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1. 发明申请

US20090267093A1 LIGHT EMITTING DEVICE 有权
标题翻译：发光装置
公开(公告)号：US20090267093A1
公开(公告)日：2009-10-29
申请号：US12067194
申请日：2005-12-28
申请人： Kazuo Kamada , Yasushi Nishioka , Youji Urano
发明人： Kazuo Kamada , Yasushi Nishioka , Youji Urano
IPC分类号： H01L33/00
CPC分类号： H01L33/483 , H01L33/505 , H01L33/507 , H01L33/58 , H01L33/60 , H01L33/642 , H01L2224/45144 , H01L2224/48091 , H01L2224/73265 , H01L2924/19107 , H01L2924/00014 , H01L2924/00
摘要： A light emitting device includes a light emitting diode chip, a heat conductive plate mounting thereon the light emitting diode chip, a sub-mount member disposed between said light emitting diode chip and said heat conductive plate, a dielectric substrate stacked on the heat conductive plate and being formed with a through-hole through which the sub-mount member is exposed, an encapsulation member for encapsulation of said light emitting diode chip, and a lens superimposed on the encapsulation member. The sub-mount member is formed around a coupling portion of the light emitting diode chip with a reflective film which reflects a light emitted from a side face of the light emitting diode chip. The sub-mount member is selected to have a thickness such that the reflecting film has its surface spaced away from said heat conductive plate by a greater distance than said dielectric substrate.
摘要翻译：发光装置包括：发光二极管芯片，安装在发光二极管芯片上的导热板，设置在所述发光二极管芯片和所述导热板之间的副安装构件，堆叠在所述导热板上的电介质基板并且形成有用于露出子安装构件的通孔，用于封装所述发光二极管芯片的封装构件和叠置在封装构件上的透镜。副安装构件围绕发光二极管芯片的耦合部分形成有反射膜，该反射膜反射从发光二极管芯片的侧面发射的光。子安装构件被选择为具有使得反射膜的表面与所述导热板间隔远离所述电介质基板的厚度的厚度。

2. 发明授权

US07956372B2 Light emitting device 有权
标题翻译：发光装置
公开(公告)号：US07956372B2
公开(公告)日：2011-06-07
申请号：US12067194
申请日：2005-12-28
申请人： Kazuo Kamada , Yasushi Nishioka , Youji Urano
发明人： Kazuo Kamada , Yasushi Nishioka , Youji Urano
IPC分类号： H01L33/48
CPC分类号： H01L33/483 , H01L33/505 , H01L33/507 , H01L33/58 , H01L33/60 , H01L33/642 , H01L2224/45144 , H01L2224/48091 , H01L2224/73265 , H01L2924/19107 , H01L2924/00014 , H01L2924/00
摘要： A light emitting device includes a light emitting diode chip, a heat conductive plate mounting thereon the light emitting diode chip, a sub-mount member disposed between said light emitting diode chip and said heat conductive plate, a dielectric substrate stacked on the heat conductive plate and being formed with a through-hole through which the sub-mount member is exposed, an encapsulation member for encapsulation of said light emitting diode chip, and a lens superimposed on the encapsulation member. The sub-mount member is formed around a coupling portion of the light emitting diode chip with a reflective film which reflects a light emitted from a side face of the light emitting diode chip. The sub-mount member is selected to have a thickness such that the reflecting film has its surface spaced away from said heat conductive plate by a greater distance than said dielectric substrate.
摘要翻译：发光装置包括：发光二极管芯片，安装在发光二极管芯片上的导热板，设置在所述发光二极管芯片和所述导热板之间的副安装构件，堆叠在所述导热板上的电介质基板并且形成有用于露出子安装构件的通孔，用于封装所述发光二极管芯片的封装构件和叠置在封装构件上的透镜。副安装构件围绕发光二极管芯片的耦合部分形成有反射膜，该反射膜反射从发光二极管芯片的侧面发射的光。子安装构件被选择为具有使得反射膜的表面与所述导热板间隔远离所述电介质基板的厚度的厚度。

3. 发明授权

US07948001B2 LED lighting fixture 有权
标题翻译： LED照明灯具
公开(公告)号：US07948001B2
公开(公告)日：2011-05-24
申请号：US12066433
申请日：2006-09-20
申请人： Kazuo Kamada , Yasushi Nishioka , Youji Urano
发明人： Kazuo Kamada , Yasushi Nishioka , Youji Urano
IPC分类号： H01L23/28 , H01L23/373
CPC分类号： F21K9/00 , F21V21/30 , F21Y2115/10 , H01L33/486 , H01L33/505 , H01L33/507 , H01L33/58 , H01L33/641 , H01L2224/73265 , H01L2924/19107
摘要： A light-emitting device held on a fixture body includes an LED chip, a heat transfer plate made of a thermally conductive material on which the LED chip is mounted, a wiring board having, on one side, patterned conductors, for supplying an electric power to the LED chip and formed with an aperture (exposure part) through which a LED chip mount surface of the heat transfer plate is exposed, an encapsulation part in which the LED chip is encapsulated on the one side of the wiring board, and a dome-shaped color-changing member made of a fluorescent material and an optically transparent material and placed on the one side of the wiring board. The light-emitting device is bonded to the fixture body with an insulating layer interposed therebetween, and the insulating layer has electrical insulating properties and is interposed between the heat transfer plate and the fixture body to thermally couple the same.
摘要翻译：保持在固定体上的发光装置包括LED芯片，由其上安装有LED芯片的导热材料制成的传热板，布线板，一侧具有图案导体，用于提供电力在LED芯片上形成有露出传热板的LED芯片安装面的开口部（曝光部），将LED芯片封装在布线基板一侧的封装部和圆顶部由荧光材料和光学透明材料制成并设置在布线板的一侧上的彩色变色构件。发光装置以夹着绝缘层的方式与固定体接合，绝缘层具有电绝缘性，插入在传热板与固定体之间，使其热耦合。

4. 发明申请

US20100148196A1 LED LIGHTING FIXTURE 有权
标题翻译： LED照明灯具
公开(公告)号：US20100148196A1
公开(公告)日：2010-06-17
申请号：US12066433
申请日：2006-09-20
申请人： Kazuo Kamada , Yasushi Nishioka , Youji Urano
发明人： Kazuo Kamada , Yasushi Nishioka , Youji Urano
IPC分类号： H01L33/00
CPC分类号： F21K9/00 , F21V21/30 , F21Y2115/10 , H01L33/486 , H01L33/505 , H01L33/507 , H01L33/58 , H01L33/641 , H01L2224/73265 , H01L2924/19107
摘要： A light-emitting device held on a fixture body includes an LED chip, a heat transfer plate made of a thermally conductive material on which the LED chip is mounted, a wiring board having, on one side, patterned conductors, for supplying an electric power to the LED chip and formed with an aperture (exposure part) through which a LED chip mount surface of the heat transfer plate is exposed, an encapsulation part in which the LED chip is encapsulated on the one side of the wiring board, and a dome-shaped color-changing member made of a fluorescent material and an optically transparent material and placed on the one side of the wiring board. The light-emitting device is bonded to the fixture body with an insulating layer interposed therebetween, and the insulating layer has electrical insulating properties and is interposed between the heat transfer plate and the fixture body to thermally couple the same.
摘要翻译：保持在固定体上的发光装置包括LED芯片，由其上安装有LED芯片的导热材料制成的传热板，布线板，一侧具有图案导体，用于提供电力在LED芯片上形成有露出传热板的LED芯片安装面的开口部（曝光部），将LED芯片封装在布线基板一侧的封装部和圆顶部由荧光材料和光学透明材料制成并设置在布线板的一侧上的彩色变色构件。发光装置以夹着绝缘层的方式与固定体接合，绝缘层具有电绝缘性，插入在传热板与固定体之间，使其热耦合。

5. 发明授权

US5494781A Method for manufacturing printed circuit board 失效
标题翻译：印刷电路板制造方法
公开(公告)号：US5494781A
公开(公告)日：1996-02-27
申请号：US286324
申请日：1994-08-04
申请人： Ryuji Ohtani , Takeshi Okamoto , Yoshimitsu Nakamura , Yosiyuki Uchinono , Kazuo Kamada , Kunzi Nakashima , Toshiyuki Suzuki
发明人： Ryuji Ohtani , Takeshi Okamoto , Yoshimitsu Nakamura , Yosiyuki Uchinono , Kazuo Kamada , Kunzi Nakashima , Toshiyuki Suzuki
IPC分类号： B23K26/00 , B23K26/06 , B23K26/067 , B23K26/073 , C25D5/02 , C25D7/00 , H05K3/00 , H05K3/02 , H05K3/06 , H05K3/08 , H05K3/10 , H05K3/18 , G03F7/26
CPC分类号： B23K26/0673 , B23K26/0643 , B23K26/066 , B23K26/067 , B23K26/073 , H05K3/027 , H05K3/064 , H05K3/108 , H05K2201/09363 , H05K2203/107 , H05K3/0017 , H05K3/0082 , H05K3/181 , Y10S430/146
摘要： A method for manufacturing a printed circuit board is to form on a top surface of an insulating substrate a layer of such plating ground as a metal film, to irradiate such electromagetic wave as a laser to a boundary edge zone of non-circuit parts with respect to circuit-printing parts on the insulating substrate in correspondence to a pattern of the non-circuit parts to remove the plating ground layer at the part irradiate by the electromagnetic wave with the plating ground layer at the non-irradiated part left as formed, and thereafter to form a plating on the surface of the plating ground layer at the non-irradiated parts, whereby it is enabled to allow the laser irradiation to be carried out only with respect to the boundary edge zone of the non-circuit parts, without irradiating all over the non-circuit parts.
摘要翻译：制造印刷电路板的方法是在绝缘基板的顶表面上形成作为金属膜的这种电镀地层的层，以将这样的激光电磁波照射到非电路部分的边界边缘区域对应于非电路部分的图案在绝缘基板上对电路印刷部分进行电路印刷，以在被形成的未照射部分处的电镀接地层用电磁波照射的部分去除电镀接地层，以及之后在未照射部分的电镀接地层的表面上形成电镀，由此能够仅在非电路部分的边界边缘区域进行激光照射，而不照射遍布非电路部分。

6. 发明授权

US06252154B1 Thermoelectric module 失效
标题翻译：热电模块
公开(公告)号：US06252154B1
公开(公告)日：2001-06-26
申请号：US09407969
申请日：1999-09-29
申请人： Kazuo Kamada , Shunichi Nakayama
发明人： Kazuo Kamada , Shunichi Nakayama
IPC分类号： H01L3534
CPC分类号： H01L35/32
摘要： A thermoelectric module 1 comprising p-type thermoelectric elements 3a and n-type thermoelectric elements 3b which are alternately arranged and electrically connected by electrodes 4 provided on the top side and the bottom side of each thermoelectric element 3 and a heat exchanger plate 5 which is fixed on the electrodes on each side, in which each thermoelectric element 3 has a coating film 2 of an insulating material on the sides thereof except the sides joined to the electrodes 4, and the thermoelectric elements 3 are spaced apart. The coating film 2 improves the strength and moisture resistance of the thermoelectric elements 3 to prevent thermoelectric elements from cracking or breaking even in cases where a load, a shock, or a thermal stress is imposed thereon and to protect the thermoelectric elements against corrosion in a high humidity atmosphere, providing a thermoelectric module 1 with improved operational reliability.
摘要翻译：包含p型热电元件3a和n型热电元件3b的热电模块1和设置在每个热电元件3的顶侧和底侧上的电极4交替布置和电连接，热交换器板5是固定在每侧的电极上，其中每个热电元件3除了连接到电极4的侧面之外具有绝缘材料的涂层膜2，并且热电元件3间隔开。涂膜2提高了热电元件3的强度和耐湿性，以防止即使在施加负载，冲击或热应力的情况下热电元件也不会破裂或断裂，并且保护热电元件免受腐蚀高湿度气氛，提供具有改善的操作可靠性的热电模块1。

7. 发明授权

US5656798A Terminal-carrying circuit board 失效
标题翻译：端子承载电路板
公开(公告)号：US5656798A
公开(公告)日：1997-08-12
申请号：US574855
申请日：1995-12-19
申请人： Masao Kubo , Kazuo Kamada , Masanobu Ogasawara , Yoshimitsu Nakamura
发明人： Masao Kubo , Kazuo Kamada , Masanobu Ogasawara , Yoshimitsu Nakamura
IPC分类号： H01L21/48 , H01R12/58 , H01R43/02 , H05K3/32 , H05K3/34 , H05K1/02
CPC分类号： H01R43/0235 , H01L21/486 , H01R12/58 , H01R43/0221 , H05K3/3447 , H01L2924/15312 , H01R12/523 , H05K2201/10303 , H05K2201/10871 , H05K2201/10984 , H05K2203/107 , H05K3/3494 , Y10T29/49149 , Y10T29/49153
摘要： A circuit board has holes extending therethrough, and a solder layer disposed on a first side of the board. Terminals have been pushed through respective holes and into contact with the solder layer. The terminals have been welded to the first side of the circuit board in a fluxless manner by an irradiated energy beam.
摘要翻译：电路板具有贯穿其中的孔，以及设置在板的第一侧上的焊料层。端子已经被推过相应的孔并与焊料层接触。这些端子已经被焊接到电路板的第一侧，以无光泽的方式被照射的能量束焊接。

8. 发明授权

US5497546A Method for mounting lead terminals to circuit board 失效
标题翻译：将引线端子安装到电路板的方法
公开(公告)号：US5497546A
公开(公告)日：1996-03-12
申请号：US120429
申请日：1993-09-14
申请人： Masao Kubo , Kazuo Kamada , Masanobu Ogasawara , Yoshimitsu Nakamura
发明人： Masao Kubo , Kazuo Kamada , Masanobu Ogasawara , Yoshimitsu Nakamura
IPC分类号： H01L21/48 , H01R12/58 , H01R43/02 , H05K3/32 , H05K3/34 , H01R9/00
CPC分类号： H01R43/0235 , H01L21/486 , H01R12/58 , H01R43/0221 , H05K3/3447 , H01L2924/15312 , H01R12/523 , H05K2201/10303 , H05K2201/10871 , H05K2201/10984 , H05K2203/107 , H05K3/3494 , Y10T29/49149 , Y10T29/49153
摘要： Load terminals are mounted to a circuit board by providing a solder layer on each lead terminal and on each conductive inner wall surface of respective holes formed in the circuit board. The lead terminals are thrust into respective holes, and contacting portions of the solder layers are irradiated with an energy beam, to produce sufficient heat for welding in a fluxless manner each lead terminal to the inner wall surface of its respective hole.
摘要翻译：通过在每个引线端子上以及形成在电路板中的相应孔的每个导电内壁表面上设置焊料层，将负载端子安装到电路板上。引线端子被推入相应的孔中，并且用能量束照射焊料层的接触部分，以产生足够的热量，以无助焊方式焊接各引线端子到其相应孔的内壁表面。

9. 发明授权

US06331063B1 LED luminaire with light control means 失效
标题翻译： LED灯具带灯光控制装置
公开(公告)号：US06331063B1
公开(公告)日：2001-12-18
申请号：US09199893
申请日：1998-11-25
申请人： Kazuo Kamada , Shoichi Koyama , Nobuyuki Asahi , Toshiyuki Suzuki , Eiji Shiohama , Masaru Sugimoto , Shohei Yamamoto , Jiro Hashizume , Taishi Akiniwa , Takashi Tanaka
发明人： Kazuo Kamada , Shoichi Koyama , Nobuyuki Asahi , Toshiyuki Suzuki , Eiji Shiohama , Masaru Sugimoto , Shohei Yamamoto , Jiro Hashizume , Taishi Akiniwa , Takashi Tanaka
IPC分类号： F21V704
CPC分类号： F21V5/02 , F21Y2105/00 , F21Y2107/00 , F21Y2107/10 , F21Y2107/50 , F21Y2107/90 , F21Y2115/10 , H01L25/0753 , H01L25/167 , H01L2224/45144 , H01L2224/48091 , H01L2224/73265 , H01L2924/3025 , H05K1/0284 , H05K1/182 , H01L2924/00014 , H01L2924/00
摘要： An LED luminaire is formed such that a plurality of LED chips are disposed three-dimensionally on an MID (molded interconnection device) substrate in a rectangular plate shape, by mounting three LED chips on bottom face of respective dents provided lengthwise and crosswise in one surface of the MID substrate, the LED chips including at least two types mutually diffferent in luminous color, desirably three types of red, blue and green colors. Any optional light distribution characteristic is made thereby easily obtainable depending on a configuration of the substrate, luminaire module can be thinned, and such delicate color difference as white color and day-light color of luminescent lamps is enabled by mixing the luminous colors of the respective LED chips.
摘要翻译：形成LED灯具，使得多个LED芯片以三维方式设置在矩形板状的MID（模制互连装置）基板上，通过在一个表面纵向和横向设置各个凹槽的底面上安装三个LED芯片的MID基板，包括至少两种相互不同的发光颜色的LED芯片，期望为红色，蓝色和绿色三种类型。由此可以根据基板的结构容易地获得任何可选的光分布特性，可以使灯具组件变薄，通过混合各个发光体的发光颜色，能够实现发光灯的白色和日光颜色的微妙色差 LED芯片

10. 发明授权

US06278050B1 Method of producing sintered body of material for thermoelectric element 失效
标题翻译：生产热电元件材料烧结体的方法
公开(公告)号：US06278050B1
公开(公告)日：2001-08-21
申请号：US09602017
申请日：2000-06-23
申请人： Yoji Urano , Kazuo Kamada , Hirokazu Yoshioka , Kentaro Kobayashi
发明人： Yoji Urano , Kazuo Kamada , Hirokazu Yoshioka , Kentaro Kobayashi
IPC分类号： H01L3534
CPC分类号： H01L35/34 , B22F2998/10 , B22F3/1208 , B22F3/16
摘要： A sintered body of a material for thermoelectric element having excellent thermoelectric performance and mechanical strength can be produced by the following method. A block of the material for thermoelectric element is provided. The block has an electric-current passing direction, in which electricity is supplied to obtain a desired thermoelectric performance of the thermoelectric element. The block is encased in an elongate capsule such that the electric-current passing direction of the block is substantially agreement with an axial direction of the capsule. After degassing the capsule, a forming operation for reducing a cross section perpendicular to the axial direction of the capsule is performed to obtain a formed capsule having a green compact of the block crushed by the forming operation therein. A heat treatment is then performed to sinter the green compact in the formed capsule. Finally, the resultant sintered body is removed from the formed capsule. This method is preferably used to manufacture a thermoelectric module that is a temperature control device using the Peltier effect.
摘要翻译：通过以下方法可以制造出具有优异的热电性能和机械强度的用于热电元件的材料的烧结体。提供了一种用于热电元件的材料块。该块具有电流通过方向，其中供电以获得热电元件的期望的热电性能。块被封装在细长的胶囊中，使得块的电流通过方向基本上与胶囊的轴向方向一致。在对胶囊进行脱气之后，进行用于减小与胶囊的轴向垂直的横截面的成形操作，以获得具有通过其中的成形操作压碎的块的生坯的成形胶囊。然后进行热处理以烧结形成的胶囊中的生坯。最后，从形成的胶囊中除去所得的烧结体。该方法优选用于制造使用珀尔帖效应的温度控制装置的热电模块。

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