embodiment, a semiconductor memory device includes a memory array, an address counter, an address detecting circuit and a control circuit. The memory array has a plurality of memory cells arranged at crossing positions of word lines and bit lines. The address counter increments an address including a row address and a column address in synchronism with a clock to sequentially output the incremented addresses. The address detecting circuit detects an address previous to an address including a row address to which the row address is switched at the address output from the address counter to output a detection signal. The control circuit performs a precharging operation to the bit lines connected to the memory cells according to the detection signal output from the address detecting circuit.
    • 根据一个实施例,半导体存储器件包括存储器阵列,地址计数器,地址检测电路和控制电路。 存储器阵列具有布置在字线和位线的交叉位置处的多个存储单元。 地址计数器与时钟同步地增加包括行地址和列地址的地址,以顺序输出递增的地址。 地址检测电路在从地址计数器输出的地址处检测包括行地址切换到的行地址的地址,以输出检测信号。 控制电路根据从地址检测电路输出的检测信号对与存储单元连接的位线执行预充电操作。
    • 5. 发明申请
    • SEMICONDUCTOR MEMORY DEVICE
    • 半导体存储器件
    • US20110013472A1
    • 2011-01-20
    • US12836851
    • 2010-07-15
    • Tomoyuki HAMANOShigefumi IshiguroToshifumi WatanabeKazuto Uehara
    • Tomoyuki HAMANOShigefumi IshiguroToshifumi WatanabeKazuto Uehara
    • G11C8/00G11C8/04
    • G11C8/04G11C11/41G11C2029/0411
    • According to one embodiment, a semiconductor memory device includes a memory array, an address counter, an address detecting circuit and a control circuit. The memory array has a plurality of memory cells arranged at crossing positions of word lines and bit lines. The address counter increments an address including a row address and a column address in synchronism with a clock to sequentially output the incremented addresses. The address detecting circuit detects an address previous to an address including a row address to which the row address is switched at the address output from the address counter to output a detection signal. The control circuit performs a precharging operation to the bit lines connected to the memory cells according to the detection signal output from the address detecting circuit.
    • 根据一个实施例,半导体存储器件包括存储器阵列,地址计数器,地址检测电路和控制电路。 存储器阵列具有布置在字线和位线的交叉位置处的多个存储单元。 地址计数器与时钟同步地增加包括行地址和列地址的地址,以顺序输出递增的地址。 地址检测电路在从地址计数器输出的地址处检测包括行地址切换到的行地址的地址,以输出检测信号。 控制电路根据从地址检测电路输出的检测信号对与存储单元连接的位线执行预充电操作。
    • 7. 发明授权
    • Structure of electrically programmable read-only memory cells and
redundancy signature therefor
    • 电可编程只读存储单元的结构和冗余签名
    • US5208780A
    • 1993-05-04
    • US731467
    • 1991-07-17
    • Taira IwaseMakoto TakizawaShigefumi IshiguroKazuhiko Nobori
    • Taira IwaseMakoto TakizawaShigefumi IshiguroKazuhiko Nobori
    • G11C17/16G11C29/00
    • G11C29/835G11C17/16
    • In an electrically programmable ROM, each cell 13 includes a series-connected element composed of a combination writing and reading transistor 17 and a fuse 15. One end of this series-connected element is connected to a corresponding bit line 19, and the other end thereof is grounded. A gate of the transistor 17 of the series-connected element is connected to a corresponding word line 23. Each bit line 19 is connected to a high-voltage applying pad 21 via an element such as diode or transistor provided with electrically connecting/isolating functions. When a data is written in the memory cell 13, the high-voltage applying pad 21 is electrically connected to the bit line 19. Under these conditions, if a high voltage is applied to the high-voltage applying pad 21, the transistor 17 performs snap-back action (i.e. secondary breakdown) to blow out the fuse 15. When the data is read, the high-voltage applying pad 21 is isolated from the bit line 19 without exerting influence upon the read out operation. In addition, in the above-mentioned electrically programmable ROM, a circuit for electrically blowing out the fuse by utilizing transistor's snap-back action is used as a redundancy signature indicative of whether the redundancy circuit is used or unused.
    • 在电可编程ROM中,每个单元13包括由写入和读取晶体管17和熔丝15组成的串联元件。该串联元件的一端连接到对应的位线19,而另一端 它接地。 串联元件的晶体管17的栅极连接到相应的字线23.每个位线19经由诸如具有电连接/隔离功能的二极管或晶体管的元件连接到高压施加焊盘21 。 当数据被写入存储单元13时,高压施加焊盘21与位线19电连接。在这些条件下,如果向高压施加焊盘21施加高电压,则晶体管17执行 回扫动作(即二次击穿)以吹出保险丝15.当读取数据时,高压施加垫21与位线19隔离,而不会对读出操作产生影响。 此外,在上述电气可编程ROM中,使用用于通过利用晶体管的快速恢复动作来电熔熔丝的电路作为指示冗余电路是否被使用或未被使用的冗余标记。