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1. 发明授权

US08187664B2 Metallic pattern forming method, metallic pattern obtained thereby, printed wiring board using the same, and TFT wiring board using the same 失效
标题翻译：金属图案形成方法，由此获得的金属图案，使用该金属图案的印刷线路板以及使用该图案的TFT布线板
公开(公告)号：US08187664B2
公开(公告)日：2012-05-29
申请号：US11815609
申请日：2006-02-08
申请人： Kazuhiko Matsumoto , Koichi Kawamura , Takeyoshi Kano
发明人： Kazuhiko Matsumoto , Koichi Kawamura , Takeyoshi Kano
IPC分类号： B05D5/12
CPC分类号： C23C18/1608 , C23C18/1653 , C23C18/2086 , C23C18/30 , H05K3/182 , H05K3/387 , H05K2203/0545
摘要： The invention provides a method of forming a metallic pattern including: (a) forming, in a pattern form on a substrate, a polymer layer which contains a polymer that has a functional group that interacts with an electroless plating catalyst or a precursor thereof; (b) imparting the electroless plating catalyst or precursor thereof onto the polymer layer; and (c) forming a metallic film in the pattern form by subjecting the substrate having the polymer layer to electroless plating using an electroless plating solution, wherein the substrate is treated using a solution comprising a surface charge modifier or 1×10−10 to 1×10−4 mmol/l of a plating catalyst poison before or during the (c) forming of the metallic film. The invention further provides a metallic pattern obtained thereby. Furthermore, the invention provides a printed wiring board and a TFT wiring board, each of which uses the metallic pattern as a conductive layer.
摘要翻译：本发明提供一种形成金属图案的方法，包括：（a）以图案形式在基底上形成聚合物层，该聚合物层含有具有与化学镀催化剂或其前体相互作用的官能团的聚合物; （b）将化学镀催化剂或其前体赋予聚合物层; 和（c）通过使用具有聚合物层的基板进行化学镀以形成金属膜，使用化学镀溶液进行无电镀，其中使用包含表面电荷调节剂的溶液或1×10 -10至1 在（c）形成金属膜之前或期间，电镀催化剂毒素为×10-4mmol / l。本发明还提供了由此获得的金属图案。此外，本发明提供一种印刷线路板和TFT布线板，其中每个都使用金属图案作为导电层。

2. 发明申请

US20090022885A1 METALLIC PATTERN FORMING METHOD, METALLIC PATTERN OBTAINED THEREBY, PRINTED WIRING BOARD USING THE SAME, AND TFT WIRING BOARD USING THE SAME 失效
标题翻译：金属图案形成方法，获得的金属图案，使用其的印刷电路板和使用其的TFT布线板
公开(公告)号：US20090022885A1
公开(公告)日：2009-01-22
申请号：US11815609
申请日：2006-02-08
申请人： Kazuhiko Matsumoto , Koichi Kawamura , Takeyoshi Kano
发明人： Kazuhiko Matsumoto , Koichi Kawamura , Takeyoshi Kano
IPC分类号： B05D5/12
CPC分类号： C23C18/1608 , C23C18/1653 , C23C18/2086 , C23C18/30 , H05K3/182 , H05K3/387 , H05K2203/0545
摘要： The invention provides a method of forming a metallic pattern including: (a) forming, in a pattern form on a substrate, a polymer layer which contains a polymer that has a functional group that interacts with an electroless plating catalyst or a precursor thereof; (b) imparting the electroless plating catalyst or precursor thereof onto the polymer layer; and (c) forming a metallic film in the pattern form by subjecting the substrate having the polymer layer to electroless plating using an electroless plating solution, wherein the substrate is treated using a solution comprising a surface charge modifier or 1×10−10 to 1×10−4 mmol/l of a plating catalyst poison before or during the (c) forming of the metallic film. The invention further provides a metallic pattern obtained thereby. Furthermore, the invention provides a printed wiring board and a TFT wiring board, each of which uses the metallic pattern as a conductive layer.
摘要翻译：本发明提供一种形成金属图案的方法，包括：（a）以图案形式在基底上形成聚合物层，该聚合物层含有具有与化学镀催化剂或其前体相互作用的官能团的聚合物; （b）将化学镀催化剂或其前体赋予聚合物层; 和（c）通过使用具有聚合物层的基材进行化学镀以形成化学镀方法形成图案形式的金属膜，其中使用包含表面电荷调节剂的溶液或1×10 -10至1×10 -4 在（c）形成金属膜之前或期间，电镀催化剂毒素为mmol / l。本发明还提供了由此获得的金属图案。此外，本发明提供一种印刷线路板和TFT布线板，其中每个都使用金属图案作为导电层。

3. 发明授权

US07849593B2 Method of making multi-layer circuit board 失效
标题翻译：制作多层电路板的方法
公开(公告)号：US07849593B2
公开(公告)日：2010-12-14
申请号：US11628478
申请日：2005-05-31
申请人： Koichi Kawamura , Takeyoshi Kano
发明人： Koichi Kawamura , Takeyoshi Kano
IPC分类号： H05K3/02
CPC分类号： H05K3/386 , H05K3/381 , H05K3/4644 , H05K3/4652 , H05K2203/1163 , H05K2203/1168 , Y10T29/49117 , Y10T29/49155 , Y10T29/49165
摘要： The invention provides a multi-layer circuit board sequentially having an insulating substrate, a first electrically conductive pattern arbitrarily formed, an insulating material layer and a second electrically conductive pattern formed by providing an electrically conductive material on a graft polymer pattern formed on the insulating material layer, and having an electrically conductive path which electrically connects the first electrically conductive pattern present on the insulating substrate and the second electrically conductive pattern. The graft polymer pattern includes a combination of a region where a graft polymer is present and a region where no graft polymer is present, or a combination of a region where a hydrophilic graft polymer is present and a region where a hydrophobic graft polymer is present.
摘要翻译：本发明提供一种多层电路板，其顺序地具有绝缘基板，任意形成的第一导电图案，绝缘材料层和通过在形成于绝缘材料上的接枝聚合物图案上提供导电材料而形成的第二导电图案并且具有将存在于绝缘基板上的第一导电图案与第二导电图案电连接的导电路径。接枝聚合物图案包括存在接枝聚合物的区域和不存在接枝聚合物的区域的组合，或存在亲水接枝聚合物的区域和存在疏水接枝聚合物的区域的组合。

4. 发明申请

US20080029294A1 Multi-Layer Circuit Board And Production Method Thereof 失效
标题翻译：多层电路板及其制作方法
公开(公告)号：US20080029294A1
公开(公告)日：2008-02-07
申请号：US11628478
申请日：2005-05-31
申请人： Koichi Kawamura , Takeyoshi Kano
发明人： Koichi Kawamura , Takeyoshi Kano
IPC分类号： H05K1/11 , H05K3/10
CPC分类号： H05K3/386 , H05K3/381 , H05K3/4644 , H05K3/4652 , H05K2203/1163 , H05K2203/1168 , Y10T29/49117 , Y10T29/49155 , Y10T29/49165
摘要： The invention provides a multi-layer circuit board sequentially having an insulating substrate, a first electrically conductive pattern arbitrarily formed, an insulating material layer and a second electrically conductive pattern formed by providing an electrically conductive material on a graft polymer pattern formed on the insulating material layer, and having an electrically conductive path which electrically connects the first electrically conductive pattern present on the insulating substrate and the second electrically conductive pattern. The graft polymer pattern includes a combination of a region where a graft polymer is present and a region where no graft polymer is present, or a combination of a region where a hydrophilic graft polymer is present and a region where a hydrophobic graft polymer is present.
摘要翻译：本发明提供一种多层电路板，其顺序地具有绝缘基板，任意形成的第一导电图案，绝缘材料层和通过在形成于绝缘材料上的接枝聚合物图案上提供导电材料而形成的第二导电图案并且具有将存在于绝缘基板上的第一导电图案与第二导电图案电连接的导电路径。接枝聚合物图案包括存在接枝聚合物的区域和不存在接枝聚合物的区域的组合，或存在亲水接枝聚合物的区域和存在疏水接枝聚合物的区域的组合。

5. 发明申请

US20070212883A1 Method For Forming Surface Graft, Method For Forming Conductive Film, Method For Forming Method Pattern, Method For Forming Multilayer Wiring Board, Surface Graft Material, And Conductive Material 失效
标题翻译：形成表面接枝的方法，形成导电膜的方法，成型方法方法，形成多层接线板，表面接枝材料和导电材料的方法
公开(公告)号：US20070212883A1
公开(公告)日：2007-09-13
申请号：US10594227
申请日：2005-03-24
申请人： Takeyoshi Kano , Koichi Kawamura
发明人： Takeyoshi Kano , Koichi Kawamura
IPC分类号： C23C18/16 , B32B27/00 , C08F2/48 , C23C18/20 , C08J7/18 , B32B5/16
CPC分类号： C08J7/12 , C08J7/045 , C08J7/16 , C08J2379/08 , C23C18/1601 , C23C18/1653 , C23C18/1692 , C23C18/2006 , C23C18/2086 , C23C18/28 , C25D5/34 , H05K3/389 , H05K3/4661 , Y10T29/49117 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156 , Y10T29/4921 , Y10T428/25 , Y10T428/31721
摘要： The present invention provides a method for forming a surface graft, comprising the process of applying energy to the surface of a substrate containing polyimide having a polymerization initiating moiety in the skeleton thereof, to generate active points on the surface of the substrate and to generate a graft polymer that is directly bonded to the surface of the substrate starting from the active points and that has a polar group, and a surface graft material obtained thereby. The present invention also provides a method for forming a conductive film, comprising the processes of applying energy to the surface of a substrate containing polyimide having a polymerization initiating moiety in the skeleton thereof, to generate active points on the surface of the substrate and to generate a graft polymer that is directly bonded to the surface of the substrate starting from the active points and that has a polar group, and causing a conductive material to adhere to the graft polymer, and a conductive material obtained thereby.
摘要翻译：本发明提供了一种形成表面接枝物的方法，包括向基体上具有聚合引发部分的含有聚酰亚胺的基材的表面施加能量的方法，以在基材的表面上产生活性点，并产生从活性点开始并且具有极性基团直接结合到基材表面的接枝聚合物，以及由此获得的表面接枝材料。本发明还提供一种形成导电膜的方法，其包括在基体上具有聚合引发部分的含有聚酰亚胺的基材的表面施加能量的工序，以在基板的表面上产生活性点，并产生从活性点开始直接键合到基材表面并具有极性基团并使导电材料附着到接枝聚合物上的接枝聚合物，以及由此获得的导电材料。

6. 发明授权

US06878470B2 Visible image receiving material, conductive pattern material and organic electroluminescence element, using member having surface hydrophilicity 失效
标题翻译：可见图像接收材料，导电图案材料和有机电致发光元件，使用具有表面亲水性的构件
公开(公告)号：US06878470B2
公开(公告)日：2005-04-12
申请号：US10359741
申请日：2003-02-07
申请人： Koichi Kawamura , Takao Nakayama , Miki Takahashi , Takeyoshi Kano
发明人： Koichi Kawamura , Takao Nakayama , Miki Takahashi , Takeyoshi Kano
IPC分类号： B41M3/00 , B41M5/00 , B41M5/50 , B41M5/52 , C09D11/10 , G03F7/00 , H01L27/32 , H01L51/00 , H01L51/40 , H05K3/12 , H05K3/38 , H01J1/62 , B32B3/10 , H05B33/00
CPC分类号： H05K3/38 , B41M3/006 , B41M5/506 , B41M5/52 , C09D11/101 , G03F7/0007 , H01L27/3211 , H01L27/3295 , H01L51/0004 , H01L51/0021 , H05K3/12 , H05K2203/1168 , Y10S428/917 , Y10T428/24802
摘要： The invention includes a visible image receiving material, a conductive pattern material and an organic electroluminescence element, to which a member having a hydrophilic graft chain on a surface thereof through attention to the strong hydrophilicity of the graft chain.
摘要翻译：本发明包括可见图像接收材料，导电图案材料和有机电致发光元件，通过注意接枝链的强亲水性，其表面上具有亲水性接枝链的构件。

7. 发明授权

US07879535B2 Pattern forming method, graft pattern material, conductive pattern forming method and conductive pattern material 失效
标题翻译：图案形成方法，接枝图案材料，导电图案形成方法和导电图案材料
公开(公告)号：US07879535B2
公开(公告)日：2011-02-01
申请号：US11090593
申请日：2005-03-28
申请人： Takeyoshi Kano , Koichi Kawamura
发明人： Takeyoshi Kano , Koichi Kawamura
IPC分类号： G03F1/00
CPC分类号： G03F7/0387 , B41M5/368 , C23C18/1608 , C23C18/1612 , C23C18/1653 , C23C18/2033 , C23C18/204 , C23C18/2086 , C23C18/28 , G03F7/0045 , G03F7/031 , G03F7/039 , G03F7/0392 , G03F7/095 , G03F7/0955 , G03F7/16 , G03F7/165 , G03F7/265 , G03F7/405 , H05K1/0346 , H05K3/185 , H05K3/389 , H05K2201/0154 , H05K2203/1168
摘要： The present invention provides a pattern forming method characterized in that energy is applied to a surface of a base material including a polyimide having a polymerization initiating moiety in a skeleton thereof to thereby generate an active site on the surface of the base material, and a polymer directly bonded to the base material surface and having at least a group selected from a group consisting of: a polar group; a functional group whose hydrophilicity/hydrophobicity changes, whose structure is changed into a structure that interacts with an electroless plating catalyst or a precursor thereof, or which ceases to interact with an electroless plating catalyst or a precursor thereof in response to heat, acid or radiation; and a polymerizable functional group, is generated in a pattern shape using the active site as a starting point so that a pattern is formed on the surface of the base material.
摘要翻译：本发明提供了一种图案形成方法，其特征在于，将能量施加到包括在骨架中具有聚合引发部分的聚酰亚胺的基材的表面，从而在所述基材的表面上产生活性位点，直接结合到基材表面并且具有至少一个选自以下的基团：极性基团; 其亲水性/疏水性变化的结构变化成与化学镀催化剂或其前体相互作用的结构，或者不依赖于化学镀催化剂或其前体与热，酸或辐射相互作用的官能团 ; 和可聚合官能团以使用活性部位作为起点形成图案形状，使得在基材的表面上形成图案。

8. 发明授权

US07438950B2 Metallic pattern forming method and conductive pattern material 失效
标题翻译：金属图案形成方法和导电图案材料
公开(公告)号：US07438950B2
公开(公告)日：2008-10-21
申请号：US11141055
申请日：2005-06-01
申请人： Takeyoshi Kano , Koichi Kawamura
发明人： Takeyoshi Kano , Koichi Kawamura
IPC分类号： B05D3/02 , B05D3/04 , B05D5/12 , C08F2/48
CPC分类号： C23C18/1608 , C23C18/1612 , C23C18/1653 , C23C18/2033 , C23C18/204 , C23C18/2086 , C23C18/30 , C23C18/31 , G03F7/265 , H05K3/185 , H05K3/387 , H05K2203/107 , H05K2203/1168
摘要： The invention provides a metallic pattern forming method comprising: forming a region in which a graft polymer, that directly bonds to a surface of a base material that includes a polyimide and has a functional group that interacts with either an electroless plating catalyst or a precursor thereof, is generated in a pattern shape; imparting either an electroless plating catalyst or a precursor thereof and electroless plating so as to form a metallic film in the pattern shape, wherein the polyimide has at least one structural unit represented by the following Formula (1) or Formula (2) and has a polymerization initiating site in a skeleton thereof. R1 represents a bivalent organic group. R2 is represented by one of Formulae (3) to (6). R3, R4, R5 and R6 independently represents a bivalent organic group.
摘要翻译：本发明提供一种金属图案形成方法，包括：形成其中直接粘合到包括聚酰亚胺的基材的表面并具有与无电镀催化剂或其前体相互作用的官能团的接枝聚合物的区域，以图案形状生成; 赋予化学镀催化剂或其前体和化学镀以形成图案形状的金属膜，其中聚酰亚胺具有至少一个由下式（1）或式（2）表示的结构单元，并具有其骨架中的聚合引发位点。 R 1表示二价有机基团。 R 2由式（3）至（6）之一表示。 R 3，R 4，R 5和R 6独立地表示二价有机基团。

9. 发明授权

US07405035B2 Pattern forming method and substance adherence pattern material 失效
标题翻译：图案形成方法和物质粘附图案材料
公开(公告)号：US07405035B2
公开(公告)日：2008-07-29
申请号：US10735769
申请日：2003-12-16
申请人： Koichi Kawamura , Takeyoshi Kano
发明人： Koichi Kawamura , Takeyoshi Kano
IPC分类号： G03F7/00
CPC分类号： C08F292/00 , C08F2438/01 , G03F7/029 , G03F7/165
摘要： The present invention relates to a pattern forming method comprising image-wise forming, on a surface of a substrate, a region having an ability to initiate polymerization, forming a graft polymer on the region by atom transfer radical polymerization, and adhering a substance to the graft polymer. The method can be applied for preparing an image forming material, a fine particle adsorption pattern material, a conductive pattern material, or the like by selecting a suitable substance.
摘要翻译：本发明涉及一种图案形成方法，包括在基材表面上成像形成具有引发聚合能力的区域，通过原子转移自由基聚合在该区域上形成接枝聚合物，并将物质粘附到接枝聚合物。该方法可以通过选择合适的物质来应用于制备成像材料，细颗粒吸附图案材料，导电图案材料等。

10. 发明申请

US20050266352A1 Metallic pattern forming method and conductive pattern material 失效
标题翻译：金属图案形成方法和导电图案材料
公开(公告)号：US20050266352A1
公开(公告)日：2005-12-01
申请号：US11141055
申请日：2005-06-01
申请人： Takeyoshi Kano , Koichi Kawamura
发明人： Takeyoshi Kano , Koichi Kawamura
IPC分类号： G03F7/004 , C08G73/10 , C23C18/16 , C23C18/20 , C23C18/30 , C23C18/31 , G03C5/00 , G03F7/26 , G03F7/40 , H05K1/03 , H05K3/18 , H05K3/38
CPC分类号： C23C18/1608 , C23C18/1612 , C23C18/1653 , C23C18/2033 , C23C18/204 , C23C18/2086 , C23C18/30 , C23C18/31 , G03F7/265 , H05K3/185 , H05K3/387 , H05K2203/107 , H05K2203/1168
摘要： The invention provides a metallic pattern forming method comprising: forming a region in which a graft polymer, that directly bonds to a surface of a base material that includes a polyimide and has a functional group that interacts with either an electroless plating catalyst or a precursor thereof, is generated in a pattern shape; imparting either an electroless plating catalyst or a precursor thereof; and electroless plating so as to form a metallic film in the pattern shape, wherein the polyimide has at least one structural unit represented by the following Formula (1) or Formula (2) and has a polymerization initiating site in a skeleton thereof. R1 represents a bivalent organic group. R2 is represented by one of Formulae (3) to (6). R3, R4, R5 and R5 independently represents a bivalent organic group.
摘要翻译：本发明提供一种金属图案形成方法，包括：形成其中直接粘合到包括聚酰亚胺的基材的表面并具有与无电镀催化剂或其前体相互作用的官能团的接枝聚合物的区域，以图案形状生成; 赋予化学镀催化剂或其前体; 和化学镀以形成图案形状的金属膜，其中聚酰亚胺具有至少一个由下式（1）或式（2）表示的结构单元，并且在其骨架中具有聚合引发位点。 R 1表示二价有机基团。 R 2由式（3）至（6）之一表示。 R 3，R 4，R 5和R 5独立地表示二价有机基团。

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