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1. 发明授权

US5382333A Process for producing copper clad laminate 失效
标题翻译：生产覆铜层压板的工艺
公开(公告)号：US5382333A
公开(公告)日：1995-01-17
申请号：US950757
申请日：1992-09-24
申请人： Kazuhiro Ando , Takamasa Kawakami , Yasuhiro Shouji , Yasuo Tanaka , Takeo Kanaoka , Norio Sayama
发明人： Kazuhiro Ando , Takamasa Kawakami , Yasuhiro Shouji , Yasuo Tanaka , Takeo Kanaoka , Norio Sayama
IPC分类号： C23C22/63 , C23C22/83 , H05K3/38 , H05K3/46 , C25F5/00
CPC分类号： C23C22/83 , C23C22/63 , H05K3/385 , H05K2201/0355 , H05K2203/0315 , H05K2203/1157 , H05K3/4611
摘要： A process for producing a copper-clad laminate using a copper foil obtained by subjecting the surface of the copper foil to chemical oxidation thereby to form, on the surface, a fine roughness constituted by a copper oxide of a brown to black color and then reducing the copper oxide constituting the fine roughness in an atmosphere in which a reducing gas is present.
摘要翻译：一种使用铜箔制造覆铜层压板的方法，其通过使铜箔的表面进行化学氧化，从而在表面上形成由褐色至黑色的氧化铜构成的微细粗糙度，然后还原在存在还原气体的气氛中构成微细粗糙度的氧化铜。

2. 发明授权

US5252355A Process for producing multilayered printed board 失效
标题翻译：制造多层印刷电路板的方法
公开(公告)号：US5252355A
公开(公告)日：1993-10-12
申请号：US738013
申请日：1991-07-30
申请人： Kazuhiro Ando , Takamasa Kawakami , Yasuhiro Shouji , Yasuo Tanaka , Takeo Kanaoka , Norio Sayama
发明人： Kazuhiro Ando , Takamasa Kawakami , Yasuhiro Shouji , Yasuo Tanaka , Takeo Kanaoka , Norio Sayama
IPC分类号： H05K3/38 , H05K3/46 , C23C26/00
CPC分类号： H05K3/385 , H05K2203/0315 , H05K2203/1157 , H05K3/4611
摘要： A process for producing a multilayered printed circuit board which comprises using, as an intermediate layer, an inner-layer board obtained by chemically oxidizing the surface of a copper foil constituting an outermost layer of an inner-layer board having a printed circuit formed in the copper foil, thereby to form on the surface a finely roughened layer constituted by a copper oxide of a brown to black color, and then reducing the copper oxide constituting the finely roughened layer in an atmosphere in which a reducing gas is present.

3. 发明授权

US5173150A Process for producing printed circuit board 失效
标题翻译：生产印刷电路板的工艺
公开(公告)号：US5173150A
公开(公告)日：1992-12-22
申请号：US689428
申请日：1991-04-23
申请人： Takeo Kanaoka , Norio Sayama
发明人： Takeo Kanaoka , Norio Sayama
IPC分类号： H05K1/02 , H05K1/09 , H05K1/16 , H05K1/18 , H05K3/22 , H05K3/46 , H05K9/00
CPC分类号： H05K3/4697 , H05K1/0218 , H05K1/167 , H05K1/183 , H05K3/4673 , H05K9/0039 , H05K1/095 , H05K2201/0376 , H05K2201/0715 , H05K2203/0278 , H05K2203/1453 , H05K3/22 , H05K3/4644 , Y10T29/49155 , Y10T29/49158
摘要： A process for producing a printed circuit board which can mainly shield electromagnetic waves generated therefrom, a printed circuit board having printed thereon printed devices, a multilayered printed circuit board, or a printed circuit board for mounting chip devices, all of which have high reliability, using a printed circuit board obtained by preparing a semicured resin-based copper-clad laminate by continuous pressing by means of a double-belt pressing method or a batch-wise continuous pressing in which one laminate is produced by press molding between a pair of hot platens, the semicured resin-based copper-clad laminate having a copper foil peel strength of 0.2 kg/cm or more, preferably 0.3 kg/cm or more, and 90% or less of the peel strength thereof as measured after the resin is completely cured, subsequently forming a predetermined printed circuit by etching, and then pressing the resulting semicured resin-based printed circuit board, thereby to exist the conductor surface on almost the same level with the substrate surface.
摘要翻译：一种能够主要屏蔽由其产生的电磁波的印刷电路板的制造方法，印刷有印刷装置的印刷电路板，多层印刷电路板或用于安装芯片装置的印刷电路板，所有这些都具有高可靠性，使用通过双层压制法或间歇式连续压制法连续压制制备半固化树脂基覆铜层压板而获得的印刷电路板，其中通过在一对热压板，半导体树脂系覆铜层压板，其树脂完全在铜箔剥离强度为0.2kg / cm以上，优选为0.3kg / cm以上，剥离强度为90％以下固化，随后通过蚀刻形成预定的印刷电路，然后压制所得的半固化树脂基印刷电路板，从而将导体表面存在于与基材表面几乎相同。

4. 发明授权

US06594892B2 Process for the production of composite ceramic printed wiring board 失效
标题翻译：复合陶瓷印刷线路板生产工艺
公开(公告)号：US06594892B2
公开(公告)日：2003-07-22
申请号：US09920636
申请日：2001-08-03
申请人： Kazuyuki Ohya , Norio Sayama , Takeshi Nobukuni
发明人： Kazuyuki Ohya , Norio Sayama , Takeshi Nobukuni
IPC分类号： H05K302
CPC分类号： H05K3/0011 , H05K1/0306 , H05K3/4046 , H05K3/4053 , H05K3/4629 , H05K2201/0116 , H05K2203/1147 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156 , Y10T29/49163 , Y10T29/49165
摘要： A process for the production of a composite ceramic printed wiring board, comprising (1) making a penetration hole having a diameter of 0.1 to 0.8 mm in a ceramic board having an open porosity of at least 5% and a thickness of 0.1 to 10 mm, (2) fixing metal (M) to the penetration hole such that the metal (M) penetrates through the penetration hole, (3) impregnating a heat-resistant resin precursor (R) under vacuum, polymerizing the heat-resistant resin precursor (R) and polishing both surfaces of the resultant board to produce a resin composite ceramic substrate (MRA) having a conductive portion for conduction between both surfaces in a predetermined portion, and (4) forming printed wiring networks on one or both surfaces of the resin composite ceramic substrate (MRA).
摘要翻译：一种复合陶瓷印刷线路板的制造方法，其特征在于，具有（1）在开孔率为5％以上且厚度为0.1〜10mm的陶瓷板中制作直径为0.1〜0.8mm的贯通孔，（2）将金属（M）固定在贯通孔上，使得金属（M）穿透穿透孔，（3）在真空下浸渍耐热树脂前体（R），聚合耐热性树脂前体（ R）并抛光所得板的两个表面以制备具有用于在预定部分中在两个表面之间导电的导电部分的树脂复合陶瓷基板（MRA），以及（4）在树脂的一个或两个表面上形成印刷布线网络复合陶瓷基板（MRA）。

5. 发明授权

US5314740A Base board for printed circuit board 失效
标题翻译：印刷电路板基板
公开(公告)号：US5314740A
公开(公告)日：1994-05-24
申请号：US935245
申请日：1992-08-27
申请人： Kenji Ishii , Yoshinori Kondo , Hiroyuki Matsumoto , Norio Sayama
发明人： Kenji Ishii , Yoshinori Kondo , Hiroyuki Matsumoto , Norio Sayama
IPC分类号： C09K11/06 , H05K1/02 , H05K1/03 , B32B9/00
CPC分类号： C09K11/06 , H05K1/0269 , H05K1/0373 , H05K2203/122 , H05K2203/161 , Y10S428/901 , Y10T428/24917
摘要： A base board for a printed circuit board panel which permits easy inspection of a printed circuit by means of a fluorescence-applied circuit pattern inspection machine used for the inspection of printed circuit patterns and which is not altered in the properties as a printed circuit board, the base board having an insulating layer containing 5.0 to 0.00001% by weight of a compound of any one of the formulae (1), (2) and (3), ##STR1##
摘要翻译：一种用于印刷电路板面板的基板，其允许通过用于检查印刷电路图案并且在作为印刷电路板的性质中没有改变的荧光施加电路图案检查机器来容易地检查印刷电路，所述基板具有绝缘层，所述绝缘层含有式（1），（2）和（3）中任何一个的化合物的5.0至0.00001重量％，图像（1）（3）

6. 发明授权

US5266385A Printed circuit comprising novel compounds as fluorescence means to control circuit quality 失效
标题翻译：包含新化合物的印刷电路作为控制电路质量的荧光装置
公开(公告)号：US5266385A
公开(公告)日：1993-11-30
申请号：US911934
申请日：1992-07-10
申请人： Kenji Ishii , Yoshinori Kondo , Hiroyuki Matsumoto , Norio Sayama
发明人： Kenji Ishii , Yoshinori Kondo , Hiroyuki Matsumoto , Norio Sayama
IPC分类号： C08K5/1545 , C08K5/3465 , C08K5/45 , H01B3/30 , H05K1/02 , H05K1/03 , B32B9/00
CPC分类号： H01B3/30 , C08K5/1545 , C08K5/3465 , C08K5/45 , H05K1/0269 , H05K1/0373 , H05K2203/122 , H05K2203/161 , Y10S428/901 , Y10T428/24917 , Y10T428/31678
摘要： A base board for a printed circuit board having a printed circuit formed from a copper foil on an insulating layer, the insulating layer containing a compound of the formula (1) or a compound of the formula (2). ##STR1##

7. 发明授权

US4653268A Regenerative gas turbine cycle 失效
标题翻译：再生燃气轮机循环
公开(公告)号：US4653268A
公开(公告)日：1987-03-31
申请号：US741729
申请日：1985-06-06
申请人： Hiromi Nakamura , Takehiko Takahashi , Norio Narazaki , Kazuo Yamamoto , Norio Sayama
发明人： Hiromi Nakamura , Takehiko Takahashi , Norio Narazaki , Kazuo Yamamoto , Norio Sayama
IPC分类号： F01K21/04 , F02C7/143 , F02C3/30
CPC分类号： F02C7/143 , F01K21/047 , Y02E20/16
摘要： In a regenerative gas turbine cycle in which heat recovery is carried out by multi-phase and multi-component mixture of compressed air/liquid phase water/steam (hereinafter referred to as MPC mixture), said mixture being obtained by injection of liquid phase water (hereinafter referred to simply as water) into a part of or the whole of compressed gas using air or air based gas (hereinafter referred to as air) as a combustion supporting/working medium gas; the improvement comprising(a) intercooling of said compressor, and/or(b) precooling of the compressed air for producing the MPC mixtureby a part of the MPC mixture.
摘要翻译：在通过压缩空气/液相水/蒸汽的多相和多组分混合物（以下称为MPC混合物）进行热回收的再生燃气轮机循环中，所述混合物通过注入液相水（以下简称为水）成为使用空气或空气的气体（以下称为空气）作为燃烧支撑/作业介质气体的压缩气体的一部分或全部; 所述改进包括（a）所述压缩机的中间冷却和/或（b）用于由MPC混合物的一部分产生MPC混合物的压缩空气的预冷却。

8. 发明授权

US4610137A Regenerative gas turbine cycle 失效
标题翻译：再生燃气轮机循环
公开(公告)号：US4610137A
公开(公告)日：1986-09-09
申请号：US744238
申请日：1985-06-13
申请人： Hiromi Nakamura , Takehiko Takahashi , Norio Narazaki , Kazuo Yamamoto , Norio Sayama
发明人： Hiromi Nakamura , Takehiko Takahashi , Norio Narazaki , Kazuo Yamamoto , Norio Sayama
IPC分类号： F01K21/04 , F02C7/143 , F02C7/16 , F02C3/30
CPC分类号： F02C7/143 , F01K21/047 , F02C7/16 , F05D2260/211 , Y02E20/16
摘要： A regenerative gas turbine cycle wherein heat recovery is carried out by a mixture of air/steam which is obtained by contact between water and compressed air, the compressed air being compressed by a compressor for compressing gas using air or air based gas as a combustion supporting/working medium gas. The cycle includes the improvement whereby mixture of air/steam and liquid phase cooled water is obtained through contact between the compressed air and heated water which is used as heat recovering medium; the cooled water being used as heat recovering medium not only for heat recovery of turbine exhaust gas but also, for(a) intercooling of the compressor, and/or(b) precooling of compressed air for the contact operation.Water corresponding to the amount of water which contacts the compressed air and is lost by evaporation is added to the liquid phase water for contact or heat recovery as it is or after use as a heat recovering medium.

9. 发明授权

US4537023A Regenerative gas turbine cycle 失效
标题翻译：再生燃气轮机循环
公开(公告)号：US4537023A
公开(公告)日：1985-08-27
申请号：US448322
申请日：1982-12-09
申请人： Hiromi Nakamura , Takehiko Takahashi , Norio Narazaki , Kazuo Yamamoto , Norio Sayama
发明人： Hiromi Nakamura , Takehiko Takahashi , Norio Narazaki , Kazuo Yamamoto , Norio Sayama
IPC分类号： F01K21/04 , F02C7/143 , F02C7/16 , F02C7/00
CPC分类号： F02C7/143 , F01K21/047 , F02C7/16 , F05D2260/211 , Y02E20/16
摘要： In a regenerative gas turbine cycle in which heat recovery is carried out by a mixture of air/steam which is obtained by contact between water and a part of or the whole of compressed air, said compressed air being compressed by a compressor for compressing gas using air or air based gas as a combustion supporting/working medium gas; the improvement comprising: the mixture of air/steam and liquid phase cooled water being obtained through the contact between the compressed air and heated water which is used as heat recovering medium; said cooled water being used as heat recovering medium not only for heat recovery of turbine exhaust gas but also, for(a) intercooling of the compressor, and/or(b) precooling of compressed air for the contact operation;supplying water corresponding to the amount of water which contacts the compressed air and is lost by evaporation to the liquid phase water for contact or heat recovery as it is or after using as a heat recovering medium.
摘要翻译：在通过水与一部分或全部压缩空气接触获得的空气/蒸汽的混合物进行热回收的再生式燃气轮机循环中，所述压缩空气被压缩机压缩，用于压缩气体，使用空气或空气基气体作为燃烧支持/工作介质气体; 该改进包括：通过压缩空气和用作热回收介质的加热水之间的接触获得空气/蒸汽和液相冷却水的混合物; 所述冷却水不仅用于热回收涡轮废气，而且还用于（a）压缩机的中间冷却和/或（b）用于接触操作的压缩空气的预冷却; 将与压缩空气接触的水量相应地蒸发的水相当于作为热回收介质的使用时或作为热回收介质使用后，向蒸发的液相水供给接触或热回收。

10. 发明授权

US6113730A Metal-foil-clad composite ceramic board and process for the production thereof 失效
标题翻译：金属箔复合陶瓷板及其制造方法
公开(公告)号：US6113730A
公开(公告)日：2000-09-05
申请号：US873398
申请日：1997-06-12
申请人： Kazuyuki Ohya , Norio Sayama
发明人： Kazuyuki Ohya , Norio Sayama
IPC分类号： H01L21/48 , H01L23/15 , H05K1/03 , H05K3/02 , C09J5/02
CPC分类号： H05K3/022 , H01L21/4846 , H01L23/15 , H05K1/0306 , H05K1/0353 , H01L2924/0002 , H01L2924/09701 , H01L2924/13055 , H01L2924/1423 , H01L2924/1433 , H05K2201/0116 , H05K2201/0355 , H05K3/4629 , Y10S428/901 , Y10S428/94 , Y10T428/266 , Y10T428/31
摘要： A metal-foil-clad composite ceramic board produced by impregnating a sintered substrate (II) of an inorganic continuously porous sintered body (I) having a true porosity of 12 to 50% and an open porosity of at least 10%, with a thermosetting resin (R) under vacuum, to form a resin-imprgnated sintered substrate (IIR), stacking a metal foil on the resin-impregnated sintered substrate (IIR) and press-forming the resultant laminate, wherein the stacked metal foil has a 10-point average surface roughness Rz of 10 .mu.m or less, and the resin-impregnated sintered substrate (IIR) and the metal foil have substantially no adhesive layer therebetween or have an adhesive layer having a thickness of 10 .mu.m or less therebetween.
摘要翻译：一种金属箔复合陶瓷板，其通过将具有12-50％的真实孔隙率和至少10％的开孔率的无机连续多孔烧结体（I）的烧结基材（II）树脂（R）在真空下形成树脂发泡烧结基板（IIR），在浸渍了树脂的烧结基板（IIR）上堆叠金属箔并压制成形的层压板，其中堆叠的金属箔具有10- 点平均表面粗糙度Rz为10μm以下，树脂浸渍烧结基板（IIR）和金属箔之间基本上没有粘合剂层，或者具有厚度为10μm以下的粘合剂层。

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