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1. 发明申请

US20060194942A1 Polyimide films with superior alkali etching workability and superior stamping workability 审中-公开
标题翻译：具有优异的碱蚀刻加工性和优异的冲压加工性的聚酰亚胺膜
公开(公告)号：US20060194942A1
公开(公告)日：2006-08-31
申请号：US11348623
申请日：2006-02-01
申请人： Kazuhiro Ono , Kan Fujihara , Kiyokazu Akahori
发明人： Kazuhiro Ono , Kan Fujihara , Kiyokazu Akahori
IPC分类号： C08G69/26
CPC分类号： C08J5/18 , C08G73/10 , C08G73/1067 , C08G73/1071 , C08J2379/08
摘要： A polyimide film according to the present invention satisfies Condition (1) in which a tear propagation resistance variation CH is not more than 1.0 g, and/or Condition (2) in which a swelling coefficient CR after being dipped in an alkaline solution is not more than 20.0. By satisfying these conditions, workability of the polyimide film can be improved and working defects can be effectively prevented, thereby improving productivity of each step.
摘要翻译：根据本发明的聚酰亚胺膜满足条件（1），其中，撕裂蔓延阻力变化量C H不大于1.0g，和/或其中溶胀系数C < 浸渍在碱性溶液中之后，不超过20.0。通过满足这些条件，可以提高聚酰亚胺膜的加工性，并且可以有效地防止工作缺陷，从而提高各步骤的生产率。

2. 发明申请

US20050238896A1 Polyimide film and method for production thereof, and polyimide/metal laminate using polyimide 审中-公开
标题翻译：聚酰亚胺膜及其制造方法以及使用聚酰亚胺的聚酰亚胺/金属层叠体
公开(公告)号：US20050238896A1
公开(公告)日：2005-10-27
申请号：US10514929
申请日：2003-05-20
申请人： Toshihisa Itoh , Kan Fujihara , Kazuhiro Ono , Shirou Sasaki , Kiyokazu Akahori
发明人： Toshihisa Itoh , Kan Fujihara , Kazuhiro Ono , Shirou Sasaki , Kiyokazu Akahori
IPC分类号： B32B15/08 , C08J5/18 , C23C14/20 , H05K1/03 , B32B27/00
CPC分类号： C08J5/18 , B32B15/08 , C08J2379/08 , C23C14/20 , H05K1/0346 , Y10T428/31721
摘要： A polyimide film having improved adhesion strength is produced by forming a partially cured and/or dried gel film using a first polyamic acid solution; coating the gel film with the second polyamic acid solution or immersing the gel film in the second polyamic acid solution; and heating the gel film applied with the second polyamic acid solution. By laminating a metal by vapor deposition, sputtering, ion plating, or the like, directly on the polyimide film, a polyimide/metal laminate is provided which has excellent dimensional stability and in which reliability with respect to adhesion between the polyimide film and the metal is improved.
摘要翻译：通过使用第一聚酰胺酸溶液形成部分固化和/或干燥的凝胶膜来制备具有改善的粘合强度的聚酰亚胺膜; 用第二聚酰胺酸溶液涂布凝胶膜或将凝胶膜浸入第二聚酰胺酸溶液中; 并加热施加有第二聚酰胺酸溶液的凝胶膜。通过直接在聚酰亚胺膜上通过气相沉积，溅射，离子电镀等层压金属，提供了聚酰亚胺/金属层压体，该聚酰亚胺/金属层压体具有优异的尺寸稳定性，并且在聚酰亚胺膜和金属之间的粘附性方面具有可靠性改进了

3. 发明授权

US07267883B2 Polyimide film and laminate having metal layer and same 有权
标题翻译：聚酰亚胺膜和具有金属层的层压体
公开(公告)号：US07267883B2
公开(公告)日：2007-09-11
申请号：US10667134
申请日：2003-09-19
申请人： Kan Fujihara , Kazuhiro Ono , Kiyokazu Akahori
发明人： Kan Fujihara , Kazuhiro Ono , Kiyokazu Akahori
IPC分类号： B32B27/06 , B32B15/08
CPC分类号： B32B15/08 , C08G73/10 , C08G73/1039 , C08G73/1064 , C08G73/1067 , C08G73/1071 , C08G73/1082 , C08G73/16 , C08J5/18 , C08J2379/08 , H05K1/0346 , Y10T428/31681 , Y10T428/31721
摘要： A polyimide film of the present invention is a polyimide film having a dynamic viscoelasticity whose tan δ peak is located in a range of not less than 310° C. but not more than 410° C., and whose tan δ value at 300° C. is not more than 0.05, or a polyimide film prepared by copolymerizing (a) an acid dianhydride component including a biphenyltetracarboxylic dianhydride and a pyromellitic dianhydride, and (b) a diamine component, and the polyimide film having such an etching speed that one side thereof is etched with a 1N potassium hydroxide solution at an etching speed of 0.1 μm/minute (one side) or higher. The polyimide film of the present invention possesses film properties that are necessary for use in an electronic raw material for flexible printed circuit boards and the like, and is suitable as an electronic raw material.
摘要翻译：本发明的聚酰亚胺膜是具有动态粘弹性的聚酰亚胺膜，其tanδ峰位于不低于310℃但不高于410℃的范围内，其tanδ值在300℃ （a）包含联苯四羧酸二酐和均苯四酸二酐的酸二酐组分和（b）二胺组分制备的聚酰亚胺膜，以及具有如下蚀刻速度的聚酰亚胺膜：以0.1mum /分钟（一侧）的蚀刻速度用1N氢氧化钾溶液蚀刻。本发明的聚酰亚胺膜具有用于柔性印刷电路板等的电子原料所必需的膜特性，并且适合作为电子原料。

4. 发明授权

US06852826B2 Manufacturing method of polyamic acid, and polyamic acid solution 有权
标题翻译：聚酰胺酸和聚酰胺酸溶液的制备方法
公开(公告)号：US06852826B2
公开(公告)日：2005-02-08
申请号：US10326799
申请日：2002-12-19
申请人： Kan Fujihara , Kazuhiro Ono , Kiyokazu Akahori
发明人： Kan Fujihara , Kazuhiro Ono , Kiyokazu Akahori
IPC分类号： C08G73/10 , C08G69/28
CPC分类号： C08G73/1007
摘要： In a step of polymerizing polyamic acid by mixing tetracarboxylic acid dianhydride and diamine and polycondensating the tetracarboxylic acid dianhydride and diamine under the presence of a polymerization-use solvent, a tetracarboxylic acid dianhydride slurry in which a tetracarboxylic acid dianhydride is dispersed in a dispersion medium is used. According to this, it is possible to directly manufacture a polyamic acid solution having a high concentration of polyamic acid more than or equal to 10% by weight. Especially, even if a tetracarboxylic acid dianhydride having low solubility in the polymerization-use solvent, it is possible to effectively manufacture a polyamic acid solution having high solids content, by a simple process and in a short time.
摘要翻译：在聚四甲酸二酐和二胺混合并在四聚羧酸二酐和二胺在聚合用溶剂的存在下缩聚的步骤中，将四羧酸二酐分散在分散介质中的四羧酸二酐浆料是用过的。据此，可以直接制造聚酰胺酸浓度高于10重量％的聚酰胺酸溶液。特别是即使在聚合用溶剂中溶解性低的四羧酸二酐也可以通过简单的工艺和短时间有效地制造固体含量高的聚酰胺酸溶液。

5. 发明申请

US20070045895A1 Process for producing synthetic resin film having molecular orientation controlled in MD direction 审中-公开
标题翻译：具有在MD方向控制的分子取向的合成树脂膜的制造方法
公开(公告)号：US20070045895A1
公开(公告)日：2007-03-01
申请号：US11509083
申请日：2006-08-24
申请人： Takaaki Matsuwaki , Kazuhiro Ono , Kan Fujihara , Toshihisa Itoh , Kiyokazu Akahori
发明人： Takaaki Matsuwaki , Kazuhiro Ono , Kan Fujihara , Toshihisa Itoh , Kiyokazu Akahori
IPC分类号： B29C39/14 , B29C39/38
CPC分类号： B29C41/28 , B29C55/00 , B29C71/0072 , B29C71/02 , B29C2035/046 , B29K2995/0051 , C08J5/18 , C08J2379/08 , H05K1/0393 , H05K3/0011 , H05K3/007 , H05K2203/0156 , H05K2203/0759 , H05K2203/1105
摘要： It is an object of the present invention to provide a stable process for continuously producing a synthetic resin film oriented in the machine direction across the full width. The present invention provides a process for producing a synthetic resin film including step (A) of casting and applying a composition containing a polymer and an organic solvent onto a support to form a gel film; step (B) of stripping the gel film and heating the gel film with both ends being fixed; and step (C) of heating the film with both ends being released after step (B), wherein the thickness b of the film produced in step (B) and the thickness c of the film produced in step (C) satisfy the relationship: b>c.
摘要翻译：本发明的目的是提供一种用于在整个宽度上连续生产沿机器方向取向的合成树脂薄膜的稳定方法。本发明提供一种制造合成树脂薄膜的方法，该方法包括将含有聚合物和有机溶剂的组合物浇铸和涂布到载体上以形成凝胶膜的步骤（A）步骤（B）剥离凝胶膜并加热两端固定的凝胶膜; 以及步骤（B）中两端被剥离的步骤（C），其中步骤（B）中制备的膜的厚度b和步骤（C）中制备的膜的厚度c满足以下关系： <？in-line-formula description =“In-line Formulas”end =“lead”？> b> c。 <？in-line-formula description =“In-line Formulas”end =“tail”？>

6. 发明授权

US07112648B2 Polyimide film excellent in alkali etching processability and punchability 有权
标题翻译：碱蚀刻加工性和冲压性优异的聚酰亚胺膜
公开(公告)号：US07112648B2
公开(公告)日：2006-09-26
申请号：US10480899
申请日：2002-06-17
申请人： Kazuhiro Ono , Kan Fujihara , Kiyokazu Akahori
发明人： Kazuhiro Ono , Kan Fujihara , Kiyokazu Akahori
IPC分类号： C08G69/26
CPC分类号： C08J5/18 , C08G73/10 , C08G73/1067 , C08G73/1071 , C08J2379/08
摘要： A polyimide film according to the present invention satisfies Condition (1) in which a tear propagation resistance variation CH is not more than 1.0 g, and/or Condition (2) in which a swelling coefficient CR after being dipped in an alkaline solution is not more than 20.0. By satisfying these conditions, workability of the polyimide film can be improved and working defects can be effectively prevented, thereby improving productivity of each step.
摘要翻译：根据本发明的聚酰亚胺膜满足条件（1），其中，撕裂蔓延阻力变化量C H不大于1.0g，和/或其中溶胀系数C < 浸渍在碱性溶液中之后，不超过20.0。通过满足这些条件，可以提高聚酰亚胺膜的加工性，并且可以有效地防止工作缺陷，从而提高各步骤的生产率。

7. 发明申请

US20070138690A1 Process for producing synthetic resin film having molecular orientation controlled in md direction 审中-公开
标题翻译：具有以md方向控制的分子取向的合成树脂膜的制造方法
公开(公告)号：US20070138690A1
公开(公告)日：2007-06-21
申请号：US10590494
申请日：2005-02-08
申请人： Takaaki Matsuwaki , Kazuhiro Ono , Kan Fujihara , Toshihisa Itoh , Kiyokazu Akahori
发明人： Takaaki Matsuwaki , Kazuhiro Ono , Kan Fujihara , Toshihisa Itoh , Kiyokazu Akahori
IPC分类号： B29C39/14
CPC分类号： B29C41/28 , B29C55/00 , B29C71/0072 , B29C71/02 , B29C2035/046 , B29K2995/0051 , C08J5/18 , C08J2379/08 , H05K1/0393 , H05K3/0011 , H05K3/007 , H05K2203/0156 , H05K2203/0759 , H05K2203/1105
摘要： It is an object of the present invention to provide a stable process for continuously producing a synthetic resin film oriented in the machine direction across the full width. The present invention provides a process for producing a synthetic resin film including step (A) of casting and applying a composition containing a polymer and an organic solvent onto a support to form a gel film; step (B) of stripping the gel film and heating the gel film with both ends being fixed; and step (C) of heating the film with both ends being released after step (B), wherein the thickness b of the film produced in step (B) and the thickness c of the film produced in step (C) satisfy the relationship: b>c.
摘要翻译：本发明的目的是提供一种用于在整个宽度上连续生产沿机器方向取向的合成树脂薄膜的稳定方法。本发明提供一种制造合成树脂薄膜的方法，该方法包括将含有聚合物和有机溶剂的组合物浇铸并施加到载体上以形成凝胶膜的步骤（A）步骤（B）剥离凝胶膜并加热两端固定的凝胶膜; 以及步骤（B）中两端被剥离的步骤（C），其中步骤（B）中制备的膜的厚度b和步骤（C）中制备的膜的厚度c满足以下关系： b> c。

8. 发明申请

US20070066090A1 Wiring board, process for producing the same polyimide film for use in the wiring board, and etchant for use in the process 审中-公开
标题翻译：接线板，用于制造用于布线板的相同聚酰亚胺膜的工艺，以及用于该工艺中的蚀刻剂
公开(公告)号：US20070066090A1
公开(公告)日：2007-03-22
申请号：US11602958
申请日：2006-11-22
申请人： Kazuhiro Ono , Kan Fujihara , Kiyokazu Akahori
发明人： Kazuhiro Ono , Kan Fujihara , Kiyokazu Akahori
IPC分类号： H01B13/00 , H05K1/00
CPC分类号： C08J7/12 , C08J2379/08 , H05K1/0346 , H05K3/002 , H05K2201/0154 , H05K2203/0554 , H05K2203/0793 , H05K2203/122
摘要： In etching an organic insulating layer made of a polyimide film, a polyimide containing at least a recurrent unit expressed by general formula (1) is used for the polyimide film: ;and an alkaline etchant containing oxyalkylamine, a hydroxide of an alkaline metal compound, water, and preferably an aliphatic alcohol is used as an etchant. The composition enables efficient formation of desirably shaped via holes and through holes through the organic insulating layer on a wiring board.
摘要翻译：在蚀刻由聚酰亚胺膜制成的有机绝缘层时，聚酰亚胺膜使用至少含有由通式（1）表示的反复单元的聚酰亚胺;和含有氧烷基胺，碱金属化合物的氢氧化物的碱性蚀刻剂，水，优选使用脂肪族醇作为蚀刻剂。该组合物能够有效地形成通过布线板上的有机绝缘层的期望形状的通孔和通孔。

9. 发明申请

US20070042167A1 Novel polymide film and use thereof 有权
标题翻译：新型聚酰亚胺膜及其用途
公开(公告)号：US20070042167A1
公开(公告)日：2007-02-22
申请号：US11513353
申请日：2006-08-31
申请人： Kan Fujihara , Kazuhiro Ono , Takaaki Matsuwaki
发明人： Kan Fujihara , Kazuhiro Ono , Takaaki Matsuwaki
IPC分类号： B32B15/08 , B32B27/00
CPC分类号： B32B15/08 , B29C55/143 , B29D7/01 , B29K2079/08 , B32B27/281 , B32B27/34 , B32B2038/0088 , B32B2307/514 , B32B2309/02 , C08J5/18 , C08J2379/08 , H05K1/0271 , H05K1/0346 , H05K3/022 , H05K2201/0154 , H05K2201/068 , H05K2203/1545 , Y10T428/24917 , Y10T428/31681 , Y10T428/31721
摘要： A polyimide film in which the dimensional change is reduced when it has undergone a step of laminating a metal on the polyimide film or a step of etching the metal layer to form wiring, and the rate of dimensional change can be stabilized across the entire width is provided. The object can be solved by a polyimide film produced by a continuous process, wherein when a coefficient of linear expansion a in a direction of the molecular orientation axis and a coefficient of linear expansion b in a direction perpendicular to the molecular orientation axis are measured in the temperature range of 100° C. to 200° C., a and b satisfy a particular relationship across the entire width, or a polyimide film produced by a continuous process, wherein when a tear propagation resistance c in the direction of the molecular orientation axis and a tear propagation resistance d in the direction perpendicular to the molecular orientation axis are measured, c and d satisfy a particular relationship across the entire width.
摘要翻译：在聚酰亚胺膜上进行金属层叠工序的步骤中，尺寸变化减小的聚酰亚胺膜或蚀刻金属层以形成配线的工序，整个宽度的尺寸变化率均可稳定提供。该目的可以通过由连续方法制造的聚酰亚胺膜来解决，其中当在分子取向轴的方向上的线性膨胀系数a和与分子取向轴垂直的方向上的线性膨胀系数b测量在 100℃至200℃的温度范围，a和b满足整个宽度的特定关系，或通过连续方法制备的聚酰亚胺膜，其中当分子取向方向上的抗撕裂传播阻力c 轴和在与分子取向轴垂直的方向上的撕裂传播阻力d，c和d在整个宽度上满足特定的关系。

10. 发明授权

US07691961B2 Polyimide film and use thereof 有权
标题翻译：聚酰亚胺膜及其用途
公开(公告)号：US07691961B2
公开(公告)日：2010-04-06
申请号：US11513353
申请日：2006-08-31
申请人： Kan Fujihara , Kazuhiro Ono , Takaaki Matsuwaki
发明人： Kan Fujihara , Kazuhiro Ono , Takaaki Matsuwaki
IPC分类号： C08G73/10
CPC分类号： B32B15/08 , B29C55/143 , B29D7/01 , B29K2079/08 , B32B27/281 , B32B27/34 , B32B2038/0088 , B32B2307/514 , B32B2309/02 , C08J5/18 , C08J2379/08 , H05K1/0271 , H05K1/0346 , H05K3/022 , H05K2201/0154 , H05K2201/068 , H05K2203/1545 , Y10T428/24917 , Y10T428/31681 , Y10T428/31721
摘要： A polyimide film in which the dimensional change is reduced when it has undergone a step of laminating a metal on the polyimide film or a step of etching the metal layer to form wiring, and the rate of dimensional change can be stabilized across the entire width is provided. The object can be solved by a polyimide film produced by a continuous process, wherein when a coefficient of linear expansion a in a direction of the molecular orientation axis and a coefficient of linear expansion b in a direction perpendicular to the molecular orientation axis are measured in the temperature range of 100° C. to 200° C., a and b satisfy a particular relationship across the entire width, or a polyimide film produced by a continuous process, wherein when a tear propagation resistance c in the direction of the molecular orientation axis and a tear propagation resistance d in the direction perpendicular to the molecular orientation axis are measured, c and d satisfy a particular relationship across the entire width.
摘要翻译：在聚酰亚胺膜上进行金属层叠工序的步骤中，尺寸变化减小的聚酰亚胺膜或蚀刻金属层而形成配线的工序，能够使整个宽度的尺寸变化率稳定化提供。该目的可以通过由连续方法制造的聚酰亚胺膜来解决，其中当在分子取向轴的方向上的线性膨胀系数a和与分子取向轴垂直的方向上的线性膨胀系数b测量在 100℃至200℃的温度范围，a和b满足整个宽度的特定关系，或通过连续方法制备的聚酰亚胺膜，其中当分子取向方向上的抗撕裂传播阻力c 轴和在与分子取向轴垂直的方向上的撕裂传播阻力d，c和d在整个宽度上满足特定的关系。

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