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1. 发明申请

US20110298143A1 COPOLYCARBONATE AND OPTICAL LENS 审中-公开
标题翻译：共聚碳酸酯和光学透镜
公开(公告)号：US20110298143A1
公开(公告)日：2011-12-08
申请号：US13201555
申请日：2010-03-02
申请人： Kazunori Nunome , Manabu Matsui , Yoshihiko Imanaka
发明人： Kazunori Nunome , Manabu Matsui , Yoshihiko Imanaka
IPC分类号： B29D11/00 , C08G64/20 , C08G64/16
CPC分类号： C08G64/165 , C08G64/081 , G02B1/041 , C08L69/00
摘要： A copolycarbonate having a high refractive index, a small birefringence, high processability and excellent transparency and an optical lens formed from the copolycarbonate.The copolycarbonate has a total content of a unit represented by the following formula (I) and a unit represented by the following formula (II) of not less than 80 mol % based on the total of all the recurring units, the molar ratio of the unit represented by the formula (I) to the unit represented by the formula (II) being in the range of 98:2 to 35:65. (wherein each of R1, R2, R3 and R4 is independently a hydrogen atom, alkyl group having 1 to 20 carbon atoms or the like. X is an alkylene group having 2 to 8 carbon atoms or the like. Each of m and n is independently an integer of 1 to 10.) (wherein each of R5, R6, R7 and R8 is independently a hydrogen atom, alkyl group having 1 to 20 carbon atoms or the like.)
摘要翻译：具有高折射率，小双折射，高加工性和优异透明性的共聚碳酸酯和由共聚碳酸酯形成的光学透镜。共聚碳酸酯的总含量以下述通式（I）表示的单元，下式（II）表示的单元相对于全部重复单元的总和为80摩尔％以上，由式（I）表示的单元与由式（II）表示的单元的比例在98:2至35:65的范围内。（其中R 1，R 2，R 3和R 4各自独立地为氢原子，碳原子数1〜20的烷基等，X为碳原子数2〜8的亚烷基等，m和n分别为独立地为1〜10的整数。）（其中，R 5，R 6，R 7和R 8各自独立地为氢原子，碳原子数为1〜20的烷基等。

2. 发明授权

US08404134B2 Method for manufacturing electrode foil 有权
标题翻译：电极箔的制造方法
公开(公告)号：US08404134B2
公开(公告)日：2013-03-26
申请号：US12366874
申请日：2009-02-06
申请人： Yoshihiko Imanaka , Hitoshi Yamada , Hideyuki Amada
发明人： Yoshihiko Imanaka , Hitoshi Yamada , Hideyuki Amada
IPC分类号： B31D3/00
CPC分类号： C25F3/04 , H01G9/045 , H01G9/055 , Y10T428/24926 , Y10T428/31678
摘要： A method of manufacturing a electrode foil composed of a valve metal layer of a first valve metal and a metal foil of a second valve metal supporting the valve metal layer, the method includes coating fine particles of the first valve metal with a resin to form composite fine particles, forming the composite fine particles into an aerosol, jetting the aerosol to the metal foil in an atmosphere under a reduced pressure, depositing the composite fine particles onto the metal foil to form a aerosol deposition layer, and removing selectively the resin from the aerosol deposition layer to form the valve metal layer.
摘要翻译：一种制造由第一阀金属的阀金属层和支撑阀金属层的第二阀金属的金属箔构成的电极箔的方法，该方法包括用树脂涂覆第一阀金属的细颗粒以形成复合物细小颗粒，将复合细颗粒形成气雾剂，在减压气氛下将气溶胶喷射到金属箔上，将复合细颗粒沉积到金属箔上以形成气溶胶沉积层，并从气溶胶沉积层形成阀门金属层。

3. 发明授权

US08080875B2 Interconnection substrate and semiconductor device, manufacturing method of interconnection substrate 有权
标题翻译：互连基板和半导体器件，互连基板的制造方法
公开(公告)号：US08080875B2
公开(公告)日：2011-12-20
申请号：US11968341
申请日：2008-01-02
申请人： Yoshihiko Imanaka
发明人： Yoshihiko Imanaka
IPC分类号： H01L23/48
CPC分类号： H05K3/4614 , H01L21/4857 , H01L21/6835 , H01L23/49822 , H01L2224/10175 , H01L2224/16 , H01L2224/16235 , H01L2924/00011 , H01L2924/00014 , H01L2924/0102 , H01L2924/01078 , H01L2924/01079 , H05K3/102 , H05K3/4069 , H05K3/4644 , H05K3/4652 , H05K2201/0245 , H05K2201/10378 , H05K2203/0191 , H05K2203/1344 , H05K2203/1461 , H01L2224/0401
摘要： An interconnection substrate including therein one or more resin layers, each of the resin layers including therein a via-hole penetrating from a top surface to a bottom surface of the resin layer. A via-plug of metal particles is formed in the via-hole. Each of the metal particles has a flattened shape generally parallel to a plane of the resin layer.
摘要翻译：一种其中包括一个或多个树脂层的互连基板，每个树脂层包括从树脂层的顶表面延伸到底表面的通孔。在通孔中形成金属颗粒的通孔。每个金属颗粒具有大致平行于树脂层的平面的扁平形状。

4. 发明申请

US20100165544A1 ELECTRODE FOIL, METHOD OF MANUFACTURING ELECTRODE FOIL, AND ELECTROLYTIC CAPACITOR 失效
标题翻译：电极箔，制造电极箔的方法和电解电容器
公开(公告)号：US20100165544A1
公开(公告)日：2010-07-01
申请号：US12580708
申请日：2009-10-16
申请人： Yoshihiko Imanaka , Minoru Funahashi , Hidetoshi Ishizuka , Katsuharu Yamada
发明人： Yoshihiko Imanaka , Minoru Funahashi , Hidetoshi Ishizuka , Katsuharu Yamada
IPC分类号： H01G9/04 , H01G9/045 , H01G9/07 , H01G9/042 , H01G9/035 , H01G9/025 , H01G9/028 , B32B15/02 , B05D3/00 , B05D5/12 , C25F3/04
CPC分类号： H01G9/045 , H01G9/02 , H01G9/028 , H01G9/055 , H01G9/151 , H01G11/48 , Y02E60/13 , Y10T428/12049 , Y10T428/12139
摘要： An electrode foil includes a structure a structure in which metal particles and ceramic particles, which primarily include at least one of valve metal particles having a dielectric constant and ceramic particles, are deposited on a surface of a metal foil.
摘要翻译：电极箔包括结构，其中主要包括具有介电常数的阀金属颗粒和陶瓷颗粒中的至少一种的金属颗粒和陶瓷颗粒沉积在金属箔的表面上。

5. 发明申请

US20100123996A1 STRUCTURAL BODY, CAPACITOR, AND METHOD OF FABRICATING THE CAPACITOR 有权
标题翻译：结构体，电容器和电容器的制造方法
公开(公告)号：US20100123996A1
公开(公告)日：2010-05-20
申请号：US12575791
申请日：2009-10-08
申请人： Yoshihiko Imanaka
发明人： Yoshihiko Imanaka
IPC分类号： H01G4/06 , B32B7/02 , B05D5/12
CPC分类号： H01G4/20 , H01G4/10 , H01G4/33 , Y10T428/24942
摘要： A structural body which includes a first dielectric layer formed on a first substrate and including first conductive particles, each surface of the first conductive particles being entirely covered with a first dielectric film; and a second dielectric layer formed on the first dielectric layer wherein a volume ratio of a dielectric in the second dielectric layer is higher than a volume ratio of a dielectric in the first dielectric layer.
摘要翻译：一种结构体，包括形成在第一基板上并包括第一导电颗粒的第一介电层，第一导电颗粒的每个表面全部被第一介电膜覆盖; 以及形成在所述第一电介质层上的第二电介质层，其中所述第二电介质层中的电介质的体积比高于所述第一电介质层中的电介质的体积比。

6. 发明申请

US20090316333A1 METHOD FOR MANUFACTURING CAPACITOR, AND CAPACITOR 审中-公开
标题翻译：制造电容器和电容器的方法
公开(公告)号：US20090316333A1
公开(公告)日：2009-12-24
申请号：US12411757
申请日：2009-03-26
申请人： Yoshihiko Imanaka
发明人： Yoshihiko Imanaka
IPC分类号： H01G4/06 , B05D5/12
CPC分类号： H01G4/12 , C23C24/04 , H01G9/0029 , H01G9/04 , H01G9/045
摘要： A method for manufacturing a capacitor, includes: accelerating conductor particles by ejecting the conductor particles together with gas, each surface of the conductor particles covered with a dielectric entirely; fixing the conductor particles to a substrate with the surface of the conductor particles still covered with the dielectric entirely by colliding the conductor particles with the substrate; and sandwiching a deposited film formed of the conductor particles fixed to the substrate between electrodes.
摘要翻译：一种制造电容器的方法，包括：通过将导体颗粒与气体一起喷射来加速导体颗粒，导体颗粒的每个表面完全被电介质覆盖; 将导体颗粒固定到基底上，导体颗粒的表面仍然被电介质完全覆盖，导体颗粒与基底相撞; 并且将由固定在基板上的导体颗粒形成的沉积膜夹在电极之间。

7. 发明申请

US20090143560A1 Optical Element and Achromatic Lens 失效
标题翻译：光学元件和消色差透镜
公开(公告)号：US20090143560A1
公开(公告)日：2009-06-04
申请号：US12084620
申请日：2006-11-08
申请人： Kunio Hatanaka , Yoshihiko Imanaka , Masanori Monri
发明人： Kunio Hatanaka , Yoshihiko Imanaka , Masanori Monri
IPC分类号： C08G64/06
CPC分类号： G02B1/04 , C08G64/10 , G02B1/041 , G02B27/0037 , G02B27/4211 , G02B27/4272 , C08L69/00
摘要： There are provided an optical element that comprises a polymer which has a structural unit derived from a specific dihydroxy compound typified by 2,2-bis(4-hydroxyphenyl)-1,1,1,3,3,3-hexafluoro propane (bisphenol AF) and in which the relationship between a refractive index nD and an Abbe number νD satisfies the following formula (I): nD+0.0076×νD≦1.78 (I) and that is used for correction of chromatic aberration, and an achromatic lens using the optical element.
摘要翻译：提供了一种光学元件，其包含聚合物，其具有衍生自以2,2-双（4-羟基苯基）-1,1,1,3,3,3-六氟丙烷（双酚）为代表的特定二羟基化合物的结构单元 AF），折射率nD与阿贝数nuD之间的关系满足下式（I）：<？in-line-formula description =“In-line Formulas”end =“lead”？> nD + 0.0076 xnuD <= 1.78（I）<？in-line-formula description =“In-line Formulas”end =“tail”？>，用于色差校正，以及使用该光学元件的消色差透镜。

8. 发明申请

US20070293606A1 Infrared Absorption Filter 有权
标题翻译：红外线吸收滤光片
公开(公告)号：US20070293606A1
公开(公告)日：2007-12-20
申请号：US11665799
申请日：2005-10-19
申请人： Masahiro Yamada , Tsuyoshi Fujiki , Shinichi Kawasaki , Mitsuaki Yamada , Takatsune Yanagida , Masatoshi Ando , Yoshihiko Imanaka
发明人： Masahiro Yamada , Tsuyoshi Fujiki , Shinichi Kawasaki , Mitsuaki Yamada , Takatsune Yanagida , Masatoshi Ando , Yoshihiko Imanaka
IPC分类号： G02B5/22 , C08G64/06 , C09B47/08 , C09B47/30 , C09B53/00 , C09B57/10 , C09K3/00
CPC分类号： C09B53/02 , C08G64/0208 , C08G64/04 , C08G64/1608 , C08J5/18 , C08J2369/00 , C08K5/0041 , C09B47/08 , C09B47/30 , G02B5/208 , C08L69/00
摘要： It is an object of the present invention to provide an infrared absorption filter which enables a coloring matter having infrared absorptivity to be contained or dispersed uniformly in a high concentration and has excellent durability and an infrared absorption panel comprising this infrared absorption filter. The infrared absorption filter is composed of a polycarbonate resin which contains 20 to 100 mol % of a recurring unit having a fluorene skeleton represented by the formula (1) and 0 to 80 mol % of a recurring unit represented by the formula (2) and a coloring matter having infrared absorptivity.
摘要翻译：本发明的目的是提供一种红外线吸收滤光器，其能够使具有红外线吸收性的着色物质以高浓度均匀地包含或分散并具有优异的耐久性和包含该红外吸收滤光片的红外线吸收面板。红外线吸收滤光器由含有20〜100摩尔％的具有式（1）所示的芴骨架的重复单元和0〜80摩尔％的式（2）表示的重复单元的聚碳酸酯树脂和具有红外线吸收性的着色物质。

9. 发明申请

US20070230151A1 Circuit substrate and electronic apparatus, fabrication process thereof 有权
标题翻译：电路基板及电子设备及其制造工艺
公开(公告)号：US20070230151A1
公开(公告)日：2007-10-04
申请号：US11507505
申请日：2006-08-22
申请人： Nobuyuki Hayashi , Yoshihiko Imanaka
发明人： Nobuyuki Hayashi , Yoshihiko Imanaka
IPC分类号： H05K1/11 , H05K1/14
CPC分类号： H05K1/162 , H05K3/4602 , H05K2201/0175 , H05K2201/0187 , H05K2201/09509 , H05K2201/096 , H05K2201/09809 , H05K2201/09827 , H05K2203/1366
摘要： A circuit substrate comprises a lamination of plural resin insulation films and includes, on a surface and in an interior of the circuit substrate, plural interconnection layers. One of the plural resin insulation films is formed on a first conductor pattern constituting one of the plural interconnection layers in such a manner that a bottom principal surface of the resin insulation film makes a contact with a surface of the first conductor pattern, the resin insulation film including an opening defined by a sloped surface and exposing the first conductor pattern at the bottom principal surface. A ceramic high-K dielectric film is formed at a bottom of the opening in contact with the surface of the first conductor pattern, wherein there is formed a second conductor pattern constituting one of the plural interconnection layers on the resin insulation film so as to cover the sloped surface and in contact with a surface of the ceramic high-K dielectric film.
摘要翻译：电路基板包括多个树脂绝缘膜的叠层，并且在电路基板的表面和内部包括多个互连层。多个树脂绝缘膜之一形成在构成多个互连层之一的第一导体图案上，使得树脂绝缘膜的底部主表面与第一导体图案的表面接触，树脂绝缘体膜包括由倾斜表面限定的开口并且在底部主表面处暴露第一导体图案。陶瓷高K电介质膜形成在与第一导体图案的表面接触的开口的底部，其中在树脂绝缘膜上形成构成多个互连层之一的第二导体图案，以覆盖倾斜的表面并与陶瓷高K电介质膜的表面接触。

10. 发明授权

US07176556B2 Semiconductor system-in-package 有权
标题翻译：半导体系统封装
公开(公告)号：US07176556B2
公开(公告)日：2007-02-13
申请号：US10092525
申请日：2002-03-08
申请人： Keishiro Okamoto , Takeshi Shioga , Osamu Taniguchi , Koji Omote , Yoshihiko Imanaka , Yasuo Yamagishi
发明人： Keishiro Okamoto , Takeshi Shioga , Osamu Taniguchi , Koji Omote , Yoshihiko Imanaka , Yasuo Yamagishi
IPC分类号： H01L29/40 , H01L29/00 , H01L23/34
CPC分类号： H01L23/49816 , H01L21/4846 , H01L23/49822 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16235 , H01L2924/01019 , H01L2924/01046 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/15192 , H01L2924/3011
摘要： A semiconductor apparatus comprises a support substrate having through holes filles with conductor adapted to a first pitch; a capacitor formed on or above said support substrate; a wiring layer formed on or above said support substrate, leading some of said through holes filles with conductor upwards through said capacitor, having branches, and having wires of a second pitch different from said first pitch; and plural semiconductor elements disposed on or above said wiring layer, having terminals adapted to the second pitch, and connected with said wiring layer via said terminals. A semiconductor apparatus, in which semiconductor elements having a narrow terminal pitch, a support having through wires at a wider pitch, and a capacitor are suitably electrically connected to realize the decoupling function with reduced inductance and large capacitance.
摘要翻译：一种半导体装置，包括：支撑基板，其具有填充有适于第一间距的导体的通孔; 形成在所述支撑基板上或上方的电容器; 形成在所述支撑基板上或上方的布线层，使一些所述通孔向上填充有通过所述电容器的导体，具有分支，并且具有不同于所述第一间距的第二间距的导线; 以及设置在所述布线层上或上方的多个半导体元件，具有适于所述第二间距的端子，并且经由所述端子与所述布线层连接。其中具有窄端子间距的半导体元件，具有较宽节距的导线的支撑件和电容器的半导体装置被适当地电连接以实现具有减小的电感和大电容的去耦功能。

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