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1. 发明授权

US06822534B2 Laminated electronic component, laminated duplexer and communication device 有权
标题翻译：层压电子元件，层压双工器和通信设备
公开(公告)号：US06822534B2
公开(公告)日：2004-11-23
申请号：US10221971
申请日：2003-01-10
申请人： Kazuhide Uriu , Hiroyuki Nakamura , Toru Yamada , Tsutomu Matsumura , Hiroshi Kagata , Kouji Kawakita , Toshio Ishizaki
发明人： Kazuhide Uriu , Hiroyuki Nakamura , Toru Yamada , Tsutomu Matsumura , Hiroshi Kagata , Kouji Kawakita , Toshio Ishizaki
IPC分类号： H03H701
CPC分类号： H01P1/20345 , H01P1/2039
摘要： A laminated filter includes: a first dielectric layer having a first shield electrode on one principal plane; a second dielectric layer having resonator electrodes on one principal plane; a third dielectric layer having a coupling electrode provided facing part of the above-described resonator electrodes; a fourth dielectric layer having a second shield electrode on one principal plane; a fifth dielectric layer whose at least one principal plane is exposed outside; and a grounding electrode provided on the other principal plane of the above-described dielectric layer and/or the above-described one principal plane of the above-described fifth dielectric layer, and the above-described first grounding electrode and the above-described first shield electrode are electrically connected through a via hole provided in the above-described first dielectric layer.
摘要翻译：层压滤波器包括：第一介电层，其在一个主平面上具有第一屏蔽电极; 一个第二电介质层，在一个主平面上具有谐振器电极; 第三电介质层，其具有面对所述谐振器电极的一部分设置的耦合电极; 第四电介质层，在一个主平面上具有第二屏蔽电极; 第五电介质层，其至少一个主平面暴露在外面; 以及设置在上述介电层的另一个主面上的接地电极和/或上述第五电介质层的上述一个主面，以及上述第一接地电极和上述第一接地电极屏蔽电极通过设置在上述第一电介质层中的通孔电连接。

2. 发明授权

US06227051B1 Acceleration sensor 失效
标题翻译：加速度传感器
公开(公告)号：US06227051B1
公开(公告)日：2001-05-08
申请号：US09532027
申请日：2000-03-21
申请人： Tetsuro Otsuchi , Katsu Takeda , Katsunori Moritoki , Osamu Kawasaki , Junichi Kato , Kouji Kawakita , Hiroshi Kagata
发明人： Tetsuro Otsuchi , Katsu Takeda , Katsunori Moritoki , Osamu Kawasaki , Junichi Kato , Kouji Kawakita , Hiroshi Kagata
IPC分类号： G01P1509
CPC分类号： G01P15/0922 , G01P21/00
摘要： An acceleration sensor has a piezoelectric element which includes a piezoelectric member layer in which a plurality of piezoelectric members are stacked and electrodes which are disposed in major opposed surfaces of the piezoelectric member layer; and a support member for supporting the piezoelectric element, wherein some piezoelectric members of the piezoelectric member layer are polarized. The electrodes are disposed in both surfaces of the polarized piezoelectric members. Capacitors which are formed by the polarized piezoelectric members and the electrodes in both surfaces of the polarized piezoelectric members are connected parallel to each other.
摘要翻译：一种加速度传感器具有压电元件，该压电元件包括堆叠有多个压电元件的压电元件层和设置在该压电元件层主要相对表面的电极; 以及用于支撑压电元件的支撑构件，其中压电构件层的一些压电构件被极化。电极设置在极化压电部件的两个表面。由极化压电部件形成的电容器和极化压电部件的两面的电极彼此平行地连接。

3. 发明授权

US6050144A Acceleration sensor 失效
标题翻译：加速度传感器
公开(公告)号：US6050144A
公开(公告)日：2000-04-18
申请号：US89660
申请日：1998-06-03
申请人： Tetsuro Otsuchi , Katsu Takeda , Katsunori Moritoki , Osamu Kawasaki , Junichi Kato , Kouji Kawakita , Hiroshi Kagata
发明人： Tetsuro Otsuchi , Katsu Takeda , Katsunori Moritoki , Osamu Kawasaki , Junichi Kato , Kouji Kawakita , Hiroshi Kagata
IPC分类号： G01P15/09 , G01P21/00
CPC分类号： G01P15/0922 , G01P21/00
摘要： An acceleration sensor has a piezoelectric element which includes a piezoelectric member layer in which a plurality of piezoelectric members are stacked and electrodes which are disposed in major opposed surfaces of the piezoelectric member layer; and a support member for supporting the piezoelectric element, wherein some piezoelectric members of the piezoelectric member layer are polarized, the electrodes are disposed in the both surfaces of the polarized piezoelectric members, capacitors which are formed by the polarized piezoelectric members and the electrodes in the both surfaces of the polarized piezoelectric members are connected parallel to each other.
摘要翻译：加速度传感器具有压电元件，该压电元件包括堆叠有多个压电元件的压电元件层和设置在该压电元件层的主要相对表面的电极; 以及用于支撑所述压电元件的支撑构件，其中所述压电构件层的一些压电构件被极化，所述电极设置在所述极化压电构件的两个表面中，所述极化压电构件形成的电容器和所述极化压电构件中的电极极化压电元件的两个表面彼此平行地连接。

4. 发明授权

US06154356A Laminated ceramic device 失效
标题翻译：层压陶瓷装置
公开(公告)号：US06154356A
公开(公告)日：2000-11-28
申请号：US150887
申请日：1998-09-10
申请人： Hiroshi Kagata , Kouji Kawakita , Tatsuya Inoue , Hiroshi Sogou
发明人： Hiroshi Kagata , Kouji Kawakita , Tatsuya Inoue , Hiroshi Sogou
IPC分类号： H01G4/30 , H01G4/005 , H01G4/06
CPC分类号： H01G4/30
摘要： A laminated ceramic device formed by laminating ceramics and conductive metals having a conductor section at a part of at least one of its upper and lower surfaces, in which the difference in level between the conductor section and the section other than the conductor section is smaller than the thickness of the conductor section. Consequently, even in the case of arranging the pattern conductors on both the upper and the lower surfaces of the device, a laminated ceramic device can be obtained in which pattern conductors can be arranged with high accuracy at low cost, no special care is required in the case of polishing, and the thickness accuracy and the bond strength of electrodes are high.
摘要翻译：一种层叠陶瓷器件，其通过层叠陶瓷和导体金属而形成，所述导电金属在其上表面和下表面中的至少一个的一部分具有导体部分，其中导体部分与导体部分之间的部分之间的差别小于导体部分的厚度。因此，即使在装置的上下两面配置图案导体的情况下，也可以得到以低成本高精度地布置图案导体的层叠陶瓷装置，不需要特别注意抛光的情况，电极的厚度精度和接合强度高。

5. 发明授权

US6096411A Conductive paste composition for via hole filling and printed circuit board using the same 失效
标题翻译：用于通孔填充的导电糊组合物和使用其的印刷电路板
公开(公告)号：US6096411A
公开(公告)日：2000-08-01
申请号：US38625
申请日：1998-03-12
申请人： Seiichi Nakatani , Kouji Kawakita , Tatsuo Ogawa
发明人： Seiichi Nakatani , Kouji Kawakita , Tatsuo Ogawa
IPC分类号： C08K3/00 , C08K3/08 , C08L63/00 , H05K1/09 , H05K3/40 , H05K3/46 , B32B3/00
CPC分类号： H05K3/4069 , C08K3/08 , H05K1/095 , C08K2003/085 , H05K2201/0355 , H05K2203/1461 , H05K3/4652 , Y10S428/901 , Y10T428/24917
摘要： The invention related to a paste for via hole filling which enables inner via hole connection between electrode layers without employing through hole plating techniques, and a multi-layered printed circuit board using the same. The conductive paste composition of the invention comprises a) 70-90 wt % of copper particles of an average particle size of 0.5-8 .mu.m; b) 0.5-15 wt % of insulating particles of an average particle size of 8-20 .mu.m; and, c) 6-17 wt % of heat setting type liquid epoxy resin, in order to exhibit low viscosity and low volatility. The conductive paste is printed and filled into through holes passing through a laminated substrate which is provide with copper foils on both sides thereof, to form a printed circuit board in which the via holes are electrically connected after thermosetting. By adding insulating particles of large particle size, the amount of copper particles to be added is decreased so that a via hole connection of low specific resistance and high reliability is obtained, and improvements in a decrease of viscosity and continuous printability of the paste itself can be achieved.
摘要翻译：本发明涉及一种用于通孔填充的糊剂，其能够在不使用通孔电镀技术的情况下实现电极层之间的内部通孔连接，以及使用该糊状物的多层印刷电路板。本发明的导电糊组合物包含a）70-90重量％的平均粒径为0.5-8μm的铜颗粒; b）0.5-15重量％的平均粒径为8-20μm的绝缘颗粒; 和c）6-17重量％的热固定型液体环氧树脂，以显示低粘度和低挥发性。将导电性糊料印刷填充到通过其两侧设置有铜箔的层叠基板的通孔中，形成印刷电路基板，其中通孔在热固化后电连接。通过添加大粒径的绝缘粒子，可以减少添加的铜粒子的量，从而获得低电阻率和高可靠性的通孔连接，并且可以提高糊剂本身的粘度和连续印刷性的降低实现。

6. 发明授权

US5977490A Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the same 失效
标题翻译：用于通孔填充的导电浆料化合物，使用导电浆料的印刷电路板及其制造方法
公开(公告)号：US5977490A
公开(公告)日：1999-11-02
申请号：US780329
申请日：1997-01-08
申请人： Kouji Kawakita , Seiichi Nakatani , Tatsuo Ogawa , Masatoshi Suehiro , Kouichi Iwaisako , Hideo Akiyama
发明人： Kouji Kawakita , Seiichi Nakatani , Tatsuo Ogawa , Masatoshi Suehiro , Kouichi Iwaisako , Hideo Akiyama
IPC分类号： H01B1/22 , H05K1/09 , H05K3/40 , H05K3/46 , H05K1/11 , C08K3/08
CPC分类号： H05K1/095 , H01B1/22 , H05K3/4069 , H01L2224/2929 , H01L2224/29311 , H01L2224/29316 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29364 , H01L2224/29399 , H01L2924/01079 , H05K2201/0355 , H05K2201/10378 , H05K2203/1461 , H05K3/4614 , H05K3/462 , H05K3/4623 , H05K3/4652 , Y10S428/901 , Y10T428/24917 , Y10T428/25
摘要： A conductive paste compound for via hole filling includes a conductive filler at 80 to 92 weight percent with an average particle size of from 0.5 to 20 .mu.m and specific surface of from 0.1 to 1.5 m.sup.2 /g, a liquid epoxy resin at 4.5 to 20 weight percent containing 2 or more epoxy groups with room temperature viscosity of 15 Pa.sec or less, and a hardener at 0.5 to 5 weight percent, wherein the viscosity is 2,000 Pa.sec or less and the volatile amount is 2.0 weight percent or less. A filling paste and a printed circuit board with use thereof are provided which can conduct an inner-via-hole connection between electrode layers without using a through-hole plating technique.The conductive paste comprises a metallic particle such as copper, an epoxy resin, a hardener, and if necessary, a dispersant. The paste having low viscosity and low volatility under high shear is used to fill holes disposed in a laminated substrate. Then, this substrate is heated and pressurized together with copper foil on both sides to attain a printed circuit board where both sides are electrically inner-via-hole connected.
摘要翻译：用于通孔填充的导电糊剂化合物包括平均粒度为0.5至20μm，比表面积为0.1至1.5m 2 / g的80至92重量％的导电填料，4.5至20的液体环氧树脂含有2个以上环氧树脂的室温粘度为15Pa·sec以下的固化剂和0.5〜5重量％的固化剂，其中粘度为2,000Pa·s以下，挥发量为2.0重量％以下。提供了一种填充膏和使用它们的印刷电路板，其可以在不使用通孔电镀技术的情况下进行电极层之间的内部通孔连接。导电糊料包括金属颗粒如铜，环氧树脂，硬化剂，如果需要，可以使用分散剂。使用在高剪切下具有低粘度和低挥发性的糊料来填充设置在层压基板中的孔。然后，将该基板与铜箔一起加热和加压两侧，以获得印刷电路板，其中两侧电连通内部通孔。

7. 发明授权

US6108903A Connecting member of a circuit substrate and method of manufacturing multilayer circuit substrates by using the same 失效
标题翻译：电路基板的连接部件和使用该电路基板的多层电路基板的制造方法
公开(公告)号：US6108903A
公开(公告)日：2000-08-29
申请号：US582930
申请日：1996-01-04
申请人： Seiichi Nakatani , Akihito Hatakeyama , Kouji Kawakita , Hiroshi Sogou , Tatsuo Ogawa , Tamao Kojima
发明人： Seiichi Nakatani , Akihito Hatakeyama , Kouji Kawakita , Hiroshi Sogou , Tatsuo Ogawa , Tamao Kojima
IPC分类号： H05K3/40 , H05K3/42 , H05K3/46 , H05K3/10 , H05K3/36
CPC分类号： H05K3/462 , H01R12/523 , H05K3/4069 , H05K2201/0116 , H05K2201/0355 , H05K2201/09536 , H05K2201/10378 , H05K2203/0191 , H05K2203/1461 , H05K3/4623 , H05K3/4652 , Y10S428/901 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , Y10T428/24273 , Y10T428/24322 , Y10T428/24917
摘要： A connecting member of circuit substrates includes an organic porous base material provided with tackfree films on both sides, through-holes disposed at requested places which are filled with conductive resin compound up to the surface of the tackfree films. This structure enables inner-via-hole connection and can therefore attain a connecting member of circuit substrates and an electrical connector of high reliability and high quality. By using a connecting member of circuit substrates including the organic porous base material provided with tackfree films on both sides and through-holes disposed at requested places which are filled with conductive resin compound up to the surface of the tackfree films, it is possible to form a high-multilayer substrate easily from double sided boards or four-layer substrates which can be manufactured rather stably. In addition to that, since the conductive paste is filled up to the surface of the tackfree films, the conductive paste sticks out from the surface of the organic porous base material when the tackfree films are separated. As a result, the filled amount of the conductive substance increases after the lamination, and thus, the connection resistance is reduced considerably.
摘要翻译：电路基板的连接构件包括在两侧设置有无粘性薄膜的有机多孔基材，设置在要求位置的通孔，其填充有导电树脂组合物直到无粘膜的表面。这种结构能够实现内通孔连接，从而可以获得电路基板的连接构件和高可靠性和高质量的电连接器。通过使用包括在两侧设置有无粘膜的有机多孔基材的电路基板的连接构件，以及设置在填充有导电树脂组合物的所需位置的通孔，直到无粘膜的表面，可以形成来自可以制造得相当稳定的双面板或四层基板的高多层基板。除此之外，由于导电膏被填充到无粘性膜的表面，所以当无粘性膜分离时，导电糊从有机多孔基材的表面突出出来。结果，在层压之后导电物质的填充量增加，因此连接电阻显着降低。

8. 发明授权

US06211487B1 Printed circuit board and method of manufacturing the same 有权
公开(公告)号：US06211487B1
公开(公告)日：2001-04-03
申请号：US09379008
申请日：1999-08-23
申请人： Akihito Hatakeyama , Seiichi Nakatani , Kouji Kawakita , Hiroshi Sogou , Tatsuo Ogawa , Tamao Kojima
发明人： Akihito Hatakeyama , Seiichi Nakatani , Kouji Kawakita , Hiroshi Sogou , Tatsuo Ogawa , Tamao Kojima
IPC分类号： H05K336
CPC分类号： H05K3/462 , H05K1/0366 , H05K3/4069 , H05K3/4614 , H05K3/4652 , H05K2201/0116 , H05K2201/0154 , H05K2201/0278 , H05K2201/0355 , H05K2201/10378 , H05K2201/2072 , H05K2203/0191 , H05K2203/1461 , Y10S428/901 , Y10T29/49126 , Y10T29/49155 , Y10T428/24917 , Y10T428/249953 , Y10T428/249996
摘要： A printed circuit board includes an uncured substrate material with closed voids which are disposed with a through-hole. When the through-hole is formed, voids which exist in the substrate material open from inner wall of the through-hole to form a hollow-shaped part. By filling the through-hole and the hollow-shaped part with conductive paste, the adhesion improves by the increased holding effect between the conductive paste and the wall surface of the through-hole.

9. 发明授权

US5914358A Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste, and method of manufacturing the same 失效
标题翻译：用于通孔填充的导电浆料化合物，使用导电浆料的印刷电路板及其制造方法
公开(公告)号：US5914358A
公开(公告)日：1999-06-22
申请号：US649189
申请日：1996-05-17
申请人： Kouji Kawakita , Seiichi Nakatani , Tatsuo Ogawa , Masatoshi Suehiro , Kouichi Iwaisako , Hideo Akiyama
发明人： Kouji Kawakita , Seiichi Nakatani , Tatsuo Ogawa , Masatoshi Suehiro , Kouichi Iwaisako , Hideo Akiyama
IPC分类号： H01B1/22 , H05K1/09 , H05K3/40 , H05K3/46 , C08K3/08 , C08L63/00
CPC分类号： H05K1/095 , H01B1/22 , H05K3/4069 , H01L2224/2929 , H01L2224/29311 , H01L2224/29316 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29364 , H01L2224/29399 , H01L2924/01079 , H05K2201/0355 , H05K2201/10378 , H05K2203/1461 , H05K3/4614 , H05K3/462 , H05K3/4623 , H05K3/4652 , Y10S428/901 , Y10T428/24917 , Y10T428/25
摘要： A conductive paste compound for via hole filling includes a conductive filler at 80 to 92 weight percent with an average particle size of from 0.5 to 20 .mu.m and specific surface of from 0.1 to 1.5 m.sup.2 /g, a liquid epoxy resin at 4.5 to 20 weight percent containing 2 or more epoxy groups with room temperature viscosity of 15 Pa.multidot.sec or less, and a hardener at 0.5 to 5 weight percent, wherein the viscosity is 2,000 Pa.multidot.sec or less and the volatile amount is 2.0 weight percent or less. A filling paste and a printed circuit board with use thereof are provided which can conduct an inner-via-hole connection between electrode layers without using a through-hole plating technique.The conductive paste comprises a metallic particle such as copper, an epoxy resin, a hardener, and if necessary, a dispersant. The paste having low viscosity and low volatility under high shear is used to fill holes disposed in a laminated substrate. Then, this substrate is heated and pressurized together with copper foil on both sides to attain a printed circuit board where both sides are electrically inner-via-hole connected.
摘要翻译：用于通孔填充的导电糊剂化合物包括平均粒度为0.5至20μm，比表面积为0.1至1.5m 2 / g的80至92重量％的导电填料，4.5至20的液体环氧树脂含有2个以上环氧树脂的室温粘度为15Pa·s以下的固化剂和0.5〜5重量％的固化剂，其中粘度为2,000帕秒以下，挥发量为2.0重量％以下。提供了一种填充膏和使用它们的印刷电路板，其可以在不使用通孔电镀技术的情况下进行电极层之间的内部通孔连接。导电糊料包括金属颗粒如铜，环氧树脂，硬化剂，如果需要，可以使用分散剂。使用在高剪切下具有低粘度和低挥发性的糊料来填充设置在层压基板中的孔。然后，将该基板与铜箔一起加热和加压两侧，以获得印刷电路板，其中两侧电连通内部通孔。

10. 发明授权

US5652042A Conductive paste compound for via hole filling, printed circuit board which uses the conductive paste 失效
标题翻译：用于通孔填充的导电浆料化合物，使用导电浆料的印刷电路板
公开(公告)号：US5652042A
公开(公告)日：1997-07-29
申请号：US330733
申请日：1994-10-28
申请人： Kouji Kawakita , Seiichi Nakatani , Tatsuo Ogawa , Masatoshi Suehiro , Kouichi Iwaisako , Hideo Akiyama
发明人： Kouji Kawakita , Seiichi Nakatani , Tatsuo Ogawa , Masatoshi Suehiro , Kouichi Iwaisako , Hideo Akiyama
IPC分类号： H01B1/22 , H05K1/09 , H05K3/40 , H05K3/46 , B32B9/00
CPC分类号： H05K1/095 , H01B1/22 , H05K3/4069 , H01L2224/2929 , H01L2224/29311 , H01L2224/29316 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29364 , H01L2224/29399 , H01L2924/01079 , H05K2201/0355 , H05K2201/10378 , H05K2203/1461 , H05K3/4614 , H05K3/462 , H05K3/4623 , H05K3/4652 , Y10S428/901 , Y10T428/24917 , Y10T428/25
摘要： A conductive paste compound for via hole filling includes a conductive filler at 80 to 92 weight percent with an average particle size of from 0.5 to 20 .mu.m and specific surface of from 0.1 to 1.5 m.sup.2 /g, a liquid epoxy resin at 4.5 to 20 weight percent containing 2 or more epoxy groups with room temperature viscosity of 15 Pa.multidot.sec or less, and a hardener at 0.5 to 5 weight percent, wherein the viscosity is 2,000 Pa.multidot.sec or less and the volatile amount is 2.0 weight percent or less. A filling paste and a printed circuit board with use thereof are provided which can conduct an inner-via-hole connection between electrode layers without using a through-hole plating technique.The conductive paste comprises a metallic particle such as copper, an epoxy resin, a hardener, and if necessary, a dispersant. The paste having low viscosity and low volatility under high shear is used to fill holes disposed in a laminated substrate. Then, this substrate is heated and pressurized together with copper foil on both sides to attain a printed circuit board where both sides are electrically inner-via-hole connected.
摘要翻译：用于通孔填充的导电糊剂化合物包括平均粒度为0.5至20μm，比表面积为0.1至1.5m 2 / g的80至92重量％的导电填料，4.5至20的液体环氧树脂含有2个以上环氧树脂的室温粘度为15Pa·s以下的固化剂和0.5〜5重量％的固化剂，其中粘度为2,000帕秒以下，挥发量为2.0重量％以下。提供了一种填充膏和使用它们的印刷电路板，其可以在不使用通孔电镀技术的情况下进行电极层之间的内部通孔连接。导电糊料包括金属颗粒如铜，环氧树脂，硬化剂，如果需要，可以使用分散剂。使用在高剪切下具有低粘度和低挥发性的糊料来填充设置在层压基板中的孔。然后，将该基板与铜箔一起加热和加压两侧，以获得印刷电路板，其中两侧电连通内部通孔。

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