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1. 发明授权

US5188799A Wear-resistant copper-base alloy 失效
标题翻译：耐磨铜合金
公开(公告)号：US5188799A
公开(公告)日：1993-02-23
申请号：US854557
申请日：1992-03-19
申请人： Kazuhiko Mori , Minoru Kawasaki , Shin Yoshida , Hiroyuki Murase , Takashi Saito , Kouji Tanaka , Yoshio Shimura
发明人： Kazuhiko Mori , Minoru Kawasaki , Shin Yoshida , Hiroyuki Murase , Takashi Saito , Kouji Tanaka , Yoshio Shimura
IPC分类号： C22C1/10 , B23K35/30 , C22C9/06 , C22C29/18 , C22C32/00
CPC分类号： B23K35/302 , B23K35/0244 , B23K35/0255 , B23K35/0261 , B23K35/30 , C22C9/06
摘要： A wear-resistant copper-base alloy having superior self-lubricity includes, by weight %,Ni: 10.0 to 30.0%;Si: 0.5 to 3%;Co: 2.0 to 15.0%;at least one metal selected from the group consisting of Mo, W, Nb and V:2.0 to 15.0%; andthe balance being Cu and unavoidable impurities, and having a structure in which hard phase grains containing 5 vol% or more of silicide of at least one metal selected from the group consisting of Mo, W, Nb and V are uniformly dispersed in an amount of 10 to 60 vol% in a copper-rich matrix, to which 2.0 to 15.0% of Fe and/or 1.0 to 10.0% of Cr may be further added.

2. 发明授权

US5082625A Corrosion-resistant alloy for build-up welding 失效
标题翻译：耐腐蚀合金，用于堆焊
公开(公告)号：US5082625A
公开(公告)日：1992-01-21
申请号：US446818
申请日：1989-12-06
申请人： Sinji Kato , Soya Takagi , Minoru Kawasaki , Kazuhiko Mori , Katsuhiko Ueda
发明人： Sinji Kato , Soya Takagi , Minoru Kawasaki , Kazuhiko Mori , Katsuhiko Ueda
IPC分类号： B23K35/30 , C22C19/03 , C22C19/05 , F02B3/06
CPC分类号： C22C19/056 , B23K35/3033 , B23K35/304 , C22C19/05 , F02B3/06
摘要： Herein disclosed, as a Ni-based corrosion-resistant alloy to be used for build-up welding, is an alloy which contains 0.5 to 2.3 wt % of copper, 0.1 to 5.3 wt % of molybdenum, 1.0 to 29.0 wt % of at least one carbide forming element except molybdenum, 1.0 to 30.0 wt % of iron, 0.6 to 2.5 wt % of silicon, 0.008 up to 1.0 wt % of boron, and 0.04 to 1.6 wt % of carbon, the remainder being composed of nickel and incidental impurities.
摘要翻译：作为用于堆焊的Ni系耐腐蚀合金，本文公开的是含有0.5〜2.3重量％的铜，0.1〜5.3重量％的钼，1.0〜29.0重量％的至少一个碳化物形成元素除了钼，1.0-30.0重量％的铁，0.6-2.5重量％的硅，0.008至1.0重量％的硼和0.04-1.6重量％的碳，其余由镍和偶然的杂质组成。

3. 发明授权

US4832982A Laser process for forming dispersion alloy layer from powder on metallic base 失效
标题翻译：用于从金属基底上的粉末形成分散合金层的激光工艺
公开(公告)号：US4832982A
公开(公告)日：1989-05-23
申请号：US129303
申请日：1987-12-07
申请人： Kazuhiko Mori , Katsuhiko Ueda , Soya Takagi , Minoru Kawasaki
发明人： Kazuhiko Mori , Katsuhiko Ueda , Soya Takagi , Minoru Kawasaki
IPC分类号： B23K26/00 , B23K26/08 , B23K26/34 , C23C24/10 , C23C26/00 , C23C26/02
CPC分类号： B23K26/34 , B22F3/1055 , B22F7/062 , B23K26/32 , B23K35/0244 , B23K35/302 , C22C9/00 , C22C9/06 , C22F1/08 , C23C24/103 , B23K2201/005 , B23K2203/04 , B23K2203/06 , B23K2203/10 , B23K2203/12 , B23K2203/18 , B23K2203/50 , C22C32/0047 , Y02P10/295 , Y10S148/903 , Y10T428/12083 , Y10T428/12097 , Y10T428/12139 , Y10T428/12903
摘要： Herein disclosed is a process for forming a dispersion alloy layer on a metallic base. The powder of an alloy system, which will separate into two or more multi-liquid phases at a temperature equal to or higher than its melting point and will solidify, when quenched, with its individual liquid phases being separate and in which the ratio of the minimum to the maximum specific weight its individual liquid phases is 0.3 or higher, such as the powder of any alloy system of Cu-Ni(15%)-Fe(8%)-Si(3%)-B(1.5%) is applied to a metallic base. The powder thus applied is then melting and agitated while being irradiated with a laser beam oscillated. The agitated melt of the powder is then quenched to solidify with the movement of the laser beam thereby to form on the metallic base the dispersion alloy layer in which the solid particles of at least one of those phase such as silicide particles are dispersed in the matrix of the remaining one of the phases.
摘要翻译：本文公开了一种在金属基底上形成分散合金层的方法。合金系统的粉末，其将在等于或高于其熔点的温度下分离成两个或多个多液相，并且在淬火时将其固化，其各个液相是分离的，其中例如Cu-Ni（15％） - Fe（8％） - Si（3％） - B（1.5％）的任何合金体系的粉末，其单个液相的最大比重最小为0.3或更高。应用于金属基底。然后将如此施加的粉末熔融并搅拌，同时用激光束照射振荡。然后将粉末的搅拌的熔体随着激光束的移动淬火以固化，从而在金属基底上形成分散合金层，其中至少一个相的硅固体颗粒如硅化物颗粒分散在基体中剩下的一个阶段。

4. 发明授权

US5172261A Oscillatory mirror device with two exciting means 失效
标题翻译：具有两种兴奋手段的振荡镜
公开(公告)号：US5172261A
公开(公告)日：1992-12-15
申请号：US782342
申请日：1991-10-24
申请人： Shinji Kato , Soya Takagi , Kazuhiko Mori , Minoru Kawasaki , Yuichi Minami
发明人： Shinji Kato , Soya Takagi , Kazuhiko Mori , Minoru Kawasaki , Yuichi Minami
IPC分类号： G02B26/10 , B06B1/04 , B23K26/06 , G02B7/182
CPC分类号： B06B1/045 , G02B7/1821
摘要： An oscillatory mirror device having a mirror and a pair of exciting systems to exert a couple of forces to turn the mirror around an axis of oscillation in an oscillating manner.
摘要翻译：一种具有镜子和一对激励系统的振荡镜装置，用于施加一定的力以以振荡方式围绕振荡轴转动反射镜。

5. 发明授权

US5004581A Dispersion strengthened copper-base alloy for overlay 失效
标题翻译：分散强化用于覆盖层的铜基合金
公开(公告)号：US5004581A
公开(公告)日：1991-04-02
申请号：US559941
申请日：1990-07-30
申请人： Soya Takagi , Kazuhiko Mori , Minoru Kawasaki , Shinji Kato
发明人： Soya Takagi , Kazuhiko Mori , Minoru Kawasaki , Shinji Kato
IPC分类号： B23K35/30 , C22C9/06 , C22C9/10
CPC分类号： F16C33/124 , B23K35/302 , C22C9/06 , C22C9/10 , F16C33/121 , F16C2204/10 , F16C2223/46
摘要： A dispersion strengthened Cu (copper)-base alloy for a wear-resistant overlay formed on a metal substrate consists essentially of, by weight %,Ni: 5 to 30%;B: 0.5 to 3%;Si: 1 to 5%;Fe: 4 to 30%;Sn: 3 to 15% and/or An: 3 to 30%; andthe remainder being Cu and unavoidable impurities, and has a structure in which particles of boride and silicide of the Fe-Ni system are dispersed in a Cu-base matrix, and Cu-base primary crystals contain Sn and/or Zn in a solid solution state. If necessary, 0.1 to 5% of Al, 0.1 to 5% of Ti, and/or 1 to 10% of Mn may be added. 0.02 to 2% of C, and 0.1 to 10% of Cr and/or 0.3 to 5% of Ti may be further added. Instead of or along with Sn and/or Zn, 2 to 20% of Pb can be used, and nonsoluble Pb particles are uniformly dispersed between Cu-base .alpha. phase dendrites and serve as a solid lubricant.

6. 发明授权

US4818307A Dispersion strengthened copper-base alloy 失效
标题翻译：分散强化铜基合金
公开(公告)号：US4818307A
公开(公告)日：1989-04-04
申请号：US133620
申请日：1987-12-16
申请人： Kazuhiko Mori , Katsuhiko Ueda , Soya Takagi , Minoru Kawasaki
发明人： Kazuhiko Mori , Katsuhiko Ueda , Soya Takagi , Minoru Kawasaki
IPC分类号： C22C9/06 , B23K35/30 , C22C9/00 , C22C32/00 , C23C24/10 , C22C9/02
CPC分类号： C23C24/103 , B23K35/302 , C22C32/0078 , Y10T428/12486
摘要： Herein disclosed is a dispersion strengthened copper-base alloy having an excellent wear resistance, which alloy contains 5 to 30% (in weight) of nickel, 1 to 5% of silicon, 0.5 to 3% of boron and 4 to 30% of iron, the remainder being copper and unavoidable impurities, and having a structure in which hard particles composed chiefly of a silicide of iron-nickel system are dispersed in a copper-base matrix. The copper-base alloy is suitably cladded (or deposited) locally on a metallic base. The alloy may contain at least one of 0.1 to 5% of aluminum, 0.1 to 5% of Ti and 1 to 10% of Mn, if necessary, in addition to the above specified components. If necessary, 0.02 to 2% of carbon and 0.5 to 10% of chromium and/or 0.3 to 5% of titanium may be further added. Then, the structure is modified such that both the particles composed chiefly of the iron-nickel silicide and carbide particles are coexistently dispersed in the copper-base matrix.
摘要翻译：本文公开了具有优异耐磨性的分散强化铜基合金，该合金含有镍的5〜30重量％（重量），硅的1〜5％，硼的0.5〜3％，铁的4〜30％其余为铜和不可避免的杂质，并且具有其中主要由铁 - 镍系统的硅化物组成的硬颗粒分散在铜基体中的结构。铜基合金适当地在金属基底上包层（或沉积）。如果需要，除了上述规定的成分之外，合金还可含有0.1〜5％的铝，0.1〜5％的Ti和1〜10％的Mn中的至少1种。如果需要，可以进一步加入0.02〜2％的碳和0.5〜10％的铬和/或0.3〜5％的钛。然后，对该结构进行改性，使得主要由铁 - 镍硅化物和碳化物颗粒组成的颗粒两者共同分散在铜基体中。

7. 发明授权

US4725708A Method for padding a copper type alloy material upon a base of aluminum type metal using laser beam oscillating transversely to its tracking direction 失效
标题翻译：使用横向于其跟踪方向振荡的激光束将铜合金材料填充到铝型金属基底上的方法
公开(公告)号：US4725708A
公开(公告)日：1988-02-16
申请号：US885678
申请日：1986-07-15
申请人： Minoru Kawasaki , Kazuhiko Mori
发明人： Minoru Kawasaki , Kazuhiko Mori
IPC分类号： B23K26/00 , B22F3/105 , B23K26/32 , B23K26/34 , B23K35/30 , B29C67/00 , C23C26/00
CPC分类号： C23C26/00 , B22F3/1055 , B23K26/32 , B23K26/34 , B23K35/302 , B29C67/0077 , B23K2203/10 , B23K2203/12 , B23K2203/18 , Y02P10/295
摘要： In this method for padding, a layer of a copper type alloy material in powdered form is laid upon a portion of a base of aluminum type metal which is to be padded. Then a laser beam, concentrated to a spot from about 0.5 mm to about 2.0 mm in diameter with an output density of from about 80 watt/mm.sup.2 to about 20,000 watt/mm.sup.2, is irradiated upon this layer of powdered copper type alloy material upon the base of aluminum type metal. The laser beam and the base of aluminum type metal are relatively moved in a relative longitudinal direction at a longitudinal speed of from about 100 mm per minute to about 3000 mm per minute; and they are also reciprocatingly moved in a relative direction substantially transverse to the longitudinal direction at an transverse oscillating frequency of above about 80 Hz. Thereby, good padding efficiency is obtained. The copper type alloy material may initially be applied as a powder including a binder and then be dried, before the laser irradiation; or it may be applied automatically substantially during the laser irradiation.
摘要翻译：在这种填充方法中，将要填充的铝型金属的基底的一部分放置成粉末状的铜合金材料层。然后将激光束集中到直径为约0.5mm至约2.0mm的点，输出密度为约80瓦特/平方米至约20,000瓦特/平方毫米，照射在该层粉末状铜合金材料上铝型金属基座。激光束和铝型金属基体在相对纵向方向上以约100mm /分钟的纵向速度相对移动至约3000mm /分钟; 并且它们也在基本上横向于纵向的相对方向上以高于约80Hz的横向振荡频率往复运动。从而获得良好的填充效率。铜类合金材料可以在激光照射之前最初作为包括粘合剂的粉末施加，然后被干燥; 或者可以在激光照射期间基本上自动施加。

8. 发明授权

US5104748A Wear resisting copper base alloy 失效
标题翻译：耐磨铜基合金
公开(公告)号：US5104748A
公开(公告)日：1992-04-14
申请号：US492359
申请日：1990-03-09
申请人： Kazuhiko Mori , Soya Takagi , Minoru Kawasaki , Shinji Kato
发明人： Kazuhiko Mori , Soya Takagi , Minoru Kawasaki , Shinji Kato
IPC分类号： C22C9/00 , B23K35/30 , B23K35/32 , C22C9/06 , C22C30/00 , C22C32/00 , C22F1/00 , C22F1/08
CPC分类号： C22C9/06 , B23K35/302 , B23K35/327 , C22C32/00 , Y10T428/12903
摘要： A copper base alloy exhibits improved wear resistance particularly at elevated temperatures, which consists essentially of, in percent by weight, 10-40% of Ni, 1-7% of Si, 0.5-5% of B, 1-20% of Cr, and the balance of Cu, wherein particles of at least one of chromium boride and chromium silicide having a size of about 0.1 to about 50 .mu.m are evenly dispersed in a copper-nickel base matrix. The alloy may further contain W, Mo or Fe and/or a high-melting carbide such as WC and TaC.

9. 发明授权

US5230756A Method of forming weld bead of pure copper on ferroalloy base material 失效
标题翻译：纯铜基体焊丝的方法
公开(公告)号：US5230756A
公开(公告)日：1993-07-27
申请号：US680062
申请日：1991-04-03
申请人： Minoru Kawasaki , Soya Takagi , Shinji Kato , Kazuhiko Mori , Yasuo Kotetsu
发明人： Minoru Kawasaki , Soya Takagi , Shinji Kato , Kazuhiko Mori , Yasuo Kotetsu
IPC分类号： B23K26/00 , B23K9/04 , B23K15/00 , B23K26/34 , B23K35/30
CPC分类号： B23K9/04 , B23K15/0086 , B23K26/32 , B23K26/342 , B23K35/004 , B23K35/30 , B23K35/302 , C22C9/06 , B23K2203/50
摘要： In forming a weld bead of pure copper on a ferroalloy base material by laying a powder of copper and melting the powder by a high density energy source such as laser beams, TIG arc or electron beams, the powder of copper is beforehand mixed with a powder of an auxiliary metal having a higher melting point than pure copper. In order to ensure the substantial purity in copper of the weld bead, the powder mixture should not include more than 16 wt % nickel.

10. 发明授权

US4746540A Method for forming alloy layer upon aluminum alloy substrate by irradiating with a CO.sub.2 laser, on substrate surface, alloy powder containing substance for alloying and silicon or bismuth 失效
标题翻译：通过用CO2激光照射，在基板表面上合成含合金粉末的合金粉末和硅或铋来形成合金层的方法
公开(公告)号：US4746540A
公开(公告)日：1988-05-24
申请号：US894941
申请日：1986-08-08
申请人： Minoru Kawasaki , Soya Takagi , Kazuhiko Mori , Shinji Kato
发明人： Minoru Kawasaki , Soya Takagi , Kazuhiko Mori , Shinji Kato
IPC分类号： B23K35/28 , B05D3/06
CPC分类号： B23K35/286
摘要： In this method for forming an alloy layer on the surface of an aluminum alloy substrate, a powder for alloying, containing a substance to be alloyed with the substrate and an element selected from the group consisting of silicon and bismuth, is disposed upon the surface of the aluminum alloy substrate. This powder is then irradiated with a CO.sub.2 laser, so as to be melted and fused together with a surface portion of the aluminum alloy substrate, so that these two are alloyed together. The powder for alloying may be a powder of an alloy of the substance to be alloyed with the aluminum alloy substrate and the element selected from the group consisting of silicon and bismuth, or alternatively may be a mixture of a powder of the substance to be alloyed with the aluminum alloy substrate and a powder of the element selected from the group consisting of silicon and bismuth.
摘要翻译：在这种在铝合金基板的表面上形成合金层的方法中，将含有与基板合金的物质和选自硅和铋的元素合金化的粉末设置在铝合金基板。然后将该粉末用CO 2激光器照射，以与铝合金基材的表面部分熔融并熔合在一起，使得这两种合金化在一起。用于合金化的粉末可以是与铝合金基材合金物质和选自硅和铋的元素的合金的粉末，或者可以是待合金物质的粉末的混合物与铝合金基板和选自硅和铋的元素的粉末。

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