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1. 发明授权

US06419040B2 Driving force control system for four-wheel drive vehicles 有权
标题翻译：四轮驱动车辆的驱动力控制系统
公开(公告)号：US06419040B2
公开(公告)日：2002-07-16
申请号：US09734542
申请日：2000-12-13
申请人： Kazuhiko Kitano , Toru Nakasako , Akihiro Yamamoto , Naoki Uchiyama , Mitsuaki Hirakawa , Satoshi Taguchi
发明人： Kazuhiko Kitano , Toru Nakasako , Akihiro Yamamoto , Naoki Uchiyama , Mitsuaki Hirakawa , Satoshi Taguchi
IPC分类号： B60K17356
CPC分类号： B60W20/10 , B60K6/52 , B60K17/354 , B60K17/356 , B60K23/0808 , B60K28/165 , B60W10/06 , B60W10/08 , B60W20/00 , B60W2520/10 , B60W2520/26 , B60W2540/10 , B60W2710/0677 , B60W2710/086 , F16H2059/467 , Y02T10/52 , Y02T10/6265 , Y02T10/6286 , Y10S903/903 , Y10S903/916 , Y10T477/675 , Y10T477/6939
摘要： A four-wheel drive vehicle is provided in which the main driven wheels are driven by an engine via a torque converter and the auxiliary driven wheels are driven by an electric motor. The response of the vehicle to the operation of the accelerator is improved by suppressing in advance the slip of the main driven wheels due to an excess output of the engine. The main driven wheels are driven by an engine via a torque converter and auxiliary driven wheels are driven by an electric motor. The vehicle is started by the output of the electric motor in the region in which the speed ratio of the torque converter is small (that is to say, the region in which the efficiency is low) such as when the vehicle is starting, and when it enters the region in which the speed ratio of the torque converter exceeds 0.8 and the efficiency exceeds 85% the drive of the electric motor is stopped or suspended and the vehicle is made to travel by means of the output of the engine.
摘要翻译：提供四轮驱动车辆，其中主从动轮由发动机经由变矩器驱动，辅助从动轮由电动机驱动。通过由于发动机的过量输出而预先抑制主从动轮的滑动，提高了车辆对加速器的操作的响应。主动轮由发动机通过变矩器驱动，辅助从动轮由电动机驱动。通过电动机的输出在变速器的变速比小的区域（也就是说，效率低的区域）中启动车辆，并且当车辆开始时进入变矩器的转速比超过0.8且效率超过85％的区域，电动机的驱动停止或停止，并且通过发动机的输出使车辆行驶。

2. 发明授权

US06575870B2 Driving force control system for front-and-rear wheel drive vehicles 有权
标题翻译：前轮驱动车辆的驱动力控制系统
公开(公告)号：US06575870B2
公开(公告)日：2003-06-10
申请号：US09904535
申请日：2001-07-16
申请人： Kazuhiko Kitano , Naoki Uchiyama , Akihiro Yamamoto , Tooru Nakasako , Takahiro Yonekura , Toshihiko Fukuda
发明人： Kazuhiko Kitano , Naoki Uchiyama , Akihiro Yamamoto , Tooru Nakasako , Takahiro Yonekura , Toshihiko Fukuda
IPC分类号： B60R100
CPC分类号： B60W20/11 , B60K6/48 , B60K6/52 , B60K6/54 , B60K17/356 , B60L3/102 , B60L7/18 , B60L11/123 , B60L11/14 , B60L11/1861 , B60L15/2045 , B60L2240/486 , B60L2260/28 , B60T2270/603 , B60W20/00 , B60W30/02 , B60W30/18127 , B60W2510/244 , B60W2520/10 , B60W2540/10 , B60W2710/105 , Y02T10/6217 , Y02T10/6221 , Y02T10/6265 , Y02T10/645 , Y02T10/7005 , Y02T10/7044 , Y02T10/705 , Y02T10/7077 , Y02T10/7283 , Y02T10/92 , Y10S903/916 , Y10S903/917 , Y10T477/23 , Y10T477/33
摘要： A driving force control system for a front-and-rear wheel drive vehicle, which is capable of charging a battery based on a traveling condition of the vehicle. The front-and-rear wheel drive vehicle is driven while switching between a drive mode for driving front wheels by an engine and driving rear wheels by a motor, and a recharge mode for recovering running energy of the vehicle and charging the battery with the recovered running energy. Parameters (accelerator pedal opening &THgr;AP and a vehicle speed Vcar, or drive wheel speeds of the respective front and rear wheels) indicative of a driving condition of the vehicle are detected. A traveling condition of the vehicle is determined based on the parameters. It is determined, based on the traveling condition of the vehicle and the state of charge of the driving energy in the drive source, whether charging of the battery is to be executed.
摘要翻译：一种用于前轮驱动车辆的驱动力控制系统，其能够基于车辆的行驶状态对电池充电。前后轮驱动车辆在通过发动机驱动前轮的驱动模式和通过电动机驱动后轮之间切换的同时被驱动，以及用于恢复车辆的运行能量并且用回收的电池对电池充电的再充电模式运行能量检测表示车辆的行驶状态的参数（加速踏板开度THETAAP和车速V car，或各前后轮的驱动轮速度）。根据参数确定车辆的行驶状态。基于车辆的行驶状况和驱动源中的驱动能量的充电状态来确定是否执行电池的充电。

3. 发明授权

US06528959B2 Driving force control system for front-and-rear wheel drive vehicles 有权
公开(公告)号：US06528959B2
公开(公告)日：2003-03-04
申请号：US09906054
申请日：2001-07-17
申请人： Kazuhiko Kitano , Toshihiko Fukuda , Takahiro Yonekura , Naoki Uchiyama , Kenji Honda , Tooru Nakasako
发明人： Kazuhiko Kitano , Toshihiko Fukuda , Takahiro Yonekura , Naoki Uchiyama , Kenji Honda , Tooru Nakasako
IPC分类号： H02P766
CPC分类号： B60W20/10 , B60K6/48 , B60K6/52 , B60K28/16 , B60L2240/486 , B60T8/1769 , B60T8/48 , B60T2201/04 , B60T2270/602 , B60W10/06 , B60W10/08 , B60W20/00 , B60W2520/10 , B60W2530/00 , B60W2540/10 , B60W2550/142 , B60W2710/0666 , B60W2710/1061 , B60W2720/106 , Y02T10/6221 , Y02T10/6265 , Y02T10/6286 , Y10S903/916
摘要： There is provided a driving force control system for a front-and-rear wheel drive vehicle, which is capable maintaining an optimum slip condition of the drive wheels even on a low-friction road surface, ensuring a proper grip of rear wheels even on a low-friction road surface or a downhill slope, even when the driver operates the steering wheel while the vehicle is performing decelerating travel on such a road, and smoothly performing the assistance of an electric motor when the vehicle is accelerated without developing a torque step, thereby ensuring stable traveling and excellent acceleration and drivability. The front-and-rear wheel drive vehicle drives the front wheels by an engine, and rear wheels by an electric motor via an electromagnetic clutch. The target driving force for driving the vehicle is calculated based on at least a vehicle speed and an accelerator pedal opening. The present traveling condition of the vehicle is determined. The driving force for driving the vehicle is controlled based on the calculated target driving force in dependence on the determined traveling condition of the vehicle.

4. 发明授权

US06971461B2 Front and rear wheel drive vehicle and control device for controlling same 有权
标题翻译：前轮和后轮驱动车辆和控制装置
公开(公告)号：US06971461B2
公开(公告)日：2005-12-06
申请号：US10677477
申请日：2003-10-03
申请人： Akihiro Yamamoto , Naoki Uchiyama , Takahiro Yonekura
发明人： Akihiro Yamamoto , Naoki Uchiyama , Takahiro Yonekura
IPC分类号： B60K6/48 , B60K6/52 , B60K17/356 , B60W10/06 , B60W10/08 , B60W10/26 , B60K1/00
CPC分类号： B60W10/06 , B60K6/48 , B60K6/52 , B60K17/356 , B60W10/08 , B60W10/26 , B60W2540/10 , Y02T10/6221 , Y02T10/6265 , Y02T10/6286 , Y10T477/23
摘要： A front and rear wheel drive vehicle having front and rear wheel pairs one of which is driven with an engine and the other of which is driven with an electric motor. The vehicle has a control device including a target drive-power unit which sets a target drive-power responsive to operating conditions of the vehicle and a motor-assist-mode drive-power distribution-ratio setting unit which sets a drive-power distribution-ratio between an engine drive-power and a motor drive-power according to an energy efficiency index value indicating the degree of contribution to fuel consumption based on the target drive-power and a vehicle speed. In addition the vehicle includes an electric-power-generation running-mode drive-power distribution-ratio setting unit which sets a charging-mode distribution ratio, between the engine drive-power and the motor drive-power, responsive to an energy loss index value indicating the degree of contribution to fuel consumption during a charging-mode that is on the basis of the target drive-power and the vehicle speed.
摘要翻译：前轮和后轮驱动车辆具有前轮和后轮对，其中一个由发动机驱动，另一个由电动机驱动。车辆具有控制装置，该控制装置包括响应于车辆的运行状态设定目标驱动力的目标驱动力单元和设置驱动力分配比设定单元的电动助力模式驱动力分配比设定单元，根据表示基于目标驱动力和车速对燃料消耗的贡献度的能量效率指标值，发动机驱动力与电动机驱动力之比。另外，车辆包括：发电运行模式驱动力分配比设定单元，其响应于能量损失指数，设定发动机驱动力和电动机驱动力之间的充电模式分配比表示在基于目标驱动力和车速的充电模式下对燃料消耗的贡献程度的值。

5. 发明授权

US09302410B2 Method for cutting object to be processed 有权
标题翻译：切割待处理物体的方法
公开(公告)号：US09302410B2
公开(公告)日：2016-04-05
申请号：US13383487
申请日：2010-07-21
申请人： Hideki Shimoi , Naoki Uchiyama , Daisuke Kawaguchi
发明人： Hideki Shimoi , Naoki Uchiyama , Daisuke Kawaguchi
IPC分类号： B32B38/04 , B28D5/00 , B23K26/00 , H01L21/78 , B23K26/40
CPC分类号： B32B37/06 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B28D5/00 , B28D5/0011 , B32B38/0004 , H01L21/78 , Y10T29/49002 , Y10T29/49787 , Y10T156/1052
摘要： A silicon substrate 12 has a main face in a (100) plane, whereby a fracture 17 generated from a molten processed region 13 acting as a start point extends in a cleavage direction of the silicon substrate 12 (a direction orthogonal to the main face of the silicon substrate 12). Here, a rear face 1b of an object to be processed 1A and a front face 10a of an object to be processed for separation 10A are bonded to each other by anode bonding, whereby the fracture 17 reaches a front face 1a of the object 1A continuously without substantially changing its direction. When generating a stress in the object for separation 10A, the fracture 17 has reached a rear face 10b of the object for separation 10A and thus easily extends toward the object 1A.
摘要翻译：硅基板12具有（100）面内的主面，由作为起点的熔融处理区域13产生的断裂线17沿硅基板12的切割方向（与硅衬底12）。这里，待处理物体1A的后表面1b和待加工物体10A的前面10a通过阳极接合彼此接合，从而断裂17连续地到达物体1A的前表面1a 而不会大幅改变其方向。当在分离对象物10A中产生应力时，断裂部17已到达分离对象物10A的背面10b，因此容易向物体1A延伸。

6. 发明授权

US08969752B2 Laser processing method 有权
标题翻译：激光加工方法
公开(公告)号：US08969752B2
公开(公告)日：2015-03-03
申请号：US10548522
申请日：2003-09-11
申请人： Kenshi Fukumitsu , Fumitsugu Fukuyo , Naoki Uchiyama
发明人： Kenshi Fukumitsu , Fumitsugu Fukuyo , Naoki Uchiyama
IPC分类号： B23K15/00 , B23K26/00 , B23K26/04 , B23K26/14 , B23K26/06 , B23K26/02 , B23K9/12 , G01B15/00 , H05B6/00 , B23P19/00 , C22F3/00 , C23C8/00 , B28D5/00 , B28D1/22 , B23K26/40
CPC分类号： B28D5/0011 , B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , B28D1/221 , B28D5/0052 , Y10S148/903 , Y10T29/49254 , Y10T29/53465
摘要： The present invention provides a laser processing method comprising the steps of attaching a protective tape 25 to a front face 3 of a wafer 1a, irradiating a substrate 15 with laser light L while employing a rear face of the wafer 1a as a laser light entrance surface and locating a light-converging point P within the substrate 15 so as to form a molten processed region 13 due to multiphoton absorption, causing the molten processed region 13 to form a cutting start region 8 inside by a predetermined distance from the laser light entrance surface along a line 5 along which the object is intended to be cut in the wafer 1a, attaching an expandable tape 23 to the rear face 21 of the wafer 1a, and expanding the expandable tape 23 so as to separate a plurality of chip parts 24 produced upon cutting the wafer 1a from the cutting start region 8 acting as a start point from each other.
摘要翻译：本发明提供了一种激光加工方法，包括以下步骤：将保护带25附接到晶片1a的正面3，将基片15照射激光L同时使用晶片1a的背面作为激光入射面并且将聚光点P定位在基板15内，以便由于多光子吸收而形成熔融处理区域13，使得熔融处理区域13在距激光入射面一定距离处形成切割起始区域8 沿着在该晶片1a上要切割物体的线5，将可膨胀带23附接到晶片1a的后表面21，并且使可扩张带23膨胀以分离生产的多个芯片部分24 在从作为起点的切割起始区域8切割晶片1a时。

7. 发明授权

US08890027B2 Laser processing method and laser processing system 有权
标题翻译：激光加工方法和激光加工系统
公开(公告)号：US08890027B2
公开(公告)日：2014-11-18
申请号：US12282698
申请日：2007-03-06
申请人： Fumitsugu Fukuyo , Etsuji Ohmura , Kenshi Fukumitsu , Masayoshi Kumagai , Kazuhiro Atsumi , Naoki Uchiyama
发明人： Fumitsugu Fukuyo , Etsuji Ohmura , Kenshi Fukumitsu , Masayoshi Kumagai , Kazuhiro Atsumi , Naoki Uchiyama
IPC分类号： B23K26/38 , B23K26/00 , B23K26/06 , B23K26/36
CPC分类号： B23K26/53 , B23K26/0622 , B23K26/0853 , B23K26/364 , B23K26/40 , B23K2101/40 , B23K2103/50 , C03B33/0222 , C03B33/037 , H01L21/78
摘要： An object to be processed 1 is irradiated with laser light L with a standard pulse waveform, so as to form a molten processed region 131, which has a larger size in the thickness direction of the object 1 and is easy to generate a fracture 24 in the thickness direction of the object 1, within a silicon wafer 111, and with laser light L with a retarded pulse waveform, so as to form a molten processed region 132, which has a smaller size in the thickness direction of the object 1 and is hard to generate the fracture 24 in the thickness direction of the object 1, within a silicon wafer 112.
摘要翻译：用标准脉冲波形的激光L对被处理物体1进行照射，形成在物体1的厚度方向上具有较大尺寸的熔融处理区域131，容易产生骨折24 物体1的厚度方向，硅晶片111内，以及具有延迟脉冲波形的激光L，形成在物体1的厚度方向上具有较小尺寸的熔融处理区域132，并且为在硅晶片112内难以在物体1的厚度方向上产生裂缝24。

8. 发明授权

US08828306B2 Working object cutting method 有权
标题翻译：工作对象切割方法
公开(公告)号：US08828306B2
公开(公告)日：2014-09-09
申请号：US12744727
申请日：2008-11-18
申请人： Naoki Uchiyama
发明人： Naoki Uchiyama
IPC分类号： B29C35/08 , H01L21/78 , B23K26/08 , B23K26/00 , B23K26/40
CPC分类号： B23K26/53 , B23K26/0823 , B23K26/38 , B23K26/40 , B23K2101/40 , B23K2103/50 , H01L21/78
摘要： A working object cutting method capable of cutting a working object precisely is provided. The working object cutting method comprises irradiating a working object 1 with a laser beam while locating a converging point at the working object, so as to form a reformed region in the working object 1 along a reformed-region forming line 15 set at a predetermined distance inside from an outer edge E of the working object 1 along the outer edge, forming a cutting reformed region in the working object 1 along a cutting-scheduled line 5, and cutting the working object 1 along the cutting-scheduled line 5 from a cutting reformed region acting as a start point. Thus forming the working object 1 with the reformed region along the reformed-region forming line 15 set at a predetermined distance inside from the outer edge E of the working object 1 allows the formed reformed region or fissures extending therefrom to inhibit fissures generated in an outer edge portion 25 of the working object 1 from extending to the inside even if a cutting stress is applied to the working object 1 when cutting the working object 1.
摘要翻译：提供了能够精确地切割加工对象物的工件对象切断方法。工作对象切割方法包括：将加工对象物1与激光束对准，同时将加工点定位在加工对象上，以沿着设置在预定距离处的重整区域形成线15在加工对象物1中形成重整区域沿着外缘从工作对象物1的外边缘E向内侧，沿着切断预定线5在加工对象物1上形成切割重整区域，并且沿切割预定线5切割加工对象物1，改革区域作为起点。因此，通过设置在与工作对象1的外边缘E相距预定距离的重整区域形成线15的工作对象1，能够使形成的重整区域或从其延伸的裂缝抑制在外部产生的裂缝即使当切割加工对象1时对加工对象物1施加切削应力时，加工对象物1的边缘部分25也向内延伸。

9. 发明授权

US08603351B2 Working method for cutting 有权
标题翻译：切割工作方法
公开(公告)号：US08603351B2
公开(公告)日：2013-12-10
申请号：US12601090
申请日：2008-05-23
申请人： Takeshi Sakamoto , Hideki Shimoi , Naoki Uchiyama
发明人： Takeshi Sakamoto , Hideki Shimoi , Naoki Uchiyama
IPC分类号： B44C1/22
CPC分类号： B23K26/40 , B23K26/53 , B23K2101/40 , B23K2103/50 , H01L21/67132 , H01L21/78
摘要： An object to be processed is reliably cut along a line to cut. An object to be processed is irradiated with laser light while locating a converging point at the object, so as to form a modified region in the object along a line to cut. The object formed with the modified region is subjected to an etching process utilizing an etching liquid exhibiting a higher etching rate for the modified region than for an unmodified region, so as to etch the modified region. This can etch the object selectively and rapidly along the line to cut by utilizing a higher etching rate in the modified region.
摘要翻译：待切割的物体沿切割线可靠切割。在将会聚点定位在物体的同时用激光照射待处理物体，以沿着切割线在物体中形成改质区域。用改性区域形成的物体经受蚀刻处理，利用对修饰区域表现出比对于未改性区域更高的蚀刻速率的蚀刻液体，以蚀刻修饰区域。这可以通过在改质区域中利用较高的蚀刻速率沿切割线选择性地和快速地蚀刻物体。

10. 发明授权

US08481151B2 Hydrogen storage alloy and hydrogen storage unit using same 有权
标题翻译：储氢合金和储氢单元使用相同
公开(公告)号：US08481151B2
公开(公告)日：2013-07-09
申请号：US13393798
申请日：2009-09-04
申请人： Naoki Uchiyama , Tomomi Kanai , Kazumi Harada
发明人： Naoki Uchiyama , Tomomi Kanai , Kazumi Harada
IPC分类号： C01B6/24 , B32B3/26
CPC分类号： B22F1/02 , B22F7/002 , C01B3/0026 , C01B3/0042 , C01B3/0078 , C22C47/06 , C22C49/04 , C22C2202/04 , Y02E60/327 , Y10T428/249953 , Y10T428/31678
摘要： A hydrogen storage alloy comprises a hydrogen storage base formed of a mixture of magnesium and an alloy, such as a magnesium-nickel alloy, a magnesium-titanium alloy, a magnesium-niobium alloy, a magnesium-manganese alloy, or a magnesium-cobalt alloy, and a catalytic layer covering a surface of the base. A hydrogen storage alloy unit includes the hydrogen storage base and a porous body including an assembly of nanofibers. The alloy may be vapor-deposited onto the assembly of nanofibers. The nanofibers may be tangled to provide spaces between the fibers for the passage of hydrogen molecules. The nanofibers in one example are also porous. A catalytic layer of platinum may cover a surface of the hydrogen storage base.
摘要翻译：储氢合金包括由镁和合金的混合物形成的储氢基质，例如镁 - 镍合金，镁 - 钛合金，镁 - 铌合金，镁 - 锰合金或镁 - 钴合金，以及覆盖基材表面的催化剂层。储氢合金单元包括储氢基底和包括纳米纤维组件的多孔体。该合金可以气相沉积到纳米纤维的组件上。纳米纤维可能被缠结以在纤维之间提供用于氢分子通过的空间。在一个实例中的纳米纤维也是多孔的。铂的催化剂层可以覆盖储氢基底的表面。

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