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    • 1. 发明授权
    • Non-contact system parallel data transfer system
    • 非接触式系统并行数据传输系统
    • US5574273A
    • 1996-11-12
    • US257906
    • 1994-06-13
    • Kazunari NakagawaTakeshi TottoriWasao TakasugiYoshiharu HinoTakeshi Uchida
    • Kazunari NakagawaTakeshi TottoriWasao TakasugiYoshiharu HinoTakeshi Uchida
    • G06K7/08G06K19/06G06K7/06
    • G06K7/10336
    • An electromagnetic coupling connector for transferring data by an electromagnetic coupling system, including a plurality of data transfer coils for transferring data, disposed at an end portion of a side surface of the connector, a waveform shaper for shaping a waveform of a data signal received by the data transfer coils, and a connector for transferring the signal obtained by the waveform shaper to an equipment to which the electromagnetic coupling connector is fitted. The electromagnetic coupling connector may include a signal transmission/reception portion and a power transmission or reception portion, the signal transmission/reception portion includes a signal amplification circuit, a waveform shaping circuit, a serial/parallel signal conversion circuit and a parallel/serial signal conversion circuit, the power transmission portion includes an oscillation circuit, and the power reception portion includes a rectification/smoothing circuit and a constant voltage.
    • 一种用于通过电磁耦合系统传送数据的电磁耦合连接器,包括设置在连接器侧面端部的用于传送数据的多个数据传送线圈,用于对由 数据传送线圈和用于将由波形整形器获得的信号传送到安装有电磁耦合连接器的设备的连接器。 电磁耦合连接器可以包括信号发送/接收部分和电力传输或接收部分,信号发送/接收部分包括信号放大电路,波形整形电路,串行/并行信号转换电路和并行/串行信号 电力传输部分包括振荡电路,并且电力接收部分包括整流/平滑电路和恒定电压。
    • 4. 发明授权
    • Non-contact IC module
    • 非接触式IC模块
    • US07334734B2
    • 2008-02-26
    • US09769293
    • 2001-01-26
    • Yoshiharu HinoKazuhiko Daido
    • Yoshiharu HinoKazuhiko Daido
    • G06K19/06
    • H01Q1/2225H01Q1/22H01Q7/00
    • An accessed object having a non-contact IC module including a semiconductor device and a module-side antenna formed extending over two sides of an accessed object, wherein the module-side antenna consists of a first module-side antenna and a second module-side antenna continuous to the first module-side antenna, wherein the first module-side antenna secures a necessary antenna effective area by coming into face-to-face relation with a first apparatus-side antenna on communication apparatus to communicate with the accessed object, and wherein the second module-side antenna is disposed close to the second apparatus-side antenna in an access direction different from the direction in which the first apparatus-side antenna makes access to the accessed object.
    • 具有非接触IC模块的被访问对象包括半导体器件和形成在被访问对象的两侧上的模块侧天线,其中模块侧天线由第一模块侧天线和第二模块侧 天线连接到第一模块侧天线,其中第一模块侧天线通过与通信装置上的第一装置侧天线面对面地关系来确保必要的天线有效区域,以与所访问的对象进行通信,以及 其中所述第二模块侧天线在与所述第一装置侧天线访问所访问对象的方向不同的访问方向上设置为靠近所述第二装置侧天线。
    • 6. 发明授权
    • Non-contact IC module
    • 非接触式IC模块
    • US07748638B2
    • 2010-07-06
    • US12013339
    • 2008-01-11
    • Yoshiharu HinoKazuhiko Daido
    • Yoshiharu HinoKazuhiko Daido
    • G06K19/06
    • H01Q1/2225H01Q1/22H01Q7/00
    • An accessed object having a non-contact IC module including a semiconductor device and a module-side antenna formed extending over two sides of an accessed object, wherein the module-side antenna consists of a first module-side antenna and a second module-side antenna continuous to the first module-side antenna, wherein the first module-side antenna secures a necessary antenna effective area by coming into face-to-face relation with a first apparatus-side antenna on communication apparatus to communicate with the accessed object, and wherein the second module-side antenna is disposed close to the second apparatus-side antenna in an access direction different from the direction in which the first apparatus-side antenna makes access to the accessed object.
    • 具有非接触IC模块的被访问对象包括半导体器件和形成在被访问对象的两侧上的模块侧天线,其中模块侧天线由第一模块侧天线和第二模块侧 天线连接到第一模块侧天线,其中第一模块侧天线通过与通信装置上的第一装置侧天线面对面地关系来确保必要的天线有效区域,以与所访问的对象进行通信,以及 其中所述第二模块侧天线在与所述第一装置侧天线访问所访问对象的方向不同的访问方向上设置为靠近所述第二装置侧天线。