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1. 发明授权

US08736160B2 Light-emitting apparatus and method for manufacturing same 有权
标题翻译：发光装置及其制造方法
公开(公告)号：US08736160B2
公开(公告)日：2014-05-27
申请号：US12706178
申请日：2010-02-16
申请人： Kazuo Tamaki , Tohru Ohnishi , Toshio Hata
发明人： Kazuo Tamaki , Tohru Ohnishi , Toshio Hata
IPC分类号： H01J1/62 , H01J63/04 , H01L33/00 , H01L21/00
CPC分类号： F21K9/56 , F21K9/64 , F21K9/90 , H01L24/97 , H01L25/0753 , H01L33/504 , H01L2224/48091 , H01L2224/48137 , H01L2924/12035 , H01L2924/12041 , H01L2924/15787 , H01L2924/181 , H01L2933/0041 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A light-emitting apparatus including: a substrate; an LED chip mounted on a first surface of the substrate; a fluorescent material-containing layer containing a first fluorescent material, which fluorescent material-containing layer is provided above the first surface of the substrate so as to cover the LED chip; and a color-adjusting fluorescent layer that contains a second fluorescent material, which color-adjusting fluorescent material layer is formed in a layer provided on an outer side of the fluorescent material-containing layer in an emission direction, the color-adjusting fluorescent layer being formed in dots. Thus, the present invention provides a light-emitting apparatus and a method for manufacturing the same, each making it possible to carry out fine color adjustment so as to prevent a subtle color shift that occurs due to a factor such as a difference in concentration of a fluorescent material or the like.
摘要翻译： 1.一种发光装置，包括：基板; 安装在所述基板的第一表面上的LED芯片; 含有第一荧光材料的荧光材料含有层，该荧光材料含有层设置在基板的第一表面上方以覆盖LED芯片; 以及调色荧光层，其含有第二荧光体，所述调色荧光体层形成在所述含荧光体含有层的外侧的发光方向的层中，所述调色荧光层为以点形成。因此，本发明提供了一种发光装置及其制造方法，每一种都可以进行精细的颜色调节，以防止由于诸如浓度差的因素而发生的微妙的色偏荧光材料等。

2. 发明申请

US20140159076A1 LIGHT-EMITTING DEVICE 有权
标题翻译：发光装置
公开(公告)号：US20140159076A1
公开(公告)日：2014-06-12
申请号：US14236930
申请日：2012-05-31
申请人： Yoshiki Sota , Masayuki Ohta , Kazuo Tamaki , Shinji Yamaguchi , Shin Itoh , Tomoshi Kimura , Masaki Tatsumi
发明人： Yoshiki Sota , Masayuki Ohta , Kazuo Tamaki , Shinji Yamaguchi , Shin Itoh , Tomoshi Kimura , Masaki Tatsumi
IPC分类号： H01L33/50 , H01L33/60 , H01L33/62 , H01L27/15
CPC分类号： H01L33/507 , H01L23/49861 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L27/156 , H01L33/60 , H01L33/62 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/73265 , H01L2224/83012 , H01L2224/83439 , H01L2224/85012 , H01L2224/85439 , H01L2224/92247 , H01L2924/00014 , H01L2924/12041 , H01L2924/181 , H01L2224/45099 , H01L2924/00012 , H01L2924/3512 , H01L2924/00
摘要： Improves light extraction efficiency. A light emitting device 1 using a white resin molding package 5 integrally molded with lead frames 3, 4 constituting an electrode corresponding to one or a plurality of light emitting element 2 and white resin, wherein an area in a plane view of a white resin surface on a reflective surface that is level with amounting surface of the light emitting element 2 is configured to be larger than total area in a plane view occupied by surfaces of the lead frames 3, 4 and the light emitting element. Further, a step section is formed on the surfaces of lead frames 3, 4, white resin is filled in the step section, and the area of white resin surface on a reflective surface where the light emitting element 2 is mounted is increased.
摘要翻译：提高光提取效率。一种使用与构成对应于一个或多个发光元件2的电极的引线框架3,4一体模制的白色树脂成型封装5和白色树脂的发光器件1，其中白色树脂表面的平面图中的面积在与发光元件2的表面平齐的反射面上，在由引线框3,4和发光元件的表面占据的平面图中，大于总面积。此外，在引线框架3,4的表面上形成台阶部，在台阶部填充有白色树脂，并且增加了安装有发光元件2的反射面上的白色树脂表面的面积。

3. 发明授权

US07327041B2 Semiconductor package and a method for producing the same 失效
标题翻译：半导体封装及其制造方法
公开(公告)号：US07327041B2
公开(公告)日：2008-02-05
申请号：US10154834
申请日：2002-05-28
申请人： Yoshihisa Dotta , Kazuo Tamaki
发明人： Yoshihisa Dotta , Kazuo Tamaki
IPC分类号： H01L23/48
CPC分类号： H01L21/6835 , H01L21/563 , H01L21/6836 , H01L23/552 , H01L24/27 , H01L24/29 , H01L24/48 , H01L24/83 , H01L2221/68327 , H01L2221/68359 , H01L2221/68368 , H01L2224/16225 , H01L2224/274 , H01L2224/29499 , H01L2224/32225 , H01L2224/32245 , H01L2224/48227 , H01L2224/48247 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2224/81191 , H01L2224/83191 , H01L2224/838 , H01L2924/00014 , H01L2924/00015 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0781 , H01L2924/15183 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H01L2924/3511 , H01L2924/00012 , H01L2924/00 , H01L2924/3512 , H01L2224/85399 , H01L2224/05599 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor package includes: a semiconductor chip having circuits formed on a surface, and having a thickness of 0.5 μm or more and 100 μm or less; and an adhesive resin layer provided so as to cover the surface of the semiconductor chip on which the circuits are provided.
摘要翻译：半导体封装包括：半导体芯片，其具有形成在表面上的电路，并且具有0.5μm以上且100μm以下的厚度; 以及设置成覆盖设置有电路的半导体芯片的表面的粘合树脂层。

4. 发明授权

US09537065B2 Light-emitting device with reflective resin 有权
标题翻译：具有反光树脂的发光装置
公开(公告)号：US09537065B2
公开(公告)日：2017-01-03
申请号：US14236930
申请日：2012-05-31
申请人： Yoshiki Sota , Masayuki Ohta , Kazuo Tamaki , Shinji Yamaguchi , Shin Itoh , Tomoshi Kimura , Masaki Tatsumi
发明人： Yoshiki Sota , Masayuki Ohta , Kazuo Tamaki , Shinji Yamaguchi , Shin Itoh , Tomoshi Kimura , Masaki Tatsumi
IPC分类号： H01L33/54 , H01L33/60 , H01L33/62 , H01L33/50 , H01L27/15 , H01L23/498 , H01L23/00
CPC分类号： H01L33/507 , H01L23/49861 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L27/156 , H01L33/60 , H01L33/62 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/73265 , H01L2224/83012 , H01L2224/83439 , H01L2224/85012 , H01L2224/85439 , H01L2224/92247 , H01L2924/00014 , H01L2924/12041 , H01L2924/181 , H01L2224/45099 , H01L2924/00012 , H01L2924/3512 , H01L2924/00
摘要： Improves light extraction efficiency. A light emitting device 1 using a white resin molding package 5 integrally molded with lead frames 3, 4 constituting an electrode corresponding to one or a plurality of light emitting element 2 and white resin, wherein an area in a plane view of a white resin surface on a reflective surface that is level with amounting surface of the light emitting element 2 is configured to be larger than total area in a plane view occupied by surfaces of the lead frames 3, 4 and the light emitting element. Further, a step section is formed on the surfaces of lead frames 3, 4, white resin is filled in the step section, and the area of white resin surface on a reflective surface where the light emitting element 2 is mounted is increased.
摘要翻译：提高光提取效率。一种使用与构成对应于一个或多个发光元件2的电极的引线框架3,4一体模制的白色树脂成型封装5和白色树脂的发光器件1，其中白色树脂表面的平面图中的面积在与发光元件2的表面平齐的反射面上，在由引线框3,4和发光元件的表面占据的平面图中，大于总面积。此外，在引线框架3,4的表面上形成台阶部，在台阶部填充有白色树脂，并且增加了安装有发光元件2的反射面上的白色树脂表面的面积。

5. 发明申请

US20150019168A1 LED CLASSIFICATION METHOD, LED CLASSIFICATION DEVICE, AND RECORDING MEDIUM 审中-公开
标题翻译： LED分类方法，LED分类装置和记录介质
公开(公告)号：US20150019168A1
公开(公告)日：2015-01-15
申请号：US14375609
申请日：2012-06-26
申请人： Masayuki Ohta , Masataka Miyata , Kazuo Tamaki , Takashi Nakanishi , Kenichi Kurita , Kiyoshi Nagata , Masaki Tatsumi
发明人： Masayuki Ohta , Masataka Miyata , Kazuo Tamaki , Takashi Nakanishi , Kenichi Kurita , Kiyoshi Nagata , Masaki Tatsumi
IPC分类号： G01J3/50 , G01N21/25
CPC分类号： G02B6/0073 , G01J3/505 , G01J3/506 , G01N21/251 , G02F1/133603 , G02F1/133609 , G02F2001/133614 , G09G3/006 , G09G3/3413 , G09G3/3426 , G09G2320/0233 , G09G2320/0242 , G09G2320/0285 , G09G2360/16 , H01L33/0095 , H01L33/50 , H01L2224/48091 , H01L2924/00014
摘要： An LED classification device classifies LEDs, the LEDs each including a combination of an LED element that emits a primary light and a phosphor that, upon excitation by the primary light, emits a secondary light having a longer wavelength than the primary light, the LEDs each emitting a combined light of the primary light and the secondary light, those ones of the LEDs whose primary lights having their chromaticities falling within a predetermined chromaticity range being classified as LEDs for use in a backlight of a liquid crystal display apparatus. The LED classification device calculates, for all of the LEDs to be classified, correction values for the chromaticities as obtained on the assumption that the primary lights have traveled through a color filter of the liquid crystal display apparatus, and correct chromaticities by subtracting the correction values from chromaticities obtained for all of the LEDs to be classified, respectively.
摘要翻译： LED分类装置对LED进行分类，每个LED分别包括发射初级光的LED元件和荧光体的组合，在通过初级光激发时，其发射具有比初级光更长的波长的次级光，每个LED 发射一次光和二次光的组合的光，将其色度落在预定色度范围内的原色光的LED中的那些被分类为用于液晶显示装置的背光的LED。 LED分类装置对于要分类的所有LED来计算在假设主光已经通过液晶显示装置的滤色器的情况下获得的色度的校正值，并且通过减去校正值来校正色度从分别获得的所有LED的色度。

6. 发明申请

US20080237838A1 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US20080237838A1
公开(公告)日：2008-10-02
申请号：US12076389
申请日：2008-03-18
申请人： Kazuo Tamaki
发明人： Kazuo Tamaki
IPC分类号： H01L23/14
CPC分类号： H01L25/0652 , H01L24/73 , H01L25/0655 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/49171 , H01L2224/73204 , H01L2224/73265 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2924/00011 , H01L2924/00014 , H01L2924/15311 , H01L2924/3025 , H01L2924/3511 , H01L2924/00 , H01L2924/00012 , H01L2224/0401
摘要： The semiconductor device includes a plurality of semiconductor chips, and a circuit substrate having a substantially rectangular outer shape. The semiconductor device is an MCM having an MCM packaging structure in which the plurality of semiconductor chips are juxtaposed on the semiconductor chip mounting surface of the circuit substrate, and the semiconductor chip mounting surface is covered by a sealing resin along an outer edge of the circuit substrate so that the plurality of semiconductor chips are sealed. The thickness of the semiconductor chip to be mounted so as to traverse a center line has a thicker thickness in a direction perpendicular to the semiconductor chip mounting surface than the thickness of any of the other semiconductor chips which is mounted on the semiconductor chip mounting surface, the center line being defined an intersection of (i) a longitudinal cross section which divides the semiconductor chip mounting surface into two in a longitudinal direction of the semiconductor chip mounting surface and (ii) a transverse cross section which divides the semiconductor chip mounting surface into two in a transverse direction of the semiconductor chip mounting surface. This enables to suppress the warpage generated in the semiconductor device, and to reduce inadequate connection occurred due to the warpage in the semiconductor device.
摘要翻译：半导体器件包括多个半导体芯片，以及具有大致矩形外形的电路基板。半导体器件是具有MCM封装结构的MCM，其中多个半导体芯片并置在电路基板的半导体芯片安装表面上，并且半导体芯片安装表面沿着电路的外边缘被密封树脂覆盖使得多个半导体芯片被密封。要安装以穿过中心线的半导体芯片的厚度在垂直于半导体芯片安装表面的方向上的厚度比安装在半导体芯片安装表面上的任何其它半导体芯片的厚度厚，中心线被定义为（i）将半导体芯片安装表面沿着半导体芯片安装表面的纵向方向分成两个的纵向横截面和（ii）将半导体芯片安装表面分成横截面的交叉两个在半导体芯片安装表面的横向上。这能够抑制在半导体器件中产生的翘曲并且减少由于半导体器件中的翘曲而发生的不充分的连接。

7. 发明授权

US06518090B2 Semiconductor device and manufacturing method thereof 有权
公开(公告)号：US06518090B2
公开(公告)日：2003-02-11
申请号：US10000482
申请日：2001-12-04
申请人： Yoshihisa Dotta , Kazuo Tamaki , Yasuyuki Saza
发明人： Yoshihisa Dotta , Kazuo Tamaki , Yasuyuki Saza
IPC分类号： H01L2144
CPC分类号： H01L23/564 , H01L23/16 , H01L23/3121 , H01L24/45 , H01L24/48 , H01L2224/05001 , H01L2224/05023 , H01L2224/05548 , H01L2224/16225 , H01L2224/32225 , H01L2224/451 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73204 , H01L2224/73265 , H01L2224/83192 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/07802 , H01L2924/07811 , H01L2924/12042 , H01L2924/15183 , H01L2924/15311 , H01L2924/181 , H01L2924/00012 , H01L2924/00 , H01L2924/00015 , H01L2224/05599 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05144
摘要： A semiconductor device includes a circuit board on which a semiconductor chip is mounted via an adhesive resin layer and through which a moisture drain hole is formed. A pit part having a width wider than a diameter of the moisture drain hole is formed in a part of the adhesive resin layer exposed in the moisture drain hole. On this account, the semiconductor device can properly drain moisture to the outside when the semiconductor device is mounted on another packaging substrate by reflowing.

8. 发明授权

US06353263B1 Semiconductor device and manufacturing method thereof 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US06353263B1
公开(公告)日：2002-03-05
申请号：US09517510
申请日：2000-03-02
申请人： Yoshihisa Dotta , Yasuyuki Saza , Kazuo Tamaki
发明人： Yoshihisa Dotta , Yasuyuki Saza , Kazuo Tamaki
IPC分类号： H01L2348
CPC分类号： H01L25/50 , H01L21/561 , H01L21/563 , H01L23/3121 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/75 , H01L24/97 , H01L25/0657 , H01L2224/05599 , H01L2224/16225 , H01L2224/29111 , H01L2224/2929 , H01L2224/29344 , H01L2224/29355 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73203 , H01L2224/73204 , H01L2224/73265 , H01L2224/81191 , H01L2224/83191 , H01L2224/83192 , H01L2224/85399 , H01L2224/92125 , H01L2224/97 , H01L2225/0651 , H01L2225/06517 , H01L2225/06555 , H01L2225/06582 , H01L2225/06586 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/07802 , H01L2924/07811 , H01L2924/15311 , H01L2924/181 , H01L2924/18161 , H01L2924/19043 , H01L2224/83 , H01L2224/81 , H01L2224/85 , H01L2924/00012 , H01L2924/00 , H01L2924/0665 , H01L2224/92247 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： When a first semiconductor chip is installed on a circuit substrate by using an anisotropic conductive bonding agent, one portion thereof is allowed to protrude outside the first semiconductor chip. A second semiconductor chip is installed on the first semiconductor chip and a support portion formed by the protruding resin. The protruding portion of the second semiconductor chip is supported by the support portion from under. Thus, in a semiconductor device having a plurality of laminated semiconductor chips in an attempt to achieve a high density, even when, from a semiconductor chip stacked on a circuit substrate, one portion of a semiconductor chip stacked thereon protrudes, it is possible to carry out a better wire bonding process on electrodes formed on the protruding portion.
摘要翻译：当通过使用各向异性导电粘合剂将第一半导体芯片安装在电路基板上时，允许其一部分突出到第一半导体芯片的外部。第二半导体芯片安装在第一半导体芯片上以及由突出树脂形成的支撑部分。第二半导体芯片的突出部分由支撑部分从下方支撑。因此，为了实现高密度化，在具有多层叠半导体芯片的半导体装置中，即使从堆叠在电路基板上的半导体芯片的一部分堆叠的半导体芯片突出，也可以携带在形成在突出部分上的电极上形成更好的引线接合工艺。

9. 发明申请

US20140175501A1 LIGHT EMITTING DEVICE 有权
标题翻译：发光装置
公开(公告)号：US20140175501A1
公开(公告)日：2014-06-26
申请号：US14117807
申请日：2012-05-31
申请人： Yoshiki Sota , Kazuo Tamaki
发明人： Yoshiki Sota , Kazuo Tamaki
IPC分类号： H01L33/54 , H01L33/62
CPC分类号： H01L33/62 , H01L24/97 , H01L33/36 , H01L33/38 , H01L33/486 , H01L33/54 , H01L33/56 , H01L33/60 , H01L2224/32245 , H01L2224/48247 , H01L2224/73265 , H01L2224/97 , H01L2924/181 , H01L2933/0066 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： Pkg resin crack is suppressed after dicing.A light emitting device 1 where a light emitting device 2 that emits light is mounted on a lead frame 3 and that uses a resin cavity molding package 5 having an integrally molded lead frames 3, 4 constituting electrodes that correspond to the light emitting element 2 and resin, wherein roundness is given to a part or all of a cutting plane corner part of a retention section (hanger lead 3a, 4a) that become a cause of crack generation due to the retention sections (hanger leads 3a, 4a) of the lead frames giving stress concentration to resin at the time of cutting by a blade 7.
摘要翻译：切割后抑制Pkg树脂裂纹。发光装置1，其中发光的发光装置2安装在引线框架3上，并且使用具有构成与发光元件2相对应的电极的一体模制的引线框架3,4的树脂腔模制包装5和树脂，其中，由于引线的保持部（吊架引线3a，4a）而导致成为裂纹产生的原因的保持部（悬挂引线3a，4a）的切割面角部的一部分或全部呈圆形在叶片7切割时给树脂施加应力集中的框架。

10. 发明申请

US20060027841A1 Stack type semiconductor apparatus package and manufacturing method thereof 有权
标题翻译：堆叠型半导体器件封装及其制造方法
公开(公告)号：US20060027841A1
公开(公告)日：2006-02-09
申请号：US11193465
申请日：2005-08-01
申请人： Kazuo Tamaki
发明人： Kazuo Tamaki
IPC分类号： H01L29/80
CPC分类号： H01L25/03 , H01L24/73 , H01L25/0652 , H01L25/0657 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48465 , H01L2224/48475 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/85051 , H01L2225/0651 , H01L2225/06517 , H01L2225/06558 , H01L2225/06586 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/07811 , H01L2924/14 , H01L2924/1433 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/00 , H01L2924/00012 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A stack type semiconductor apparatus package includes: (i) a first circuit substrate, (ii) a semiconductor apparatus package mounted on the first circuit substrate, (iii) a semiconductor apparatus, and (iv) a sealing resin for covering them. The first circuit substrate has a surface on which first connecting pads and second connecting pads are provided. The first connecting pads are connected to first external input/output terminals of the semiconductor apparatus package, and the second connecting pads are connected to electrodes of the first semiconductor apparatus, respectively. On a rear surface of the first circuit substrate, there are provided second external input/output terminals connected to the first connecting pads and the second connecting pads. The semiconductor apparatus package includes: a second circuit substrate, and a second semiconductor apparatus mounted on the second circuit substrate. On a surface of the second circuit substrate, there are provided third connecting pads connected to electrodes of the second semiconductor apparatus, respectively. The first external input/output terminals are provided on a rear surface of the second circuit substrate. This makes it possible to provide a stack type semiconductor apparatus package that can be easily manufactured with inexpensive cost.
摘要翻译：叠层型半导体装置封装包括：（i）第一电路基板，（ii）安装在第一电路基板上的半导体装置封装，（iii）半导体装置，以及（iv）用于覆盖它们的密封树脂。第一电路基板具有其上设置有第一连接焊盘和第二连接焊盘的表面。第一连接焊盘连接到半导体装置封装的第一外部输入/输出端子，第二连接焊盘分别连接到第一半导体装置的电极。在第一电路基板的后表面上设置有连接到第一连接焊盘和第二连接焊盘的第二外部输入/输出端子。半导体装置封装包括：第二电路基板和安装在第二电路基板上的第二半导体装置。在第二电路基板的表面上，分别设置有连接到第二半导体装置的电极的第三连接焊盘。第一外部输入/输出端子设置在第二电路基板的后表面上。这使得可以提供可以以便宜的成本容易地制造的堆叠型半导体器件封装。

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