会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明申请
    • RESIST PROCESSING METHOD AND USE OF POSITIVE TYPE RESIST COMPOSITION
    • 电阻加工方法和正极型电阻组合物的使用
    • US20110183264A1
    • 2011-07-28
    • US13063670
    • 2009-09-08
    • Kazuhiko HashimotoMitsuhiro HataSatoshi Yamamoto
    • Kazuhiko HashimotoMitsuhiro HataSatoshi Yamamoto
    • G03F7/004G03F7/20
    • G03F7/0035G03F7/0045G03F7/0046G03F7/0397G03F7/40
    • A resist processing method has the steps of: (1) forming a first resist film by applying a first resist composition comprising: a resin (A) including a structural unit represented by the formula (XX), and having an acid-labile group, being insoluble or poorly soluble in alkali aqueous solution, and being rendered soluble in alkali aqueous solution through the action of an acid, and a photo acid generator (B) onto a substrate and drying; (2) prebaking the first resist film; (3) exposing the first resist film; (4) post-exposure baking of the first resist film; (5) developing with a first alkali developer to obtain a first resist pattern; (6) hard-baking the first resist pattern, (7) obtaining a second resist film by applying a second resist composition onto the first resist pattern, and then drying; (8) pre-baking the second resist film; (9) exposing the second resist film; (10) post-exposure baking the second resist film; and (11) developing with a second alkali developer to obtain a second resist pattern. wherein, Ra1 represents a hydrogen atom, a halogen atom or a C1 to C3 saturated hydrocarbon group which may be substituted with a halogen atom; Ra2 represents a single bond or a divalent organic group; Ra3 represents a hydrogen atom, a C1 to C12 saturated hydrocarbon group which may be substituted with a hydroxy group etc., and Ra4 represent a C1 to C12 saturated hydrocarbon group.
    • 抗蚀剂处理方法具有以下步骤:(1)通过施加第一抗蚀剂组合物形成第一抗蚀剂膜,所述第一抗蚀剂组合物包含:包含由式(XX)表示的结构单元并具有酸不稳定基团的树脂(A) 在碱性水溶液中不溶或难溶,并且通过酸的作用使碱溶液和光酸产生剂(B)溶解在基材上并干燥; (2)预烘第一抗蚀膜; (3)曝光第一抗蚀膜; (4)第一抗蚀剂膜的曝光后烘烤; (5)用第一碱性显影剂显影以获得第一抗蚀剂图案; (6)对第一抗蚀剂图案进行硬烘烤,(7)通过将第二抗蚀剂组合物施加到第一抗蚀剂图案上,然后干燥获得第二抗蚀剂膜; (8)预烘烤第二抗蚀剂膜; (9)使第二抗蚀剂膜曝光; (10)曝光后烘烤第二抗蚀膜; 和(11)用第二碱性显影剂显影以获得第二抗蚀剂图案。 其中,Ra1表示氢原子,卤素原子或可被卤素原子取代的C1〜C3饱和烃基; Ra2表示单键或二价有机基团; Ra3表示氢原子,可被羟基取代的C1〜C12饱和烃基等,Ra4表示C1〜C12饱和烃基。
    • 2. 发明申请
    • PROCESS FOR PRODUCING PHOTORESIST PATTERN
    • 生产光电子图案的工艺
    • US20100273112A1
    • 2010-10-28
    • US12763357
    • 2010-04-20
    • Mitsuhiro HataSatoshi YamamotoYusuke Fuji
    • Mitsuhiro HataSatoshi YamamotoYusuke Fuji
    • G03F7/20
    • G03F7/40G03F7/0035G03F7/0045G03F7/0046G03F7/0397G03F7/091
    • The present invention provides a process for producing a photoresist pattern comprising the following steps (A) to (D): (A) a step of forming the first photoresist film on a substrate using the first photoresist composition comprising a resin comprising a structural unit having an acid-labile group in its side chain and being itself insoluble or poorly soluble in an alkali aqueous solution but becoming soluble in an alkali aqueous solution by the action of an acid, an acid generator, and a cross-linking agent, exposing the first photoresist film to radiation followed by developing the exposed first photoresist film to obtain the first photoresist pattern, (B) a step of baking the obtained first photoresist pattern at 190 to 250° C. for 10 to 60 seconds, (C) a step of forming the second photoresist film on the substrate on which the first photoresist pattern has been formed using the second photoresist composition, exposing the second photoresist film to radiation, and (D) a step of developing the exposed second photoresist film to obtain the second photoresist pattern.
    • 本发明提供一种制造光致抗蚀剂图案的方法,包括以下步骤(A)至(D):(A)使用包含树脂的第一光致抗蚀剂组合物在基板上形成第一光致抗蚀剂膜的步骤,所述树脂包括具有 其侧链酸性不稳定基团本身不溶于或难溶于碱水溶液,但通过酸,酸发生剂和交联剂的作用变得可溶于碱性水溶液中,使第一 将曝光的第一光致抗蚀剂膜显影以获得第一光致抗蚀剂图案,(B)在190至250℃下烘烤获得的第一光致抗蚀剂图案10至60秒的步骤,(C)步骤 在所述基板上形成所述第二光致抗蚀剂膜,使用所述第二光致抗蚀剂组合物在其上形成所述第一光致抗蚀剂图案,将所述第二光致抗蚀剂膜暴露于辐射,以及(D) 旋转曝光的第二光致抗蚀剂膜以获得第二光致抗蚀剂图案。
    • 3. 发明申请
    • RESIST PROCESSING METHOD
    • 电阻加工方法
    • US20110189618A1
    • 2011-08-04
    • US13062180
    • 2009-09-01
    • Mitsuhiro HataNobuo AndoSatoshi YamamotoJunji ShigematsuAkira Kamabuchi
    • Mitsuhiro HataNobuo AndoSatoshi YamamotoJunji ShigematsuAkira Kamabuchi
    • G03F7/20
    • G03F7/0035G03F7/0045G03F7/0046G03F7/0397G03F7/40
    • A resist processing method comprises the steps of: (1) forming a first resist film by applying a first resist composition comprising: a resin (A) having an acid-labile group, being insoluble or poorly soluble in alkali aqueous solution, and being rendered soluble in alkali aqueous solution through the action of an acid, a photo acid generator (B), a cross-linking agent (C) and an acid amplifier (D) onto a substrate and drying; (2) prebaking the first resist film; (3) exposing to the first resist film; (4) post-exposure baking of the first resist film; (5) developing with a first alkali developer to obtain a first resist pattern; (6) hard-baking the first resist pattern, (7) obtaining a second resist film by applying a second resist composition onto the first resist pattern, and drying; (8) pre-baking the second resist film; (9) exposing the second resist film; (10) post-exposure baking the second resist film; and (11) developing with a second alkali developer to obtain a second resist pattern.
    • 抗蚀剂处理方法包括以下步骤:(1)通过施加第一抗蚀剂组合物形成第一抗蚀剂膜,所述第一抗蚀剂组合物包含:具有酸不稳定基团的树脂(A),其在碱性水溶液中不溶或难溶,并且呈现 通过酸,光酸产生剂(B),交联剂(C)和酸放大器(D)的作用将其溶于碱水溶液中并干燥; (2)预烘第一抗蚀膜; (3)暴露于第一抗蚀膜; (4)第一抗蚀剂膜的曝光后烘烤; (5)用第一碱性显影剂显影以获得第一抗蚀剂图案; (6)硬烘烤第一抗蚀剂图案,(7)通过将第二抗蚀剂组合物施加到第一抗蚀剂图案上并干燥获得第二抗蚀剂膜; (8)预烘烤第二抗蚀剂膜; (9)使第二抗蚀剂膜曝光; (10)曝光后烘烤第二抗蚀膜; 和(11)用第二碱性显影剂显影以获得第二抗蚀剂图案。
    • 4. 发明申请
    • RESIST PROCESSING METHOD
    • 电阻加工方法
    • US20110171586A1
    • 2011-07-14
    • US13003178
    • 2009-07-07
    • Mitsuhiro HataSatoshi YamamotoTakayuki Miyagawa
    • Mitsuhiro HataSatoshi YamamotoTakayuki Miyagawa
    • G03F7/20
    • G03F7/0035G03F7/0045G03F7/0046G03F7/0397G03F7/2022G03F7/38G03F7/40
    • A resist processing method having the steps of: (1) forming a first resist film by applying a first resist composition comprising: a resin (A) having an acid-labile group, being insoluble or poorly soluble in alkali aqueous solution, and being rendered soluble in alkali aqueous solution through the action of an acid, a photo acid generator (B) and a cross-linking agent (C) onto a substrate and drying; (2) prebaking the first resist film; (3) exposing to a whole surface of the first resist film, and then exposing the first resist film through a mask; (4) post-exposure baking of the first resist film; (5) developing with a first alkali developer to obtain a first resist pattern; (6) hard-baking the first resist pattern, (7) obtaining a second resist film by applying a second resist composition onto the first resist pattern, and then drying; (8) pre baking the second resist film; (9) exposing the second resist film through a mask; (10) post-exposure baking the second resist film; and (11) developing with a second alkali developer to obtain a second resist pattern.
    • 一种抗蚀剂处理方法,具有以下步骤:(1)通过施加第一抗蚀剂组合物形成第一抗蚀剂膜,所述第一抗蚀剂组合物包含:具有酸不稳定基团的树脂(A),其在碱性水溶液中不溶或难溶,并且呈现 通过酸,光酸产生剂(B)和交联剂(C)的作用将其溶解在碱性水溶液中并干燥; (2)预烘第一抗蚀膜; (3)暴露于第一抗蚀剂膜的整个表面,然后通过掩模曝光第一抗蚀剂膜; (4)第一抗蚀剂膜的曝光后烘烤; (5)用第一碱性显影剂显影以获得第一抗蚀剂图案; (6)对第一抗蚀剂图案进行硬烘烤,(7)通过将第二抗蚀剂组合物施加到第一抗蚀剂图案上,然后干燥获得第二抗蚀剂膜; (8)预烘烤第二抗蚀剂膜; (9)通过掩模使第二抗蚀剂膜曝光; (10)曝光后烘烤第二抗蚀膜; 和(11)用第二碱性显影剂显影以获得第二抗蚀剂图案。